Epoxy resin-based cathodic electrodeposition (CED) of metal components as an adhesion promoter for PU systems
US-12104083-B2 · Oct 1, 2024 · US
US11186734B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11186734-B2 |
| Application number | US-201916427869-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 31, 2019 |
| Priority date | May 31, 2019 |
| Publication date | Nov 30, 2021 |
| Grant date | Nov 30, 2021 |
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An epoxy resin emulsion includes a continuous phase including an aqueous carrier and an acid. The emulsion also includes a dispersed phase including an epoxy resin. The epoxy resin is the reaction product of an amine compound and a first epoxy reactant. The first epoxy reactant itself includes the reaction product of (1) an aromatic diol monomer, (2) a di-glycidyl ether of Bisphenol A and/or a di-glycidyl ether of catechol, and (3) a C8-C18 alkyl phenolic end-capping agent. The (1) aromatic diol monomer has the structure:In this structure, each of R1-R4 is independently a hydrogen atom, a C1-C8 alkyl group, a C3-C8 cycloalkyl group, an aryl group, an aralkyl group, a halide group, a cyano group, a nitro group, a blocked isocyanate group, or a C1-C8 alkyloxy group or wherein any two or more of R1-R4 may be a fused ring.
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What is claimed is: 1. An electrocoating composition comprising: A. an epoxy resin emulsion that is free of sulfamic acid and consists essentially of: (1) a continuous phase comprising water, lactic acid, methanesulfonic acid, and nitric acid; and (2) a dispersed phase comprising an epoxy resin that is reaction product of: (a) a liquid epoxy resin of diglycidyl ether of bisphenol A; (b) catechol; (c) dodecylphenol; and (d) polypropylene glycol; and B. a cross-linking resin that comprises the reaction product of methylene diphenyl diisocyanate and trimethylolpropane. 2. The electrocoating composition of claim 1 wherein said epoxy resin of said dispersed phase has a weight average molecular weight (Mw) of from about 1,000 to about 100,000 g/mol. 3. The electrocoating composition of claim 1 wherein said epoxy resin of said dispersed phase has a weight average molecular weight (Mw) of from about 5,000 to about 20,000 g/mol. 4. The electrocoating composition of claim 1 wherein said epoxy resin of said dispersed phase has a weight average molecular weight (Mw) of from about 5,000 to about 10,000 g/mol. 5. The electrocoating composition of claim 1 where-in epoxy resin emulsion consists essentially of said water, said acids, and said epoxy resin of said dispersed phase. 6. The electrocoating composition of claim 1 wherein said water is present in an amount of about 53.5 wt %; said lactic acid is present as a 56% solution in an amount of about 1.2 wt %; said methane sulfonic acid is present as a 70% solution in an amount of about 0.7 wt %; said liquid epoxy resin of diglycidyl ether of bisphenol A is utilized in an amount of about 15.1 wt %; said catechol is utilized in an amount of about 2.7 wt %; said dodecylphenol is utilized in an amount of about 0.8 wt %; said polypropylene glycol has a weight average molecular weight of 900 g/mol and is utilized in an amount of about 3.7 wt %; and said cross-linking resin is present in an amount of about 18.3 wt %. 7. The electrocoating composition of claim 6 further comprising ethyltriphenyl phosphonium iodide, N,N-diethanolamine, aminopropyldiethanolamine, and a plasticizer additive. 8. The electrocoating composition of claim 7 wherein said ethyltriphenyl phosphonium iodide is present in an amount of less than about 0.02 wt %; said N,N-diethanolamine is present in an amount of about 1.7 wt %; said aminopropyldiethanolamine is present in an amount of about 1 wt %; and said plasticizer additive is present in an amount of about 0.8 wt %. 9. The electrocoating composition of claim 8 wherein the epoxy resin emulsion has a solids content of about 41.1%, and a particle size of about 105 nm. 10. The electrocoating composition of claim 9 wherein the epoxy resin of said dispersed phase has a weight average molecular weight of about 7566 g/mol. 11. The electrocoating composition of claim 7 wherein the epoxy resin emulsion has a solids content of about 41.1%, and a particle size of about 105 nm. 12. The electrocoating composition of claim 11 wherein the epoxy resin of said dispersed phase has a weight average molecular weight of about 7566 g/mol. 13. The electrocoating composition of claim 6 wherein the epoxy resin emulsion has a solids content of about 41.1%, and a particle size of about 105 nm. 14. The electrocoating composition of claim 13 wherein the epoxy resin of said dispersed phase has a weight average molecular weight of about 7566 g/mol. 15. The electrocoating composition of claim 1 further comprising ethyltriphenyl phosphonium iodide, N,N-diethanolamine, aminopropyldiethanolamine, and a plasticizer additive. 16. The electrocoating composition of claim 1 wherein the epoxy resin emulsion has a solids content of about 41.1%. 17. The electrocoating composition of claim 1 wherein the epoxy resin emulsion has a particle size of about 105 nm. 18. The electrocoating composition of claim 1 wherein the epoxy resin of said dispersed phase has a weight average molecular weight of about 7566 g/mol. 19. A coated substrate comprising: an electrogalvanized substrate; and a coating layer disposed on said electrogalvanized substrate, wherein the coating layer is formed from an electrocoating composition comprising: A. an epoxy resin emulsion that is free of sulfamic acid and consists essentially of: (1) a continuous phase comprising water, lactic acid, methanesulfonic acid, and nitric acid; and (2) a dispersed phase comprising an epoxy resin that is reaction product of: (a) a liquid epoxy resin of diglycidyl ether of bisphenol A; (b) catechol; (c) dodecylphenol; and (d) polypropylene glycol; and B. a cross-linking resin that comprises the reaction product of methylene diphenyl diisocyanate and trimethylolpropane, wherein said epoxy resin that is the reaction product of (a)-(d) cures to form the coating layer, and wherein the coating layer has a surface roughness Ra of less than 0.4 μm as measured using ISO 4287 (R) and that has an edge protection of less than 3 as measured using VDA 233-102 at 6 cycles. 20. The coated substrate of claim 19 , wherein, in the electrocoating composition, said water is present in an amount of about 53.5 wt %; said lactic acid is present as a 56% solution in an amount of about 1.2 wt %; said methane sulfonic acid is present as a 70% solution in an amount of about 0.7 wt %; said liquid epoxy resin of diglycidyl ether of bisphenol A is utilized in an amount of about 15.1 wt %; said catechol is utilized in an amount of about 2.7 wt %; said dodecylphenol is utilized in an amount of about 0.8 wt %; said polypropylene glycol has a weight average molecular weight of 900 g/mol and is utilized in an amount of about 3.7 wt %; and said cross-linking resin is present in an amount of about 18.3 wt %, wherein the coating composition further comprises ethyltriphenyl phosphonium iodide, N,N-diethanolamine, aminopropyldiethanolamine, and a plasticizer additive, and wherein said ethyltriphenyl phosphonium iodide is present in an amount of less than about 0.02 wt %; said N,N-diethanolamine is present in an amount of about 1.7 wt %; said aminopropyldiethanolamine is present in an amount of about 1 wt %; and said plasticizer additive is present in an amount of about 0.8 wt %.
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