Axis calibration of beam processing machines

US11167372B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11167372-B2
Application numberUS-201816124975-A
CountryUS
Kind codeB2
Filing dateSep 7, 2018
Priority dateMar 9, 2016
Publication dateNov 9, 2021
Grant dateNov 9, 2021

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  5. First independent claim

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Abstract

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In a method for determining a deviation of a spatial orientation of a beam axis (S) of a beam processing machine from a spatial nominal orientation (S0) of the beam axis (S), contour sections (KA1, KB2) are cut with a processing beam into a test workpiece from two sides of the workpiece. The contour sections (KA1, KB2) extend parallel to a nominal orientation of a rotation axis (B, C), where the rotation axis is to be calibrated. The contour sections (KA1, KA2) are probed from one side of the test workpiece by a measuring device for determining the spatial position of the contour sections (KA1, KB1). Deviation of the spatial orientation of the beam axis (S) of the beam processing machine from the spatial nominal orientation (S0) is determined based on the spatial positions of the contour sections (KA1, KB1).

First claim

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What is claimed is: 1. A method for determining a deviation of a spatial orientation of a beam axis of a processing head of a beam processing machine from a nominal orientation of the beam axis, the beam processing machine having a rotation axis that is to be calibrated, and a measuring device, the method comprising: cutting, into a test workpiece by the processing head, a first contour section and a second contour section by a processing beam provided by the processing head from a first side and a second side of the test workpiece, respectively, wherein the first side is delimited by a first surface of the test workpiece and the second side is delimited by a second surface of the test workpiece, and each of the first and the second contour sections extends parallel to a nominal orientation of the rotation axis that is to be calibrated; probing, by the measuring device and from one side of the test workpiece, the first contour section and the second contour section to determine a spatial position of each of the first and the second contour sections, wherein the measuring device is arranged in an outlet region where the processing beam exits the processing head, and the measuring device comprises a contact surface defined geometrically about the beam axis, and wherein the first and the second contour sections are probed by the contact surface; and determining a deviation of the spatial orientation of the beam axis of the beam processing machine from the nominal orientation by comparing the spatial positions of the first and the second contour sections with respective nominal position values assigned to each of the first and the second contour sections, the nominal position values indicating nominal spatial positions of respective contour sections that the processing beam provided by the processing head would cut when operating at the nominal orientation, wherein the deviation of the spatial orientation of the beam axis is usable to calibrate the rotation axis. 2. The method of claim 1 , wherein the beam processing machine is configured to process the test workpiece by the processing beam provided by the processing head and guided along the beam axis, wherein the test workpiece is a plate-shaped workpiece and the first and the second surfaces have surface normals that have a substantially common orientation, wherein the beam processing machine includes at least one translation axis for generating a translational movement between the test workpiece and the beam axis, wherein the rotation axis has a rotation range of at least 180° for orienting the beam axis in angular positions about the nominal orientation of the rotation axis, and wherein the method further comprises: mounting the test workpiece in a support position in which the nominal orientation of the beam axis can be aligned in a first angular position and a second angular position rotated 180° thereto along the orientation of the surface normals for processing the test workpiece, positioning the beam axis in a first position in which the nominal orientation of the beam axis is in the first angular position and the processing beam is directed onto the first surface, performing a first contour cut with the processing beam, wherein the first contour section is a part of the first contour cut, positioning the beam axis in a second position in which the nominal orientation of the beam axis is in the second angular position and the processing beam is directed onto the second surface, and performing a second contour cut with the processing beam, wherein the second contour section is part of the second contour cut and the second contour section is parallel to the first contour section, wherein at least one recess is formed in the test workpiece, the recess borders at least on one of the first contour section and the second contour section, wherein the first contour section and the second contour section are probed by the measuring device positioned in the same angular position for detecting the spatial position of the first contour section and the spatial position of the second contour section. 3. The method of claim 2 , wherein the deviation of the spatial orientation of the beam axis of the beam processing machine from the nominal orientation is determined in a plane that is perpendicular to the orientation of the surface normals and perpendicular to the nominal orientation of the rotation axis, and perpendicular to the first and the second contour sections. 4. The method of claim 1 , wherein the beam processing machine includes one or more beam guiding components that guide the processing beam out of the processing head, and wherein, when the first contour section is being cut, the beam guiding components are positioned at the first side of the test workpiece and, when the second contour section is being cut the beam guiding components of the beam processing machine are positioned at the second side delimited by the second surface, and, during both probing processes of the first and the second contour sections, the beam guiding components are positioned at only one of the first side and the second side of the test workpiece. 5. The method of claim 1 , wherein determining the deviation comprises: detecting a distance dimension between the first contour section and the second contour section, and determining a difference between the distance dimension and a nominal distance dimension, the nominal distance dimension being a difference between the nominal position values. 6. The method of claim 1 , wherein at least one of a first contour cut and a second contour cut forms a recess, wherein the first contour section is part of the first contour cut and the second contour section is part of the second contour cut, and wherein the first contour cut and the second contour cut are closed contours, which are arranged next to one another in such a way that the first contour section and the second contour section are arranged to be separated by a portion of the test workpiece from one another, or are arranged to be separated from one another by a portion of the test workpiece and cut out regions of at least one of the first and the second contours. 7. The method of claim 1 , wherein the first contour section is part of a first contour cut and the second contour section is part of a second contour cut, and wherein the first contour cut and the second contour cut intersect with each other or form a closed contour together in which the first contour section and the second contour section are disposed on opposite sides of a cut-out region. 8. The method of claim 1 , wherein the beam processing machine has two rotation axes whose nominal orientations are arranged orthogonally to one another, wherein the first contour section is part of a first contour cut and the second contour section is part of a second contour cut, and wherein each of the first and the second contour cuts has at least one portion along each of the nominal orientations of the rotation axes such that the first and the second contour cuts have a pair of parallel contour sections, which are each parallel to the corresponding nominal orientation. 9. The method of claim 1 , wherein the contact surface is geometrically defined in and against a direction of rotation of the rotation axis to be calibrated, and the method further comprises determining a center between the first and the second contour sections and comparing the center with a nominal center to determine a beam offset of the processing beam with respect to the nominal orientation, the nominal center being a centerline between the nominal position values. 10. The method of claim 9 , wherein the contact surface extends in parallel to

Assignees

Inventors

Classifications

  • characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes (G05B19/19 takes precedence) · CPC title

  • for adjusting the tool relative to the workpiece · CPC title

  • by welding · CPC title

  • using a fixed support {, i.e. involving moving the laser beam} · CPC title

  • Beam measuring devices · CPC title

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What does patent US11167372B2 cover?
In a method for determining a deviation of a spatial orientation of a beam axis (S) of a beam processing machine from a spatial nominal orientation (S0) of the beam axis (S), contour sections (KA1, KB2) are cut with a processing beam into a test workpiece from two sides of the workpiece. The contour sections (KA1, KB2) extend parallel to a nominal orientation of a rotation axis (B, C), where th…
Who is the assignee on this patent?
Trumpf Laser & Systemtechnik Gmbh
What technology area does this patent fall under?
Primary CPC classification B23K26/04. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 09 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).