Method of manufacture of a structure and structure

Patent metadata

Field	Value
Publication number	US-11166380-B1
Application number	US-202017072474-A
Country	US
Kind code	B1
Filing date	Oct 16, 2020
Priority date	May 20, 2020
Publication date	Nov 2, 2021
Grant date	Nov 2, 2021

Abstract

A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.

First claim

The invention claimed is:

1. A structure comprising:
a first substrate film comprising a recess defining a volume;
a functional electronics assembly comprising at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion; and
a lid member that at least partly conforms to a shape of a portion of the recess surrounding the functional electronics assembly, the lid member being separate and distinct from the functional electronics assembly and/or the at least one connection portion,
wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion and the at least one electronics component is arranged at least partly into the volume and at least part of the at least one electronics component is embedded into a first material arranged into the recess.

2. The structure of claim 1 , further comprising an injection molded material layer on the first substrate film embedding the first material, and thereby also the functional electronics assembly, between the injection molded material layer and the first substrate film.

3. The structure of claim 1 , wherein the lid member is arranged to at least partly cover the recess, wherein an outer surface of the lid member comprises at least one further electronics component, the outer surface being the surface on the opposite side of the lid member relative to the recess.

4. The structure of claim 3 , wherein the lid member is a thermoplastic film.

5. The structure of claim 1 , further comprising conductors in the functional electronics assembly.

6. The structure of claim 5 , wherein the at least one electronics component includes a plurality of electronics components, and wherein the conductors includes traces arranged between the plurality of electronics components and/or the at least one connection portion.

7. The structure of claim 6 , wherein the traces are printed.

8. The structure of claim 1 , wherein the first substrate is flexible substrate film or a rigid PCB.

9. The structure of claim 1 , wherein the functional electronics assembly is connected to the first substrate film on a bottom of the recess.

10. The structure of claim 1 , further comprising at least one layer covering the first material and the functional electronics assembly.

11. The structure of claim 1 , wherein the first substrate film defines air ventilation holes.

12. The structure of claim 1 , wherein the first material has a hardness of about 85 or less on Shore scale A.

13. The structure of claim 1 , wherein the first material has a hardness of about 40 or less on Shore scale D.

14. The structure of claim 1 , wherein the first material has a modulus of elasticity of about 2000 MPA or less.

15. The structure of claim 1 , wherein the first material has a modulus of elasticity of about 500 MPA or less.

16. The structure of claim 1 , wherein the first material has a modulus of elasticity of about 100 MPA or less.

17. The structure of claim 1 , wherein the first substrate is a rigid PCB.

Assignees

• Tactotek Oy

Inventors

• Simula Tomi
• Paani Mika
• Kärnä Miikka
• Rusanen Outi
• Juvani Johanna
• Rautio Tapio
• Suo-Anttila Marko
• Heikkinen Mikko

Classifications

• B29L2031/3406

  Components, e.g. resistors · CPC title

• H05K5/065

  sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding · CPC title

• H05K2203/1316

  Moulded encapsulation of mounted components · CPC title

• B29K2101/12

  Thermoplastic materials · CPC title

• H05K3/284 Primary

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title