Fabrication process for flip chip bump bonds using nano-LEDs and conductive resin

Patent metadata

Field	Value
Publication number	US-11166384-B2
Application number	US-201916359125-A
Country	US
Kind code	B2
Filing date	Mar 20, 2019
Priority date	Mar 20, 2019
Publication date	Nov 2, 2021
Grant date	Nov 2, 2021

Abstract

A fabrication method achieves bump bonds (to connect two electronic devices) with a pitch of less than 20 μm using UV-curable conductive epoxy resin cured with an array of nano-LEDs. Nano-LEDs are devices with sizes less than or equal to 5 μm, typically arranged in an array. After deposition of the uncured conductive epoxy layer, the nano-LED array enables a fast curing of the bumps with high spatial resolution. Next, the uncured resin is washed off and the chips are assembled, before final thermal curing takes place.

First claim

What is claimed is:

1. A method of fabricating bump bonds and mechanically and electrically connecting a first electrical component with a second electrical component, comprising:
coating a surface of the first electrical component with a layer of an electrically conductive resin;
illuminating the electrically conductive resin layer at selected locations using light emitted by a light emitting diode (LED) device to partially cure the electrically conductive resin at the selected locations, including scanning the LED device using a gantry across the coated surface of the first electronic component to the selected locations to illuminate the electrically conductive resin layer at the selected locations, while leaving the electrically conductive resin layer outside of the selected locations uncured;
removing uncured electrically conductive resin from the surface of the first electrical component using a solvent, wherein the partially cured electrically conductive resin at the selected locations forms a plurality of partially cured resin bumps;
assembling the first and second electrical components by placing the second component over the first electrical component on the partially cured resin bumps; and
after the assembling step, thermally curing the partially cured resin bumps to form fully cured resin bumps that mechanically and electrically connect the first and second electrical components.

2. The method of claim 1 , wherein the electrically conductive resin includes a dual-cure resin filled with electrically conductive particles.

3. The method of claim 2 , wherein the dual-cure resin is an epoxy resin.

4. A method of fabricating bump bonds which mechanically and electrically connect a first electrical component with a second electrical component, comprising:
coating a surface of the first electrical component with a layer of an electrically conductive resin, wherein the electrically conductive resin includes a dual-cure resin filled with electrically conductive particles, wherein the dual-cure resin is a mixture containing bisphenol A diglycidyl ether, amine or anhydride hardener, oligomeric acrylates, partially and fully acrylated epoxy oligomer, a photoinitiator, and an accelerator;
illuminating the electrically conductive resin layer at selected locations using light emitted by a light emitting diode (LED) device to partially cure the electrically conductive resin at the selected locations, leaving the electrically conductive resin layer outside of the selected locations uncured;
removing uncured electrically conductive resin from the surface of the first electrical component using a solvent, wherein the partially cured electrically conductive resin at the selected locations forms a plurality of partially cured resin bumps;
assembling the first and second electrical components by placing the second component over the first electrical component on the partially cured resin bumps; and
after the assembling step, thermally curing the partially cured resin bumps to form fully cured resin bumps that mechanically and electrically connect the first and second electrical components.

5. The method of claim 2 , wherein the electrically conductive particles include silver particles having sizes between 10 nm and 100 nm or silver coated carbon particles.

6. The method of claim 1 , wherein the layer of electrically conductive resin is less than 5 μm in thickness.

7. The method of claim 1 , wherein the LED device emits an ultraviolet (UV) light.

8. The method of claim 1 , wherein the LED device is an LED array having a plurality of LEDs, each LED having a size of less than 5 μm.

9. The method of claim 8 , wherein the LEDs are formed of gallium nitride nanowires.

10. The method of claim 8 , wherein the plurality of LEDs in the LED array are individually controllable to turn on and off or to control intensity, and wherein the illuminating step includes turning on some but not all of the LEDs in the LED array or individually controlling intensities of the LEDs.

11. The method of claim 8 , wherein the plurality of LEDs in the LED array form a predefined spatial pattern, and wherein shapes of the partially cured resin bumps are determined by the spatial pattern of the LED array.

12. The method of claim 1 , wherein the step of coating the flat surface of the first electrical component with the layer of the electrically conductive resin includes forming a first sub-layer of a first electrically conductive resin on the flat surface of the first electrical component and forming a second sub-layer of a second electrically conductive resin on the first sub-layer, wherein the second electrically conductive resin contains a lower concentration of photoinitiator than the first electrically conductive resin, and wherein the illuminating step is performed on both the first and second sub-layers at once.

13. The method of claim 1 , wherein the first electrical component is a printed circuit board (PCB).

14. The method of claim 4 , wherein the electrically conductive particles include silver particles having sizes between 10 nm and 100 nm or silver coated carbon particles.

15. The method of claim 4 , wherein the layer of electrically conductive resin is less than 5 μm in thickness.

16. The method of claim 4 , wherein the LED device emits an ultraviolet (UV) light.

17. The method of claim 4 , wherein the LED device is an LED array having a plurality of LEDs, each LED having a size of less than 5 μm, and wherein the plurality of LEDs in the LED array form a predefined spatial pattern.

18. The method of claim 17 , wherein the LEDs are formed of gallium nitride nanowires.

19. The method of claim 17 , wherein the plurality of LEDs in the LED array are individually controllable to turn on and off.

20. The method of claim 4 , wherein the step of coating the flat surface of the first electrical component with the layer of the electrically conductive resin includes forming a first sub-layer of a first electrically conductive resin on the flat surface of the first electrical component and forming a second sub-layer of a second electrically conductive resin on the first sub-layer, wherein the second electrically conductive resin contains a lower concentration of photoinitiator than the first electrically conductive resin.

Assignees

• Konica Minolta Laboratory Usa Inc

Inventors

• Bruening Karsten
• Amano Jun

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H29/142

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title

• H10H20/825

  containing nitrogen, e.g. GaN · CPC title

• H10H20/821

  of the light-emitting regions, e.g. non-planar junctions · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title