Three-dimensional (3D) printing

US11167374B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11167374-B2
Application numberUS-201616098075-A
CountryUS
Kind codeB2
Filing dateJul 26, 2016
Priority dateJul 26, 2016
Publication dateNov 9, 2021
Grant dateNov 9, 2021

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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In a three-dimensional printing method example, a metallic build material is applied. A positive masking agent is selectively applied on at least a portion of the metallic build material. The positive masking agent includes a radiation absorption amplifier that is compatible with the metallic build material. The metallic build material is exposed to radiation from a spatially broad, high energy light source to melt the portion of the metallic build material in contact with the positive masking agent to form a layer. The radiation absorption amplifier i) has an absorbance for the radiation that is higher than an absorbance for the radiation of the metallic build material, or ii) modifies a surface topography of the at least the portion of the metallic build material to reduce specular reflection of the radiation off of the at least the portion of the metallic build material, or both i) and ii).

First claim

Opening claim text (preview).

What is claimed is: 1. A three-dimensional (3D) printing method, comprising: applying a metallic build material; selectively applying a positive masking agent including a solvent and a radiation absorption amplifier on at least a portion of the metallic build material, the radiation absorption amplifier being compatible with the metallic build material, wherein the radiation absorption amplifier is a metal salt; and one of: exposing the metallic build material to radiation from a low energy light source, thereby evaporating the solvent; or heating the metallic build material, thereby evaporating the solvent; and after evaporating the solvent, exposing the metallic build material to radiation from a spatially broad, high energy light source, thereby melting the portion of the metallic build material in contact with the positive masking agent to form a layer; wherein one of: i) the radiation absorption amplifier has an absorbance for the radiation that is higher than an absorbance for the radiation of the metallic build material; or ii) the radiation absorption amplifier modifies a surface topography of the at least the portion of the metallic build material to reduce specular reflection of the radiation off of the at least the portion of the metallic build material; or both i) and ii); and wherein one of: in response to the exposing of the metallic build material to the radiation from the low energy light source, the metal salt modifies the surface topography of the at least the portion of the metallic build material by decomposing to a metal, thereby forming a porous coating of the metal on the at least the portion of the metallic build material; or in response to the heating of the metallic build material, the metal salt modifies the surface topography of the at least the portion of the metallic build material by decomposing to a metal, thereby forming a porous coating of the metal on the at least the portion of the metallic build material. 2. The method as defined in claim 1 wherein the metal salt is copper formate, nickel formate, copper oxalate, nickel oxalate, cobalt oxalate, iron oxalate, or a combination thereof. 3. The method as defined in claim 1 wherein the decomposing of the metal salt to the metal is accomplished at a temperature ranging from about 150° C. to about 400° C. and in an environment containing an inert gas, a low reactivity gas, or a reducing gas. 4. The method as defined in claim 1 wherein the radiation absorption amplifier is compatible with the metallic build material by being or decomposing to a metallic material that is the same as the metallic build material. 5. The method as defined in claim 1 wherein the radiation absorption amplifier is compatible with the metallic build material by being or decomposing to a material that forms an alloy with the metallic build material. 6. The method as defined in claim 1 wherein the selectively applying of the positive masking agent is accomplished by thermal inkjet printing or piezoelectric inkjet printing. 7. The method as defined in claim 1 wherein the spatially broad, high energy light source is one of: a continuous wave discharge lamp including xenon, argon, neon, krypton, sodium vapor, metal halide, or mercury-vapor; or an array of pulse lasers, continuous wave lasers, light-emitting diode (LED) lasers, or a combination thereof; or a flash discharge lamp including xenon or krypton; or a tungsten-halogen continuous wave lamp; or a synchrotron light source that emits light having a wave length above 200 nm. 8. The method as defined in claim 1 wherein the exposing of the metallic build material to radiation from the spatially broad, high energy light source is accomplished in a time period ranging from about 10 microseconds to about 10 seconds. 9. The method as defined in claim 1 wherein the metallic build material is applied in a layer having a thickness ranging from about 20 μm to about 100 μm. 10. The method as defined in claim 1 wherein: the spatially broad, high energy light source is a single pulse light source capable of delivering from about 30 J per cm 2 to about 50 J per cm 2 to the metallic build material; or the spatially broad, high energy light source is a multiple pulse light source capable of delivering less than 30 J per cm 2 to the metallic build material; or the spatially broad, high energy light source is a continuous wave light source capable of delivering greater than 50 J per cm 2 to the metallic build material.

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What does patent US11167374B2 cover?
In a three-dimensional printing method example, a metallic build material is applied. A positive masking agent is selectively applied on at least a portion of the metallic build material. The positive masking agent includes a radiation absorption amplifier that is compatible with the metallic build material. The metallic build material is exposed to radiation from a spatially broad, high energy…
Who is the assignee on this patent?
Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification B23K26/342. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 09 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).