Double-sided roll bond condenser, double-sided roll bond condenser embedding structure, and embedding method thereof

Patent metadata

Field	Value
Publication number	US-11181306-B2
Application number	US-201816235626-A
Country	US
Kind code	B2
Filing date	Dec 28, 2018
Priority date	Jan 9, 2018
Publication date	Nov 23, 2021
Grant date	Nov 23, 2021

Abstract

A double-sided roll bond condenser has a main body, an interposition section, and a neck portion. The main body is an upright board and has two side surfaces. Two filling structures are respectively protruded from the two side surfaces of the main body. The interposition section is formed at a bottom portion of the double-side roll bond condenser, and is a U-shaped folded structure. The U-shaped folded structure protrudes from one of the two side surfaces of the main body. The neck portion is located between the main body and the interposition section.

First claim

What is claimed is:

1. A double-sided roll bond condenser comprising:
a main body having
two side surfaces; and
two filling structures respectively formed at the two side surfaces of the main body;

an interposition section formed on a bottom portion of the double-sided roll bond condenser, and being a U-shaped folded structure; and
a neck portion located between the main body and the interposition section, and having a curved structure.

2. The double-sided roll bond condenser as claimed in claim 1 , wherein the curved structure of the neck portion is adjacent to an embedded position that is located at a top portion of the U-shaped folded structure.

3. The double-sided roll bond condenser as claimed in claim 2 , wherein the U-shaped folded structure extends toward one of the side surfaces of the main body.

4. The double-sided roll bond condenser as claimed in claim 1 , wherein the curved structure is arc-shaped.

5. The double-sided roll bond condenser as claimed in claim 1 , wherein the curved structure is formed by stamping.

6. A double-sided roll bond condenser embedding structure comprising:
multiple double-sided roll bond condensers, each double-sided roll bond condenser having
a main body having
two side surfaces; and
two filling structures respectively formed at the two side surfaces of the main body;

an interposition section located a bottom portion of the double-sided roll bond condenser, and being a U-shaped folded structure; and
a neck portion located between the main body and the interposition section, and having a curved structure; and

a base having multiple mounting slots formed in a top surface of the base, and the multiple mounting slots being parallel to each other, wherein the interposition sections of the multiple double-sided roll bond condensers are respectively inserted into the mounting slots of the base.

7. The double-sided roll bond condenser embedding structure as claimed in claim 6 , wherein the curved structure of the neck portion is adjacent to an embedded position that is located at a top portion of the U-shaped folded structure.

8. The double-sided roll bond condenser embedding structure as claimed in claim 7 , wherein each curved structure is arc-shaped.

9. The double-sided roll bond condenser embedding structure as claimed in claim 8 , wherein each arc-shaped curved structure is bent toward one of the mounting slots that is adjacent to the arc-shaped curved structure.

10. The double-sided roll bond condenser embedding structure as claimed in claim 6 , wherein each curved structure is formed by stamping.

11. The double-sided roll bond condenser embedding structure as claimed in claim 6 , wherein the interposition section of each double-sided roll bond condenser has multiple protruding tabs protruding from a top surface of a corresponding one of the mounting slots.

12. The double-sided roll bond condenser embedding structure as claimed in claim 11 , wherein the base is made of copper, aluminum, copper-based alloy or aluminum-based alloy.

13. A embedding method for a double-sided roll bond condenser, the embedding method comprising:
a first step, wherein a base is provided, and the base has multiple mounting slots formed in a top surface of the base;
a second step, wherein multiple double-side roll bond condenser s are provided, each double-side roll bond condenser has a main body, an interposition section, and a neck portion, the interposition section is formed at a bottom portion of the double-side roll bond condenser and is a U-shaped folded structure, and the neck portion is located between the main body and the interposition section;
a third step, wherein each neck portion is stamped or bent to form a curved structure; and
a fourth step, wherein each interposition section is pressed into a respective one of the mounting slots.

14. The embedding method as claimed in claim 13 , wherein the curved structure of the neck portion is adjacent to an embedded position that is located at a top portion of the U-shaped folded structure; and
in the fourth step, the U-shaped folded structure of the interposition section of each double-sided roll bond condenser is deformed to press against a corresponding one of the mounting slots to tightly combine the double-sided roll bond condenser with the base.

15. The embedding method as claimed in claim 14 , wherein each curved structure is arc-shaped.

16. The embedding method as claimed in claim 15 , wherein the arc-shaped curved structure is bent toward one of the mounting slots that is adjacent to the arc-shaped curved structure.

17. The embedding method as claimed in claim 13 , wherein the U-shaped folded structure extends toward one side surface of the main body.

Assignees

• Cooler Master Co Ltd

Inventors

• Zhang Xiong
• Zhou Jie

Classifications

• F25B39/04 Primary

  Condensers · CPC title

• F28D15/00

  Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls {; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies (F28D17/00, F28D19/00, F28D20/00 take precedence)} · CPC title

• F28F9/0075

  Supports for plates or plate assemblies · CPC title

• B21D22/00

  Shaping without cutting, by stamping, spinning, or deep-drawing (otherwise than using rigid devices or tools or yieldable or resilient pads B21D26/00) · CPC title

• F28D2021/0063

  Condensers · CPC title