Light-emitting device

Patent metadata

Field	Value
Publication number	US-11165002-B2
Application number	US-201716630743-A
Country	US
Kind code	B2
Filing date	Aug 30, 2017
Priority date	Aug 30, 2017
Publication date	Nov 2, 2021
Grant date	Nov 2, 2021

Abstract

A light-emitting device 1 comprises a base 30, a nitride semiconductor light-emitting element 10 flip-chip mounted on the base 30, and an amorphous fluororesin sealing the nitride semiconductor light-emitting element 10. The light-emitting device 1 comprises a deformation-prevention layer 60 for preventing a shape change of an amorphous fluororesin by heat treatment after shipment of the light-emitting device 1, and the deformation-prevention layer 60 is formed of a layer in which a thermosetting resin or an ultraviolet curing resin is cured, and the cured layer directly covers the surface of the amorphous fluororesin.

First claim

The invention claimed is:

1. A light-emitting device comprising:
a base;
a nitride semiconductor light-emitting element flip-chip mounted on the base; and
an amorphous fluororesin sealing the nitride semiconductor light-emitting element,
wherein the light-emitting device comprises a deformation-prevention layer for preventing a shape change of the amorphous fluororesin by heat treatment after shipment of the light-emitting device,
wherein the deformation-prevention layer comprises a layer in which a thermosetting resin or an ultraviolet curing resin is cured,
wherein the cured layer directly covers a surface of the amorphous fluororesin, and
wherein the light-emitting device in a shipment form is enclosed in an airtight package in which an inside is decompressed, in an airtight package in which an inside is filled with helium gas or argon gas, or in an airtight package in which an inside is decompressed and filled with helium gas or argon gas.

2. The light-emitting device according to claim 1 , wherein
the deformation-prevention layer covers at least a surface of an optical lens shape that focuses or diffuses light emitted from the nitride semiconductor light-emitting element, out of an exposed surface of the amorphous fluororesin.

3. The light-emitting device according to claim 1 , wherein
the deformation-prevention layer is made of a silicone resin or an epoxy resin.

4. The light-emitting device according to claim 1 , wherein
the deformation-prevention layer has gas permeability to helium, argon, oxygen, nitrogen, and water vapor.

5. The light-emitting device according to claim 1 , wherein
a structural unit of a polymer or a copolymer constituting the amorphous fluororesin has a fluorine-containing aliphatic cyclic structure.

6. The light-emitting device according to claim 1 , wherein
a terminal functional group of a polymer or a copolymer constituting the amorphous fluororesin is a perfluoroalkyl group.

7. The light-emitting device according to claim 1 , wherein
the nitride semiconductor light-emitting element is an ultraviolet light-emitting element having a light emission center wavelength in a range of 200 nm or more and about 365 nm or less.

8. The light-emitting device according to claim 1 , wherein
a weight average molecular weight of a polymer or a copolymer constituting the amorphous fluororesin is 700,000 or less.

9. A light-emitting device comprising:
a base;
a nitride semiconductor light-emitting element flip-chip mounted on the base; and
an amorphous fluororesin sealing the nitride semiconductor light-emitting element,
wherein the light-emitting device comprises a deformation-prevention layer for preventing a shape change of the amorphous fluororesin by heat treatment after shipment of the light-emitting device,
wherein the deformation-prevention layer comprises a layer in which a thermosetting resin or an ultraviolet curing resin is cured,
wherein the cured layer directly covers a surface of the amorphous fluororesin, and
wherein the light-emitting device in a shipment form is enclosed in an airtight package in which an inside is decompressed.

10. The light-emitting device of claim 9 , wherein the light-emitting device in the shipment form is enclosed in the airtight package in which the inside is decompressed and filled with helium gas or argon gas.

11. The light-emitting device according to claim 9 , wherein
the deformation-prevention layer covers at least a surface of an optical lens shape that focuses or diffuses light emitted from the nitride semiconductor light-emitting element, out of an exposed surface of the amorphous fluororesin.

12. The light-emitting device according to claim 9 , wherein
the deformation-prevention layer is made of a silicone resin or an epoxy resin.

13. The light-emitting device according to claim 9 , wherein
the deformation-prevention layer has gas permeability to helium, argon, oxygen, nitrogen, and water vapor.

14. The light-emitting device according to claim 9 , wherein
a structural unit of a polymer or a copolymer constituting the amorphous fluororesin has a fluorine-containing aliphatic cyclic structure.

15. The light-emitting device according to claim 9 , wherein
a terminal functional group of a polymer or a copolymer constituting the amorphous fluororesin is a perfluoroalkyl group.

16. The light-emitting device according to claim 9 , wherein
the nitride semiconductor light-emitting element is an ultraviolet light-emitting element having a light emission center wavelength in a range of 200 nm or more and about 365 nm or less.

17. The light-emitting device according to claim 9 , wherein
a weight average molecular weight of a polymer or a copolymer constituting the amorphous fluororesin is 700,000 or less.

18. A light-emitting device comprising:
a base;
a nitride semiconductor light-emitting element flip-chip mounted on the base; and
an amorphous fluororesin sealing the nitride semiconductor light-emitting element,
wherein the light-emitting device comprises a deformation-prevention layer for preventing a shape change of the amorphous fluororesin by heat treatment after shipment of the light-emitting device,
wherein the deformation-prevention layer comprises a layer in which a thermosetting resin or an ultraviolet curing resin is cured,
wherein the cured layer directly covers a surface of the amorphous fluororesin, and
wherein the light-emitting device in a shipment form is enclosed in an airtight package in which an inside is filled with helium gas or argon gas.

19. The light-emitting device according to claim 18 , wherein
the deformation-prevention layer covers at least a surface of an optical lens shape that focuses or diffuses light emitted from the nitride semiconductor light-emitting element, out of an exposed surface of the amorphous fluororesin.

20. The light-emitting device according to claim 18 , wherein:
the deformation-prevention layer is made of a silicone resin or an epoxy resin; and
the deformation-prevention layer has gas permeability to helium, argon, oxygen, nitrogen, and water vapor.

Assignees

• Soko Kagaku Co Ltd
• Agc Inc
• Soko Kagau Co Ltd

Inventors

• Hirano Akira
• Nagasawa Yosuke
• Ippommatsu Masamichi
• Aosaki Ko
• Suehara Yuki
• Sakane Yoshihiko

Classifications

• H10H20/882

  Scattering means (H10H20/82 takes precedence) · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/855 Primary

  Optical field-shaping means, e.g. lenses · CPC title

• H10H20/853

  characterised by their shape · CPC title

• H10H20/854 Primary

  characterised by their material, e.g. epoxy or silicone resins · CPC title