Information processing device, mounting device, and information processing method

US11176657B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11176657-B2
Application numberUS-201716496228-A
CountryUS
Kind codeB2
Filing dateMar 29, 2017
Priority dateMar 29, 2017
Publication dateNov 16, 2021
Grant dateNov 16, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An information processing device used in a mounting device including a mounting head for collecting components and arranging the components on a board. The imaging processing device includes a control section configured to acquire an image of a member having a straight line side, detect multiple edge points with respect to the straight line side to obtain a proximal straight line of the side, and perform detection processing for detecting the outer shape of the member by excluding edge points outside a predetermined range from the proximal straight line on the outside and inside of the member.

First claim

Opening claim text (preview).

The invention claimed is: 1. A mounting device comprising: a mounting head for collecting components and arranging components on a board; an accuracy measurement jig including a straight line side and configured to be collected by the mounting head; a first camera configured to capture a first image of the accuracy measurement jig held by the mounting head; and processing circuitry configured to: perform detection processing of the first image of the accuracy measurement jig, detect multiple edge points with respect to the straight line side to obtain a proximal straight line of the straight line side, determine a quantity of the edge points that deviate by a first predetermined range from the proximal straight line, and determine that the accuracy measurement jig is usable for calibration when the quantity of the edge points that deviate is less than a second predetermined range. 2. The mounting device according to claim 1 , wherein the processing circuitry is configured to notify an operator of confirmation processing of the accuracy measurement jig when the quantity of the edge points that deviate is outside the second predetermined range. 3. The mounting device according to claim 1 , wherein the processing circuitry is configured to notify an operator of a process confirming adherence of matter to the accuracy measurement jig when the quantity of the edge points that deviate on an outside of the accuracy measurement jig is outside the second predetermined range. 4. The mounting device according to claim 1 , wherein when the quantity of the edge points that deviate on an inside of the accuracy measurement jig is outside the second predetermined range, the processing circuitry is configured to notify an operator of a process confirming at least one of a defect of the accuracy measurement jig and matter adhering to the accuracy measurement jig. 5. The mounting device according to claim 1 , wherein the processing circuitry is configured to obtain at least one of a deviation of a pickup position and a deviation of a rotation angle of the accuracy measurement jig at the mounting head. 6. The mounting device according to claim 1 , further comprising: a second camera configured to capture a second image of the accuracy measurement jig after the mounting head has arranged the accuracy measurement jig at a predetermined position, wherein the processing circuitry is configured to perform a first calibration processing to obtain at least one of a deviation of a pickup position and a deviation of a rotation angle of the accuracy measurement jig at the mounting head, and perform a second calibration to arrange the accuracy measurement jig at the predetermined position, capture the second image of the accuracy measurement jig arranged at the predetermined position using the second camera, and obtain at least one of a deviation of the arrangement position and the deviation of the rotation angle of the accuracy measurement jig using the second image. 7. An information processing method for use in a mounting device including a mounting head for collecting components and arranging the components on a board, the information processing method comprising: a capturing with a camera an image of an accuracy measurement jig held by the mounting head, the accuracy measurement jig including a straight line side; performing detection processing of the image of the accuracy measurement jig, detecting multiple edge points with respect to the straight line side to obtain a proximal straight line of the straight line side, determining a quantity of the edge points that deviate by a first predetermined range from the proximal straight line, and determining that the accuracy measurement jig is usable for calibration when the quantity of the edge points that deviate is less than a second predetermined range.

Assignees

Inventors

Classifications

  • G06T7/0004Primary

    Industrial image inspection · CPC title

  • Semiconductor; IC; Wafer · CPC title

  • Edge-based segmentation · CPC title

  • by measuring lateral position of a boundary of the object (G01B11/022, G01B11/024, G01B11/04 take precedence) · CPC title

  • Controlling of single components prior to mounting, e.g. orientation, component geometry (H05K13/0812 takes precedence) · CPC title

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Frequently asked questions

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What does patent US11176657B2 cover?
An information processing device used in a mounting device including a mounting head for collecting components and arranging the components on a board. The imaging processing device includes a control section configured to acquire an image of a member having a straight line side, detect multiple edge points with respect to the straight line side to obtain a proximal straight line of the side, a…
Who is the assignee on this patent?
Fuji Corp
What technology area does this patent fall under?
Primary CPC classification G06T7/0004. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 16 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).