Lead for connection to a semiconductor device
US-2015287666-A1 · Oct 8, 2015 · US
US11166398B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11166398-B2 |
| Application number | US-201716347779-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 6, 2017 |
| Priority date | Nov 9, 2016 |
| Publication date | Nov 2, 2021 |
| Grant date | Nov 2, 2021 |
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Official abstract text for this publication.
A functional contactor is provided. A functional contactor according to an exemplary embodiment of the present invention comprises; a clip-shaped conductor having elasticity which is in electrical contact with a conductor of an electronic device; a functional element which is electrically connected to the clip-shaped conductor in series via a solder and comprises a first electrode and a second electrode respectively provided on the entire upper and lower surfaces thereof; and an arrangement guide which is formed to surround at least a part of the clip-shaped conductor on the upper surface of the functional element so as to arrange the position of the clip-shaped conductor and is made of nonconductive resin.
Opening claim text (preview).
The invention claimed is: 1. A functional contactor comprising: a clip-shaped conductor configured to come into electrical contact with a conductor of an electronic device and having elasticity; a functional element; a first electrode provided on an upper surface of the functional element, and a second electrode provided on a lower surface of the functional element, wherein the functional element is electrically connected in series to the clip-shaped conductor using a solder provided on a upper surface of the first electrode; and an arrangement guide formed to surround at least a part of the clip-shaped conductor on the upper surface of the first electrode so as to align a position of the clip-shaped conductor and made of a non-conductive resin, wherein the arrangement guide comprises a first portion and a second portion which are formed on two sides of the clip-shaped conductor in a width direction, and the first portion and the second portion are spaced apart from each other on the upper surface of the first electrode, wherein the first portion and the second portion extends along the width direction of the clip-shaped conductor, and wherein the first portion and the second portion confines the solder and the clip-shaped conductor which are located in the space between the first portion and the second portion on the upper surface of the first electrode, and the first portion and the second portion is configured to align the clip-shaped conductor when the solder is in a molten state. 2. The functional contactor of claim 1 , wherein the arrangement guide is not formed in a region in which a bent portion having elasticity of the clip-shaped conductor is disposed. 3. The functional contactor of claim 1 , wherein the arrangement guide is formed to have a thickness corresponding to 10 to 170% of a printed thickness of the solder. 4. The functional contactor of claim 1 , wherein the arrangement guide is formed to be spaced a predetermined gap apart from the clip-shaped conductor. 5. The functional contactor of claim 1 , wherein the arrangement guide is formed to be in contact with the clip-shaped conductor. 6. The functional contactor of claim 1 , wherein the arrangement guide further includes a third portion extending from at least one of the first portion and the second portion in a direction toward the remaining one thereof. 7. The functional contactor of claim 1 , wherein the arrangement guide further includes a third portion vertically connecting the first portion to the second portion. 8. The functional contactor of claim 1 , wherein the non-conductive resin is formed of one among overglass, epoxy, epoxy containing a filler, a polymer, and a non-conductive paste. 9. The functional contactor of claim 1 , wherein the non-conductive resin is made of a low temperature curing resin which is cured at a temperature in a range of 140 to 210° C. 10. The functional contactor of claim 1 , wherein the non-conductive resin is thermally decomposed at a temperature that is higher than a melting point of the solder. 11. The functional contactor of claim 1 , wherein the functional element has at least one among an electric shock prevention function of blocking a leakage current of an external power source flowing from a ground of a circuit substrate of the electronic device, a communication signal transfer function of passing a communication signal flowed from a conductive case or the circuit substrate, and an electrostatic discharge (ESD) protection function of passing the ESD without a dielectric breakdown when the ESD flows from the conductive case. 12. The functional contactor of claim 1 , wherein the non-conductive resin is cured at a temperature that is lower than a melting point of the solder, and is thermally decomposed at a temperature that is higher than the melting point of the solder.
Electrodes · CPC title
comprising means for positioning or holding the parts to be soldered or welded · CPC title
Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment · CPC title
Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00) · CPC title
Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact · CPC title
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