Method of measuring adhesive strength of cover sheet, and carrier plate

US11169083B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11169083-B2
Application numberUS-202016904495-A
CountryUS
Kind codeB2
Filing dateJun 17, 2020
Priority dateJun 21, 2019
Publication dateNov 9, 2021
Grant dateNov 9, 2021

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  1. Title

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  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of quantitatively measuring the adhesive strength of a cover sheet of an electronic component housing container including a main body having multiple housing recesses in a longitudinal direction and a cover sheet peelably adhered to the main body. The method includes mounting the housing container on a carrier plate by fitting the housing recesses in one or more housing holes of the carrier plate which includes a plate body having the one or more housing holes in the longitudinal direction and multiple sprocket holes spaced apart from the housing holes in a width direction and arranged at regular intervals in the longitudinal direction; engaging some tooth tips of a sprocket in the sprocket holes; and peeling the cover sheet from the main body by rotating the sprocket using the width direction as an axis to move the carrier plate in the longitudinal direction.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of measuring the adhesive strength of a cover sheet, the method being applicable to an electronic component housing container comprising a main body including multiple housing recesses configured to house electronic components in a longitudinal direction in which each housing recess includes an opening portion on one side in a height direction, and the cover sheet which is peelably adhered to the main body to cover the opening portion of each housing recess, the method comprising: mounting the electronic component housing container on a carrier plate by fitting the housing recesses in one or more housing holes of the carrier plate, the carrier plate comprising a plate body having the one or more housing holes configured to receive the housing recesses in the longitudinal direction and multiple sprocket holes spaced apart from the housing holes in a width direction perpendicular to the longitudinal direction and arranged at regular intervals in the longitudinal direction; engaging some tooth tips of a sprocket, comprising a plurality of the tooth tips on a periphery, in the sprocket holes of the carrier plate carrying the electronic component housing container; and peeling the cover sheet from the main body by rotating the sprocket using the width direction as an axis to move the carrier plate in the longitudinal direction. 2. The method of measuring the adhesive strength of a cover sheet according to claim 1 , wherein during the peeling of the cover sheet from the main body, a peeling angle of the cover sheet relative to the main body is kept constant. 3. The method of measuring the adhesive strength of a cover sheet according to claim 2 , further comprising rolling up the cover sheet peeled from the main body while moving the carrier plate in the longitudinal direction. 4. The method of measuring the adhesive strength of a cover sheet according to claim 1 , wherein the plate body of the carrier plate has the multiple housing holes configured to receive the respective housing recesses in the longitudinal direction. 5. The method of measuring the adhesive strength of a cover sheet according to claim 2 , wherein the plate body of the carrier plate has the multiple housing holes configured to receive the respective housing recesses in the longitudinal direction. 6. The method of measuring the adhesive strength of a cover sheet according to claim 3 , wherein the plate body of the carrier plate has the multiple housing holes configured to receive the respective housing recesses in the longitudinal direction. 7. A carrier plate configured to carry an electronic component housing container comprising a main body including multiple housing recesses configured to house electronic components in a longitudinal direction in which each housing recess includes an opening portion on one side in a height direction, and a cover sheet peelably adhered to the main body to cover the opening portion of each housing recess, the carrier plate comprising: a plate body having one or more housing holes configured to receive the housing recesses in the longitudinal direction and multiple sprocket holes spaced apart from the housing holes in a width direction perpendicular to the longitudinal direction and arranged at regular intervals in the longitudinal direction. 8. The carrier plate according to claim 7 , wherein the plate body of the carrier plate has the multiple housing holes configured to receive the respective housing recesses in the longitudinal direction.

Assignees

Inventors

Classifications

  • Attaching a series of articles, e.g. small electrical components, to a continuous web {(ammunition filling F42B)} · CPC title

  • G01N19/04Primary

    Measuring adhesive force between materials, e.g. of sealing tape, of coating · CPC title

  • Containers and magazines for components, e.g. tube-like magazines · CPC title

  • Peeling or tearing · CPC title

  • Packaging other articles presenting special problems (bundling B65B27/00) · CPC title

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Frequently asked questions

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What does patent US11169083B2 cover?
A method of quantitatively measuring the adhesive strength of a cover sheet of an electronic component housing container including a main body having multiple housing recesses in a longitudinal direction and a cover sheet peelably adhered to the main body. The method includes mounting the housing container on a carrier plate by fitting the housing recesses in one or more housing holes of the ca…
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification G01N19/04. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 09 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).