Touch panel, display device, and touch panel manufacturing method
US-2017017335-A1 · Jan 19, 2017 · US
US11155206B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11155206-B2 |
| Application number | US-201816175070-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 30, 2018 |
| Priority date | Nov 20, 2017 |
| Publication date | Oct 26, 2021 |
| Grant date | Oct 26, 2021 |
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Official abstract text for this publication.
A proximity sensor installed inside a vehicle can include: an outer frame formed of a first non-conductive substance and including a first metal layer; an inner frame formed of a second non-conductive substance, including a second metal layer, and disposed in an interior of the outer frame; a sensor electrode contacting the second metal layer; and a sensor Integrated Circuit (IC) connected to the sensor electrode and configured to detect an approach or a contact of a user's hand. The first metal layer can be connected to the ground (GND) so as to confine a sensing field of the sensor electrode to the interior of the outer frame.
Opening claim text (preview).
What is claimed is: 1. A proximity sensor installed inside a vehicle, the proximity sensor comprising: an outer frame formed of a first non-conductive substance; an inner frame formed of a second non-conductive substance and disposed in an interior of the outer frame, the inner frame comprising a first inner frame, a second inner frame, and a third inner frame, which are separated from one another; a first metal layer covering the outer frame, the second inner frame, and the third inner frame; a second metal layer covering the first inner frame; a sensor electrode contacting the second metal layer; and a sensor Integrated Circuit (IC) connected to the sensor electrode and configured to detect an approach or a contact of a user's hand, wherein the first metal layer is connected to a ground (GND) so as to confine a sensing field of the sensor electrode to the interior of the outer frame. 2. The proximity sensor of claim 1 , further comprising: a printed circuit board (PCB) having the sensor IC mounted thereon and including a ground layer forming the ground (GND). 3. The proximity sensor of claim 1 , further comprising: a connector connecting the first metal layer to the ground (GND). 4. The proximity sensor of claim 3 , wherein the outer frame comprises a metal complex, and the connector is formed by metalizing an electrode recess formed by irradiating laser to the outer frame. 5. The proximity sensor of claim 3 , wherein the connector comprises at least one of a wire, a flexible PCB, and a conductive tool. 6. The proximity sensor of claim 1 , wherein the outer frame includes a closed loop forming a range of a sensing field of the sensor electrode. 7. The proximity sensor of claim 6 , wherein the inner frame is formed to divide the closed loop of the outer frame into at least two portions. 8. The proximity sensor of claim 1 , further comprising: non-conductive ribs disposed between the first and second inner frames and between the first and third inner frames. 9. The proximity sensor of claim 1 , wherein the inner frame comprises a metal complex, and the sensor electrode is formed by metalizing an electrode recess formed by irradiating laser to the inner frame.
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