Device with integration of light-emitting diode, light sensor, and bio-electrode sensors on a substrate

Patent metadata

Field	Value
Publication number	US-11164992-B2
Application number	US-201916681974-A
Country	US
Kind code	B2
Filing date	Nov 13, 2019
Priority date	Jul 31, 2018
Publication date	Nov 2, 2021
Grant date	Nov 2, 2021

Abstract

A semiconductor device includes a substrate and a buffer layer disposed on a first portion, a second portion, and a third portion of the substrate. The semiconductor device further includes a multilayer light-emitting diode (LED) stack disposed on the first portion of the substrate, and an optical sensor disposed on the second portion of the substrate. The semiconductor device further includes at least one electrode disposed on the third portion of the substrate, a first conductor in contact with the multilayer LED stack, and a second conductor in contact with the optical sensor. The at least one electrode, the first conductor, and the second conductor are formed of a glassy carbon material.

First claim

What is claimed is:

1. A method of fabricating a semiconductor device comprising:
receiving a substrate;
forming a buffer layer on the substrate;
forming a multilayer light-emitting diode (LED) stack on the buffer layer;
etching a portion of the multilayer LED stack to form an optical sensor region trench;
forming a dielectric inner spacer on at least one side of the optical sensor region trench;
growing an optical sensor epitaxy in the optical sensor region trench to form an optical sensor in contact with the dielectric inner spacer;
depositing a contact material on the multilayer LED stack and the dielectric inner spacer;
etching portions of the multilayer LED stack to form an optical sensor conductor region, an LED conductor region, and a glassy carbon electrode conductor region;
depositing a glassy carbon material in the optical sensor conductor region, the LED conductor region, and the glassy carbon electrode conductor region; and
etching the glassy carbon material to form an optical sensor conductor, a multilayer LED stack conductor and glassy carbon electrodes disposed on a portion of the buffer layer.

2. The method of claim 1 , further comprising depositing a dielectric capping layer on the multilayer LED stack.

3. The method of claim 2 , further comprising:
applying a first photoresist layer to portions of dielectric capping layer;
patterning the optical sensor using a lithographic patterning process; and
removing the first photoresist layer.

4. The method of claim 1 , wherein forming the dielectric inner spacer on at least one side of the optical sensor region trench further includes:
depositing an optical sensor dielectric layer on the optical sensor region trench; and
etching away portions of the optical sensor dielectric layer to form the dielectric inner spacer.

5. The method of claim 1 , further comprising:
applying a second photoresist layer to the contact material;
patterning the optical sensor conductor region, the LED conductor region, and the glassy carbon electrode conductor region; and
removing the second photoresist layer.

6. The method of claim 1 , further comprising:
applying a third photoresist layer to the optical sensor region and the multilayer LED stack region;
patterning portions of the buffer layer; and
removing the third photoresist layer.

7. The method of claim 1 , further comprising:
depositing a spacer dielectric on portions of the substrate, the buffer layer, the optical sensor, the multilayer LED stack, and the contact material; and
etching the spacer dielectric to form at least one dielectric outer spacer proximate to one or more remaining portions of the buffer layer, portions of the optical sensor, and the multilayer LED stack.

8. The method of claim 1 , further comprising:
depositing a hard mask material on the glassy carbon material.

9. The method of claim 8 , wherein the hard mask material is a titanium (Ti) material.

10. The method of claim 8 , further comprising:
applying a fourth photoresist layer to portions of the hard mask material;
patterning the glassy carbon conductor region; and removing the fourth photoresist layer.

11. The method of claim 1 , wherein the substrate is a sapphire substrate.

12. The method of claim 1 , wherein the buffer layer is formed of a zirconium diboride (ZrB2) material.

13. The method of claim 1 , wherein the multilayer LED stack is a gallium nitride (GaN) multilayer LED stack.

14. The method of claim 1 , wherein the optical sensor is a gallium nitride (GaN) optical sensor.

Assignees

• IBM

Inventors

• Holmes Steve
• Sadana Devendra
• Bedell Stephen W
• Doris Bruce
• Deligianni Hariklia
• Chen Jia

Classifications

• H10H29/142

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/832

  characterised by their material · CPC title

• H10H20/825

  containing nitrogen, e.g. GaN · CPC title

• H10H20/01335

  the light-emitting regions comprising nitride materials · CPC title