Method of manufacturing substrate with resin layer and method of manufacturing liquid ejection head
US-2020094557-A1 · Mar 26, 2020 · US
US11155083B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11155083-B2 |
| Application number | US-201916512197-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 15, 2019 |
| Priority date | Jul 19, 2018 |
| Publication date | Oct 26, 2021 |
| Grant date | Oct 26, 2021 |
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A member transfer method includes sticking a member supported at a support to an object, thinning the support after the sticking of the member to the object, and removing the support from the member after the thinning of the support.
Opening claim text (preview).
What is claimed is: 1. A manufacturing method for a liquid ejection head including a channel formation member which has an ejection port ejecting a liquid and a channel communicating with the ejection port, a substrate on which the channel formation member is stacked and has a supply path communicating with the channel, and an energy generation element which generates energy for ejecting the liquid, the method comprising: sticking the channel formation member supported at a support to the substrate; thinning the support after the sticking of the channel formation member to the substrate; and peeling the support from the channel formation member after the thinning of the support and before exposing the channel formation member by light. 2. The manufacturing method for the liquid ejection head according to claim 1 , further comprising: exposing the channel formation member to light so as to form a pattern serving as the channel; and developing the channel formation member to be partially removed, and thus forming the channel. 3. The manufacturing method for the liquid ejection head according to claim 1 , wherein the channel formation member is a dry film. 4. The manufacturing method for the liquid ejection head according to claim 1 , wherein the support has a single-layer structure. 5. The manufacturing method for the liquid ejection head according to claim 4 , wherein the thinning of the support is performed by polishing the support. 6. The manufacturing method for the liquid ejection head according to claim 1 , wherein the support has a multi-layer structure. 7. The manufacturing method for the liquid ejection head according to claim 6 , wherein, in the thinning of the support, among layers forming the support, at least one layer is removed through polishing. 8. The manufacturing method for the liquid ejection head according to claim 6 , wherein, in the thinning of the support, among layers forming the support, at least one layer is removed through dissolution. 9. The manufacturing method for the liquid ejection head according to claim 6 , wherein, in the thinning of the support, among layers forming the support, at least one layer is removed through peeling.
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