Film forming composition and film forming method using the same

US11161982B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11161982-B2
Application numberUS-201816500176-A
CountryUS
Kind codeB2
Filing dateApr 3, 2018
Priority dateApr 4, 2017
Publication dateNov 2, 2021
Grant dateNov 2, 2021

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

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[Problem] To provide a film forming composition and a film forming method capable of forming a film excellent in gas barrier properties. [Means for Solution] A film forming composition comprising a polysilazane, an organic solvent and an additive having a specific structure, and a film forming method comprising applying the composition on a substrate and exposing the composition to light. This specific additive is represented by a specific general formula among those having a nonconjugated cyclic structure composed of atoms selected from the group consisting of carbon, nitrogen and oxygen in the structure.

First claim

Opening claim text (preview).

The invention claimed is: 1. A film forming composition comprising: a polysilazane, an organic solvent, and at least one type of additive is the general formula (A): wherein L A1 is a C 1-7 alkylene or a C 1-7 heteroalkylene, L A2 s are each independently a C 1-7 alkylene, and R A s are each independently hydrogen or a C 1-3 alkyl. 2. The composition according to claim 1 , wherein said L A1 is a C 2-4 alkylene. 3. The composition according to claim 1 , wherein said L A2 s are each independently —CR A ′ 2 —, where R A ′s are each independently hydrogen or a C 1-3 alkyl. 4. The composition according to claim 1 , wherein said R A s are all hydrogen. 5. The composition according to claim 1 , wherein said polysilazane comprises a structural unit of the following general formula (1): wherein R 1 s are groups each independently selected from the group consisting of hydrogen, alkyl, alkenyl, cycloalkyl, aryl, alkoxy, amino and silyl, where at least one of R 1 is hydrogen and other R 1 is unsubstituted or substituted by one or more groups selected from the group consisting of halogen, alkyl, alkoxy, amino, silyl and alkylsilyl. 6. The composition according to claim 1 , wherein R's are groups each independently selected from the group consisting of hydrogen, alkyl, alkenyl, aryl, alkylsilyl and alkoxysilylalkyl. 7. The composition according to claim 1 , containing 0.002 to 0.5 mmol of said additive, based on 1 g of said polysilazane. 8. The composition according to claim 1 , further comprising an additional component represented by the following general formula (2): wherein, R 21 s are groups each independently selected from the group consisting of hydrogen, alkyl, alkenyl, cycloalkyl, aryl, alkoxy, amino and alkylsilyl, where R 21 is unsubstituted or substituted by one or more groups selected from the group consisting of halogen, alkyl, alkoxy, amino, silyl and alkylsilyl when R 21 is other than hydrogen, and the total number of all amino and alkoxy in the formula is 5% or less based on the total number of all R 21 in the formula, R 22 s are each independently a C 1-8 hydrocarbon group, or —R 23 —N—R 24 2 wherein R 23 is a C 1-5 hydrocarbon group and R 24 s are each independently hydrogen or a C 1-3 hydrocarbon group, and m is a number indicating polymerization degree. 9. The composition according to claim 1 , further comprising an additional component represented by the following general formula (3): wherein, the groups R 3 are each independently a monovalent group selected from the group consisting of a hydrogen atom, halogen atom, hydrocarbyl group, hydroxyl group, hydroxyhydrocarbyl group, acyl group, acyloxy group, amine group, aminohydrocarbyl group, hydrocarbyloxy group, silylhydrocarbyl group, imino-containing hydrocarbyl group; or R 3 is a single bond that forms a cyclic structure with another silicon atom, L 3 is a single bond, an alicyclic hydrocarbon, an aromatic hydrocarbon, a heterocyclic ring, or a saturated or unsaturated hydrocarbon chain where the chain may be interrupted by one of an oxygen atom, an imide group, an imino group, a carbonyl group, or a carboxyl group, and m is a number of zero or more, indicating polymerization degree. 10. The composition according to claim 1 , wherein said organic solvent comprises one or more kind of solvent which is aromatic hydrocarbon, saturated hydrocarbon compound, alicyclic hydrocarbon compound or alkyl ether. 11. A film forming method, comprising: (1) coating step of applying the composition according to claim 1 on a substrate to form a composition layer, and (2) exposure step of exposing said composition layer to light. 12. The method according to claim 11 , wherein said substrate is a plastic film. 13. The method according to claim 11 , wherein the thickness of said composition layer is 10 to 900 nm. 14. The method according to claim 11 , wherein the wavelength of the light is 161 to 248 nm. 15. The method according claim 11 , wherein said exposure step is carried out under inert gas atmosphere. 16. A film produced by the method according to claim 11 . 17. An electronic device, a medical device, a packaging container or a wrapping paper, which comprise the film according to claim 16 .

Assignees

Inventors

Classifications

  • Coating · CPC title

  • use in electrical or conductive gadgets · CPC title

  • in which all the silicon atoms are connected by linkages other than oxygen atoms · CPC title

  • containing two or more polymers of the same C08L -group · CPC title

  • used for films · CPC title

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What does patent US11161982B2 cover?
[Problem] To provide a film forming composition and a film forming method capable of forming a film excellent in gas barrier properties. [Means for Solution] A film forming composition comprising a polysilazane, an organic solvent and an additive having a specific structure, and a film forming method comprising applying the composition on a substrate and exposing the composition to light. This …
Who is the assignee on this patent?
Merck Patent Gmbh
What technology area does this patent fall under?
Primary CPC classification C09D5/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 02 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).