Printed electronics

US11161996B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11161996-B2
Application numberUS-201716345089-A
CountryUS
Kind codeB2
Filing dateOct 25, 2017
Priority dateOct 25, 2016
Publication dateNov 2, 2021
Grant dateNov 2, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present invention relates to an electronic device comprising a printed substrate comprising a trace of molecular ink thereon, the molecular ink being sintered to form a conductive metal trace forming the electronic device, wherein the molecular ink is chosen from a) a flake-less printable composition of 30-60 wt % of a C8-C12 silver carboxylate, 0.1-10 wt % of a polymeric binder and balance of at least one organic solvent, all weights based on total weight of the composition; or b) a flake-less printable composition of 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate, 0.25-10 wt % of a polymeric binder and balance of at least one organic solvent, all weights based on total weight of the composition.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electronic device comprising a printed substrate comprising a trace of molecular ink thereon, the molecular ink being sintered to form a conductive metal trace forming the electronic device, wherein the molecular ink is chosen from: a) a flake-less printable composition of 30-60 wt % of a C 8 -C 12 silver carboxylate, 0.1-10 wt % of a polymeric binder and balance of at least one organic solvent, all weights based on total weight of the composition; or b) a flake-less printable composition of 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate, 0.25-10 wt % of a polymeric binder and balance of at least one organic solvent, all weights based on total weight of the composition, wherein the molecular ink is stretchable and thermoformable, and wherein the molecular ink is printed as an in-mold electronic device. 2. The electronic device of claim 1 , wherein the electronic device comprises an inductor. 3. The electronic device of claim 1 , wherein the electronic device comprises a capacitor. 4. The electronic device of claim 1 , wherein the electronic device is printed as a solar cell. 5. The electronic device of claim 1 , wherein the electronic device is printed as a transparent electrode. 6. The electronic device of claim 1 , wherein the electronic device is printed as an electroluminescent lamp. 7. The electronic device of claim 1 , wherein the electronic device is printed as a wearable electronic device. 8. The electronic device of claim 1 , wherein the electronic device is printed as one of a physicochemical and an electromechanical sensor. 9. The electronic device of claim 1 , wherein the electronic device is printed as an in-mold resistive electrical circuit. 10. The electronic device of claim 1 , wherein the electronic device is installed on a portion of an aircraft. 11. The electronic device of claim 1 , wherein the electronic device is installed on a wing of an aircraft to heat the wing. 12. The electronic device of claim 1 , wherein the trace of molecular ink is stretchable and thermoformable. 13. The electronic device of claim 1 , wherein the molecular ink is sintered to form the conductive metal trace with the conductive metal trace forming a part of the in-mold electronic device. 14. A heater comprising an electronic device comprising a printed substrate with a trace of molecular ink thereon, the molecular ink being sintered to form a conductive metal trace forming the electronic device, wherein the molecular ink is chosen from: a) a flake-less printable composition of 30-60 wt % of a C 8 -C 12 silver carboxylate, 0.1-10 wt % of a polymeric binder and balance of at least one organic solvent, all weights based on total weight of the composition; or b) a flake-less printable composition of 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate, 0.25-10 wt % of a polymeric binder and balance of at least one organic solvent, all weights based on total weight of the composition, wherein the trace of molecular ink is stretchable and thermoformable, and wherein the molecular ink is printed as an in-mold electronic device. 15. The heater of claim 14 , wherein the molecular ink is sintered to form the conductive metal trace with the conductive metal trace forming a part of the in-mold electronic device. 16. A touch interface comprising a printed substrate comprising a trace of molecular ink thereon, the molecular ink being sintered to form a conductive metal trace forming a transparent conductive film, wherein the molecular ink is chosen from: a) a flake-less printable composition of 30-60 wt % of a C 8 -C 12 silver carboxylate, 0.1-10 wt % of a polymeric binder and balance of at least one organic solvent, all weights based on total weight of the composition; or b) a flake-less printable composition of 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate, 0.25-10 wt % of a polymeric binder and balance of at least one organic solvent, all weights based on total weight of the composition, wherein the trace of molecular ink is stretchable, thermoformable, and is able to undergo elongation greater than 50% without significant decrease in electric performance, and wherein the molecular ink is printed as an in-mold electronic device. 17. The touch interface of claim 16 , further comprising printed capacitive or resistive elements. 18. The touch interface of claim 16 , further comprising a capacitive micro-wire, wherein the capacitive micro-wire comprises a grid or pattern of printed silver electrodes and the substrate is flexible. 19. The touch interface of claim 16 , wherein the molecular ink is sintered to form the conductive metal trace with the conductive metal trace forming a part of the in-mold electronic device.

Assignees

Inventors

Classifications

  • Flexible insulating substrates · CPC title

  • Organic materials or pastes · CPC title

  • made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers · CPC title

  • incorporating printed electric components, e.g. printed resistors, capacitors or inductors · CPC title

  • C09D11/52Primary

    Electrically conductive inks · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11161996B2 cover?
The present invention relates to an electronic device comprising a printed substrate comprising a trace of molecular ink thereon, the molecular ink being sintered to form a conductive metal trace forming the electronic device, wherein the molecular ink is chosen from a) a flake-less printable composition of 30-60 wt % of a C8-C12 silver carboxylate, 0.1-10 wt % of a polymeric binder and balance…
Who is the assignee on this patent?
Ggi Int, Nat Res Council Canada, Her Majesty The Queen In Right Of Canada, and 1 more
What technology area does this patent fall under?
Primary CPC classification C09D11/52. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 02 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).