Apparatus and method for feeding material

US11167347B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11167347-B2
Application numberUS-201716470359-A
CountryUS
Kind codeB2
Filing dateAug 24, 2017
Priority dateDec 16, 2016
Publication dateNov 9, 2021
Grant dateNov 9, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A material feeding apparatus is disclosed. An apparatus for removing a surface oxide of a metal material and feeding the metal material to a melting furnace, according to an embodiment of the present disclosure, includes: a housing including a material dropping chamber for feeding and discharging the metal material and a material etching chamber for performing a plasma etching process; and a pretreatment casing configured to reciprocate between the material dropping chamber and the material etching chamber in the housing, wherein the pretreatment casing receives the metal material from the material dropping chamber to store the metal material, moves to the material etching chamber to plasma-etch a surface oxide layer of the stored metal material, and then returns to the material dropping chamber to drop the etched metal material into the melting furnace.

First claim

Opening claim text (preview).

The invention claimed is: 1. An apparatus for removing a surface oxide of a metal material and feeding the metal material to a melting furnace, comprising: a housing including a material dropping chamber for feeding and discharging the metal material and a material etching chamber for performing a plasma etching process; and a pretreatment casing configured to rotate and reciprocate backward and forward by a support shaft between the material dropping chamber and the material etching chamber in the housing, wherein the pretreatment casing moves backward to be disposed in the material dropping chamber to receive the metal material from a material supply unit which is connected to the material dropping chamber to store the metal material, wherein the pretreatment casing moves forward to be disposed in the material etching chamber to plasma-etch a surface oxide layer of the stored metal material, and then returns to the material dropping chamber to drop the etched metal material into the melting furnace. 2. The apparatus according to claim 1 , wherein the pretreatment casing is rotatably installed, and when the pretreatment casing is located in the material etching chamber to perform the plasma-etch process, the pretreatment casing rotates to stir the metal material. 3. The apparatus according to claim 1 , wherein a plurality of holes are formed in an outer surface of the pretreatment casing to allow plasma to enter and exit an inside of the pretreatment casing. 4. The apparatus according to claim 1 , wherein an entrance for feeding and discharging the metal material and a cover for selectively opening and closing the entrance are provided in an outer surface of the pretreatment casing, the cover is rotatably installed along an outer circumference of the pretreatment casing, held at a position to close the entrance by a compressive force of an elastic rod coupled to the pretreatment casing, and held at a position to open the entrance by a compressive force of a clamp installed to selectively contact the cover. 5. The apparatus according to claim 1 , wherein the housing includes a heater for heating the material etching chamber to preheat the metal material filled in the pretreatment casing. 6. The apparatus according to claim 4 , wherein an inclined guide surface is provided in the pretreatment casing adjacent to the entrance to guide the metal material inclined to one side in the pretreatment casing to be discharged smoothly through the entrance. 7. The apparatus according to claim 1 , wherein an inlet port is connected to the material supply unit for feeding the metal material at an upper portion of the material dropping chamber, and an outlet port connected to the melting furnace is provided in a lower portion of the material dropping chamber. 8. The apparatus according to claim 7 , wherein the material supply unit comprises a storage hopper for storing the metal material and a weighing hopper for receiving the metal material from the storage hopper and weighing the metal material to feed the metal material to the inlet port, a buffer hopper for temporarily storing the etched metal material discharged from the outlet port in a vacuum state and providing the etched metal material to the melting furnace is provided between the material dropping chamber and the melting furnace. 9. The apparatus according to claim 1 , wherein the pretreatment casing is connected to the support shaft penetrating one side of the housing and extending, and the support shaft is axially connected to a driving motor to receive a rotation force from the driving motor to rotate and reciprocate in association with an actuator provided outside the housing. 10. The apparatus according to claim 1 , wherein one side of the housing is connected to a vacuum generator for forming a vacuum atmosphere in the material etching chamber and a gas feeder for feeding a reactive gas to the material etching chamber, when the pretreatment casing is located in the material etching chamber.

Assignees

Inventors

Classifications

  • Chemical treatment, e.g. passivation or decarburisation · CPC title

  • Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents · CPC title

  • F27D3/10Primary

    Charging directly from hoppers or shoots · CPC title

  • charging of particulate material · CPC title

  • Recycling · CPC title

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What does patent US11167347B2 cover?
A material feeding apparatus is disclosed. An apparatus for removing a surface oxide of a metal material and feeding the metal material to a melting furnace, according to an embodiment of the present disclosure, includes: a housing including a material dropping chamber for feeding and discharging the metal material and a material etching chamber for performing a plasma etching process; and a pr…
Who is the assignee on this patent?
Posco
What technology area does this patent fall under?
Primary CPC classification F27D3/10. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Nov 09 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).