Three-dimensional printing

Patent metadata

Field	Value
Publication number	US-11167482-B2
Application number	US-201817047455-A
Country	US
Kind code	B2
Filing date	Oct 19, 2018
Priority date	Oct 19, 2018
Publication date	Nov 9, 2021
Grant date	Nov 9, 2021

Abstract

The present disclosure is drawn to 3D printing kits and methods of making 3D printed articles. In one example, a 3D printing kit can include a powder bed material, a fusible fluid, and an activator fluid. The powder bed material can include polymer particles. The fusible fluid can include a radiation absorber. The fusible fluid can be to selectively apply to the powder bed material. The activator fluid can include a non-conductive electroless metal plating activator. The activator fluid can also be to selectively apply to the powder bed material.

First claim

What is claimed is:

1. A 3D printing kit comprising:
a powder bed material comprising polymer particles;
a fusible fluid comprising a radiation absorber to selectively apply to the powder bed material; and
an activator fluid comprising a non-conductive electroless metal plating activator to selectively apply to the powder bed material.

2. A 3D printing kit of claim 1 , wherein the polymer particles have an average particle size from about 20 μm to about 100 μm and include nylon 6, nylon 9, nylon 11, nylon 12, nylon 66, nylon 612, polyethylene, thermoplastic polyurethane, polypropylene, polyester, polycarbonate, polyether ketone, polyacrylate, polystyrene powder, wax, or a combination thereof.

3. A 3D printing kit of claim 1 , wherein the radiation absorber is carbon black, a near-infrared absorbing dye, a near-infrared absorbing pigment, a tungsten bronze, a molybdenum bronze, metal nanoparticles, a conjugated polymer, or a combination thereof.

4. The 3D printing kit of claim 1 , wherein the non-conductive electroless metal plating activator comprises palladium, palladium chloride, tin, stannous chloride, nickel, copper, silver, cobalt, platinum, rhodium, iridium, osmium, ruthenium, or a combination thereof.

5. The 3D printing kit of claim 1 , further comprising a detailing fluid comprising a detailing agent to selectively apply to the powder bed material.

6. The 3D printing kit of claim 1 , further comprising a metal compound that is reactive with the electroless metal plating activator to form metallic plating when the metal compound and the electroless metal plating activator are contacted within a fluid.

7. A 3D printing kit comprising:
a powder bed material comprising polymer particles;
a fusible fluid comprising a radiation absorber to selectively apply to the powder bed material;
an activator fluid comprising an electroless metal plating activator to selectively apply to the powder bed material; and
a co-activator fluid comprising an electroless metal plating co-activator to selectively apply to the powder bed material, wherein the electroless metal plating co-activator is different than the electroless metal plating activator.

8. The 3D printing kit of claim 7 , wherein the electroless metal plating activator comprises palladium, palladium chloride, tin, stannous chloride, nickel, copper, silver, cobalt, platinum, rhodium, iridium, osmium, ruthenium, or a combination thereof.

9. The 3D printing kit of claim 7 , wherein the electroless metal plating co-activator comprises palladium, palladium chloride, tin, stannous chloride, nickel, copper, silver, cobalt, platinum, rhodium, iridium, osmium, ruthenium, hydrochloric acid, formaldehyde, hydrazine, hydroxylamine, borohydride, or a combination thereof.

10. The 3D printing kit of claim 7 , further comprising a metal compound that is reactive with the electroless metal plating activator, the electroless metal plating co-activator, or both to form metallic plating when contacted within a fluid.

11. A method of making a 3D printed article comprising:
iteratively applying individual build material layers of polymer particles to a powder bed;
based on a 3D object model, selectively jetting a fusible fluid onto individual build material layers, wherein the fusible fluid comprises a radiation absorber;
jetting an activator fluid onto an area of the individual build material layers at a surface of the 3D printed article to form an area to be plated, wherein the activator fluid comprises an electroless metal plating activator; and
exposing the powder bed to energy to selectively fuse the polymer particles in contact with the radiation absorber at individual build material layers.

12. The method of claim 11 , further comprising contacting the area to be plated with a fluid comprising a metal compound, wherein the metal compound reacts with the electroless metal plating activator to form metallic plating over the area to be plated.

13. The method of claim 12 , further comprising plating additional metal onto the area to be plated by galvanic plating.

14. The method of claim 12 , wherein the 3D printed article comprises a mold which includes a 3D printed base having the metallic plating applied to a surface of the 3D printed base.

15. The method of claim 12 , wherein the 3D printed article is included in a joint which comprises a 3D printed ball or socket having the metallic plating applied to a surface of the 3D printed ball or socket.

16. The method of claim 12 , wherein the 3D printed article includes an enclosure portion and the metallic plating is applied within the enclosure portion.

17. A multi-fluid kit for 3D printing comprising:
a fusible fluid comprising water and a radiation absorber;
an activator fluid comprising an electroless metal plating activator; and
a co-activator fluid comprising an electroless metal plating co-activator, wherein the electroless metal plating co-activator is different than the electroless metal plating activator.

18. The multi-fluid kit of claim 17 , wherein the electroless metal plating activator comprises palladium, palladium chloride, tin, stannous chloride, nickel, copper, silver, cobalt, platinum, rhodium, iridium, osmium, ruthenium, or a combination thereof, and wherein the electroless metal plating co-activator comprises palladium, palladium chloride, tin, stannous chloride, nickel, copper, silver, cobalt, platinum, rhodium, iridium, osmium, ruthenium, hydrochloric acid, formaldehyde, hydrazine, hydroxylamine, borohydride, or a combination thereof.

19. The multi-fluid kit of claim 17 , further comprising a detailing fluid comprising a detailing agent.

20. The multi-fluid kit of claim 17 , further comprising an electroless plating solution comprising a metal compound that is reactive with the electroless metal plating activator to form metallic plating when the metal compound and the electroless metal plating activator are contacted within a fluid.

Assignees

• Hewlett Packard Development Co

Inventors

• Chaffins Sterling
• Tucker David
• Dekam Kevin P
• Woodlock David C
• Dockstader Lee

Classifications

• B33Y80/00

  Products made by additive manufacturing · CPC title

• B33Y40/20

  Post-treatment, e.g. curing, coating or polishing · CPC title

• B33Y10/00 Primary

  Processes of additive manufacturing · CPC title

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• C23C18/285

  Sensitising or activating with tin based compound or composition · CPC title