Connection plate, circuit board assembly, and electronic device

Patent metadata

Field	Value
Publication number	US-11166374-B2
Application number	US-201816980174-A
Country	US
Kind code	B2
Filing date	Mar 15, 2018
Priority date	Mar 15, 2018
Publication date	Nov 2, 2021
Grant date	Nov 2, 2021

Abstract

An electronic device includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch.

First claim

What is claimed is:

1. An electronic device, comprising: a housing; a display screen fastened to the housing and configured to display an image; and a circuit board assembly accommodated in the housing, and comprising: a first circuit board, wherein a first component is disposed on the first circuit board; a second circuit board stacked with the first circuit board, wherein a second component is disposed on the second circuit board; and a connection plate between the first circuit board and the second circuit board, the connection plate including a plate body, wherein one end of the plate body is connected to the first circuit board, and the other end of the plate body is connected to the second circuit board; the connection plate including: a signal transmission hole extending from the one end of the plate body to the other end of the plate body, wherein a signal transmission part is disposed in the signal transmission hole, and configured to transmit a first signal between the first circuit board and the second circuit board; at least one ground hole disposed at a spacing to the signal transmission hole and extending from the one end of the plate body to the other end of the plate body, wherein a ground part is disposed in the at least one ground hole, and is configured to connect a ground of the first circuit board and a ground of the second circuit board.

2. The electronic device according to claim 1 , wherein the first component comprises at least one of the following: a radio frequency integrated circuit, a power amplifier, a filter, a central processing unit, or a system on chip; and
the second component comprises at least one of the following: a radio frequency integrated circuit, a power amplifier, a filter, a central processing unit, or a system on chip.

3. The electronic device according to claim 1 , wherein the first signal is a radio frequency signal, wherein the radio frequency signal comprises a Wireless-Fidelity signal, a Bluetooth signal, a Global Navigation Satellite System signal, a 2G signal, a 3G signal, a 4G signal, or a 5G signal.

4. The electronic device according to claim 1 , wherein the plate body further comprises:
a connection hole located on a side that is proximate to the at least one ground hole and that is away from the signal transmission hole, wherein a connection part is disposed in the connection hole, and the connection part is configured to transmit a second signal between the first circuit board and the second circuit board.

5. The electronic device according to claim 4 , wherein the second signal comprises a power signal or a ground signal.

6. The electronic device according to claim 1 , wherein a number of the at least one ground hole is at least two.

7. The electronic device according to claim 6 , wherein the number of the at least one ground hole is 4, 6, or 8.

8. The electronic device according to claim 1 , wherein the at least one ground hole comprises four ground holes, a cross-sectional shape of each of the four ground holes comprising a first area and a second area, wherein the first area is perpendicularly connected to the second area, the cross-sectional shape of the ground hole comprises an inner side edge and an outer side edge that are opposite to each other, and the signal transmission hole is located on a side that is proximate to the inner side edge and that is away from the outer side edge.

9. The electronic device according to claim 1 , wherein a cross-sectional shape of the signal transmission hole is a circle, an ellipse, or a polygon, and the cross-sectional shape of the at least one ground hole is a circle, an ellipse, or a polygon.

10. The electronic device according to claim 1 , wherein a cross-sectional shape of the at least one ground hole is the same as the cross-sectional shape of the signal transmission hole.

11. The electronic device according to claim 6 , wherein the two ground holes are arranged with an equal distance therebetween in a circumference direction of the signal transmission hole.

12. The electronic device according to claim 11 , wherein a distance between adjacent ground holes is d, wherein d≤λ/n; the signal transmission part is configured to transmit a signal having a highest frequency f; and a wavelength λ corresponding to the highest frequency f, and n≥4.

13. The electronic device according to claim 12 , wherein n=10.

14. The electronic device according to claim 1 , wherein a number of the at last one ground hole is 1, and a cross-sectional shape of the ground hole is a closed ring.

15. The electronic device according to claim 14 , wherein the cross-sectional shape of the signal transmission hole is a circle, an ellipse, or a polygon.

16. The electronic device according to claim 1 , wherein the ground part is formed by filling the at least one ground hole with a first conductive material, and the signal transmission part is formed by filling the signal transmission hole with a second conductive material.

17. The electronic device according to claim 16 , wherein the first conductive material is the same as the second conductive material.

18. The electronic device according to claim 1 , wherein a radius of the signal transmission hole is determined according to a characteristic impedance of the signal transmission part.

19. The electronic device according to claim 1 , wherein a radius of a circle contour that is tangent to each ground part and that is between the signal transmission part and the ground part is determined according to characteristic impedance of the signal transmission part.

20. The electronic device according to claim 1 , wherein a first welding area is disposed on a first side that is of the first circuit board and that faces the second circuit board, a second welding area is disposed on a second side that is of the second circuit board and that faces the first circuit board, the one end of the plate body abuts against the first welding area, and the other end of the plate body abuts against the second welding area; and
a first positioning piece is disposed on the first side, wherein the first positioning piece is located on an outer side of the first welding area.

Assignees

• Huawei Tech Co Ltd

Inventors

• Wang Hui
• Qiu Dan
• Chen Zhijun
• Tang Daiping

Classifications

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K2201/09618

  Via fence, i.e. one-dimensional array of vias · CPC title

• H05K1/0219

  Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors · CPC title

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title