Integrating Josephson amplifiers or Josephson mixers into printed circuit boards

Patent metadata

Field	Value
Publication number	US-11178771-B2
Application number	US-202016940556-A
Country	US
Kind code	B2
Filing date	Jul 28, 2020
Priority date	Sep 29, 2017
Publication date	Nov 16, 2021
Grant date	Nov 16, 2021

Abstract

An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.

First claim

What is claimed is:

1. A printed circuit board (PCB) comprising:
one or more board layers;
a first chip cavity and a second chip cavity formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity and a second Josephson amplifier or Josephson mixer is disposed within the second chip cavity, wherein the first chip cavity and second chip cavity define a rectangular cavity in the one or more board layers, wherein the rectangular cavity comprises four sidewalls;
a coupler disposed on at least one of the one or more board layers, wherein the coupler comprises a first leg and a second leg;
wherein the first leg is electronically coupled to the first Josephson amplifier or Josephson mixer and the second leg is electronically coupled to the second Josephson amplifier or Josephson mixer; and
one or more circuit traces formed in the one or more board layers, wherein each circuit trace in the one or more circuit traces extend from a center of each sidewall of the four sidewalls, wherein the one or more traces define a cross shaped pattern in the one or more board layers.

2. The printed circuit board of claim 1 , wherein each of the Josephson amplifiers or Josephson mixers comprises at least one port, each port electronically coupled to at least one connector; and
wherein each of the at least one connector is disposed on at least one of the one or more board layers.

3. The printed circuit board of claim 1 , wherein the coupler is electronically coupled to at least one connector disposed on at least one of the one or more board layers.

4. The printed circuit board of claim 1 , further comprising:
a first cover and a second cover;
the first cover operable to mount or enclose the first Josephson amplifier or Josephson mixer and the second Josephson amplifier or Josephson mixer, wherein the first cover is disposed on a first external layer of the one or more board layers; and
the second cover operable to enclose the first Josephson amplifier or Josephson mixer and the second Josephson amplifier or Josephson mixer, wherein the second cover is disposed on a second external layer of the one or more board layers.

5. The printed circuit board of claim 4 , wherein the first and second covers comprise an oxygen-free high conductivity (OFHC) copper.

6. The printed circuit board of claim 1 , wherein the first Josephson amplifier or Josephson mixer is electronically coupled to the second Josephson amplifier or Josephson mixer.

7. The printed circuit board of claim 1 , wherein a circuit trace is formed on at least one of the one or more board layers.

8. The printed circuit board of claim 7 , further comprising:
one or more vias connecting the circuit traces formed on the one or more board layers.

Assignees

• IBM

Inventors

• Abdo Baleegh
• Bronn Nicholas T
• Jinka Oblesh
• Olivadese Salvatore B

Classifications

• G06N10/40

  Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control · CPC title

• H05K1/0243 Primary

  Printed circuits associated with mounted high frequency components · CPC title

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title

• H05K1/183 Primary

  associated with components mounted in and supported by recessed areas of the PCBs · CPC title

• H05K2201/10371

  Shields or metal cases · CPC title