Electron source and production method therefor

US11152185B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11152185-B2
Application numberUS-202117177944-A
CountryUS
Kind codeB2
Filing dateFeb 17, 2021
Priority dateJul 19, 2016
Publication dateOct 19, 2021
Grant dateOct 19, 2021

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An electron source capable of suppressing consumption of an electron emission material is provide. The present invention provides an electron source including: an electron emission material; and, an electron emission-suppressing material covering a side surface of the electron emission material, wherein a work function of the electron emission-suppressing material is higher than that of the electron emission material, and a thermal emissivity of the electron emission-suppressing material is lower than that of the electron emission material.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for manufacturing an electron source, comprising an applying step and a solidifying step, wherein, the electron source comprises an electron emission material and an electron emission-suppressing material covering a side surface of the electron emission material, a work function of the electron emission-suppressing material is higher than that of the electron emission material, in the applying step, paste containing electron emission-suppressing material is applied to a side surface of an electron emission material, and in the solidifying step, the paste is solidified. 2. The method according to claim 1 , further comprising an inserting step between the applying step and the solidifying step, wherein, in the inserting step, the electron emission material having the applied paste is inserted into an opening provided in a support member. 3. The method according to claim 1 , wherein the electron emission material comprises at least one selected from the group consisting of lanthanum boride, cerium boride and iridium cerium. 4. The method according to claim 1 , wherein the side surface of the electron emission material has a (100) crystal plane at an outer peripheral portion thereof. 5. The method according to claim 1 , wherein the electron emission-suppressing material comprises at least one selected from the group consisting of metallic tantalum, metallic titanium, metallic zirconium, metallic tungsten, metallic molybdenum, metallic rhenium, tantalum carbide, titanium carbide and zirconium carbide. 6. The method according to claim 1 , wherein an end surface of the electron emission material is on the same plane as an end surface of the electron emission-suppressing material, and a normal to the plane is in a direction of emission of electrons. 7. The method according to claim 1 , wherein shape of the electron emission-suppressing material is a thin film. 8. The method according to claim 6 , wherein the thin film has a thickness of 0.1 to 2 μm. 9. The method according to claim 2 , wherein the support member is provided around the electron emission-suppressing material. 10. The method according to claim 9 , wherein the support member is closely attached to the electron emission-suppressing material. 11. The method according to claim 9 , wherein the support member is made of graphite.

Assignees

Inventors

Classifications

  • H01J1/148Primary

    with compounds having metallic conductive properties, e.g. lanthanum boride, as an emissive material · CPC title

  • Field emission · CPC title

  • Coatings on the emitter surface, e.g. with low work function materials · CPC title

  • H01J37/06Primary

    Electron sources; Electron guns · CPC title

  • of thermionic cathodes · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11152185B2 cover?
An electron source capable of suppressing consumption of an electron emission material is provide. The present invention provides an electron source including: an electron emission material; and, an electron emission-suppressing material covering a side surface of the electron emission material, wherein a work function of the electron emission-suppressing material is higher than that of the ele…
Who is the assignee on this patent?
Denka Company Ltd
What technology area does this patent fall under?
Primary CPC classification H01J1/148. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 19 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).