Platinum-based material thin wire and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-11185902-B2
Application number	US-201916763047-A
Country	US
Kind code	B2
Filing date	Jan 17, 2019
Priority date	Jan 18, 2018
Publication date	Nov 30, 2021
Grant date	Nov 30, 2021

Abstract

A platinum-based material element wire is coated with gold or gold alloy, and drawing-processed with a carbon-containing die. The thin wire manufactured in this manner is covered with gold or gold alloy, and the coverage of gold or gold alloy is 40% or more on an area basis. The thin wire formed of a platinum-based material is manufactured in a state of suppressing breakage in a drawing processing step, and has favorable performance in electric properties and the like. In addition, this manufacturing process is capable of efficiently manufacturing a platinum-based material thin wire while suppressing breakage when the thin wire is manufactured by drawing processing.

First claim

The invention claimed is:

1. A platinum-based material thin wire having a wire diameter of 10 μm or more and 100 μm or less and formed of platinum or platinum alloy,
wherein the thin wire is covered with gold or gold alloy,
a coverage of the gold or gold alloy is 40% or more on an area basis, and
a degree of circularity on a radial cross-section in an arbitrary longitudinal position is 0.90 or more.

2. The thin wire according to claim 1 , wherein,
when TCR c is a temperature coefficient of resistance of the thin wire, and
TCR nc is a temperature coefficient of resistance of a thin wire which is identical to the thin wire in composition except gold and which is formed of platinum or platinum alloy that does not contain gold,
a difference between the TCR c and the TCR nc is within ±0.5%.

3. The thin wire according to claim 1 , comprising gold in an amount of 200 ppm or more and 1000 ppm or less on a mass basis.

4. The thin wire according to claim 1 , wherein the platinum alloy is an alloy of platinum and rhodium, palladium, iridium, tungsten or nickel, or reinforced platinum.

5. A method for manufacturing the thin wire formed of a platinum-based material according to claim 1 , comprising
a step of performing drawing processing by passing a platinum-based material element wire through a carbon-containing die at least once,
the drawing processing including passing the element wire through the die at least once in a state of being coated with gold or gold alloy in an amount of 200 ppm or more and 1000 ppm or less based on mass of the element wire.

6. A method for manufacturing the thin wire formed of a platinum-based material according to claim 1 , comprising
a step of performing drawing processing by passing a platinum-based material element wire through a carbon-containing die at least once,
the drawing processing including passing the element wire through the die at least once in a state of being coated with gold or gold alloy in an amount equivalent to a thickness of 40 nm or more and 100 nm or less.

7. The method for manufacturing the thin wire formed of a platinum-based material according to claim 5 , wherein the carbon-containing die is one of a ceramic die, an ultrahard die and a diamond die.

8. The method for manufacturing the thin wire formed of a platinum-based material according to claim 5 , wherein an element wire having a diameter of 300 μm or more and 800 μm or less is coated with gold or gold alloy, and drawing-processed.

9. The thin wire according to claim 2 , comprising gold in an amount of 200 ppm or more and 1000 ppm or less on a mass basis.

10. The thin wire according to claim 2 , wherein the platinum alloy is an alloy of platinum and rhodium, palladium, iridium, tungsten or nickel, or reinforced platinum.

11. The thin wire according to claim 3 , wherein the platinum alloy is an alloy of platinum and rhodium, palladium, iridium, tungsten or nickel, or reinforced platinum.

12. A method for manufacturing the thin wire formed of a platinum-based material according to claim 2 , comprising
a step of performing drawing processing by passing a platinum-based material element wire through a carbon-containing die at least once,
the drawing processing including passing the element wire through the die at least once in a state of being coated with gold or gold alloy in an amount of 200 ppm or more and 1000 ppm or less based on mass of the element wire.

13. A method for manufacturing the thin wire formed of a platinum-based material according to claim 3 , comprising
a step of performing drawing processing by passing a platinum-based material element wire through a carbon-containing die at least once,
the drawing processing including passing the element wire through the die at least once in a state of being coated with gold or gold alloy in an amount of 200 ppm or more and 1000 ppm or less based on mass of the element wire.

14. A method for manufacturing the thin wire formed of a platinum-based material according to claim 4 , comprising
a step of performing drawing processing by passing a platinum-based material element wire through a carbon-containing die at least once,
the drawing processing including passing the element wire through the die at least once in a state of being coated with gold or gold alloy in an amount of 200 ppm or more and 1000 ppm or less based on mass of the element wire.

15. A method for manufacturing the thin wire formed of a platinum-based material according to claim 2 , comprising
a step of performing drawing processing by passing a platinum-based material element wire through a carbon-containing die at least once,
the drawing processing including passing the element wire through the die at least once in a state of being coated with gold or gold alloy in an amount equivalent to a thickness of 40 nm or more and 100 nm or less.

16. A method for manufacturing the thin wire formed of a platinum-based material according to claim 3 , comprising
a step of performing drawing processing by passing a platinum-based material element wire through a carbon-containing die at least once,
the drawing processing including passing the element wire through the die at least once in a state of being coated with gold or gold alloy in an amount equivalent to a thickness of 40 nm or more and 100 nm or less.

17. A method for manufacturing the thin wire formed of a platinum-based material according to claim 4 , comprising
a step of performing drawing processing by passing a platinum-based material element wire through a carbon-containing die at least once,
the drawing processing including passing the element wire through the die at least once in a state of being coated with gold or gold alloy in an amount equivalent to a thickness of 40 nm or more and 100 nm or less.

18. The method for manufacturing the thin wire formed of a platinum-based material according to claim 6 , wherein the carbon-containing die is one of a ceramic die, an ultrahard die and a diamond die.

19. The method for manufacturing the thin wire formed of a platinum-based material according to claim 6 , wherein an element wire having a diameter of 300 μm or more and 800 μm or less is coated with gold or gold alloy, and drawing-processed.

20. The method for manufacturing the thin wire formed of a platinum-based material according to claim 7 , wherein an element wire having a diameter of 300 μm or more and 800 μm or less is coated with gold or gold alloy, and drawing-processed.

Assignees

• Tanaka Precious Metal Ind

Inventors

• HORINOUCHI Yuki
• Takada Mitsuo

Classifications

• C23C30/005

  on hard metal substrates · CPC title

• H01B1/02

  mainly consisting of metals or alloys · CPC title

• B21C1/02 Primary

  Drawing metal wire or like flexible metallic material by drawing machines or apparatus in which the drawing action is effected by drums · CPC title

• C23C30/00

  Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process (C23C26/00, C23C28/00 take precedence) · CPC title

• C22C5/04

  Alloys based on a platinum group metal · CPC title