Transient adhesives, methods of making, and methods of use

Patent metadata

Field	Value
Publication number	US-11149174-B2
Application number	US-201916540550-A
Country	US
Kind code	B2
Filing date	Aug 14, 2019
Priority date	Apr 22, 2016
Publication date	Oct 19, 2021
Grant date	Oct 19, 2021

Abstract

Embodiments of the present disclosure provide for transient adhesive polymers, methods of making transient adhesive polymers, structures including the transient adhesive polymer attaching two portions of the structure to one another, and the like.

First claim

We claim:

1. A composition, comprising:
a transient polymer adhesive that loses its adhesive properties upon exposure to temperatures from about 0 to about 325° C., wherein the transient polymer adhesive is a thermoset polymer, wherein the thermoset polymer has one of the following structures:

wherein R 1 and R 3 are each independently selected from C x X y , linear or branched, where X is H or a halogen and x is 1 to 12 and y is x to 2x, a bivalent aryl group, a bivalent ether, a bivalent ketone, a bivalent carbonate, a bivalent amine, a bivalent amide, or a bivalent thiol, wherein R is a alkyl group, an aryl group, an ether group, a ketone group, a carbonate group, an amine group, an amide group, or a thiol group, wherein n is 2 to 100,000 and m is 2 to 100,000.

2. The composition of claim 1 , wherein the transient polymer adhesive has a T g of about 0 to about 400° C., and wherein the transient polymer adhesive has a T Donset of about 0 to about 450° C. or wherein the transient polymer adhesive further comprising a catalyst and has a T Donset(cat) of about 25 to about 250° C.

3. The composition of claim 1 , wherein the transient polymer adhesive loses its adhesive properties upon exposure to temperatures from about 80 to about 325° C.

4. The composition of claim 1 , wherein the transient polymer adhesive loses its adhesive properties upon exposure to temperatures from about 25 to about 200° C.

5. A structure, comprising: a device or a textile adhered to a substrate using a transient polymer adhesive that loses its adhesive properties upon exposure to temperatures from about 0 to about 325° C.,
wherein the transient polymer adhesive is a thermoset polymer, wherein the thermoset polymer has one of the following structures:

wherein R 1 and R 3 are each independently selected from C x X y , linear or branched, where X is H or a halogen and x is 1 to 12 and y is x to 2x, a bivalent aryl group, a bivalent ether, a bivalent ketone, a bivalent carbonate, a bivalent amine, a bivalent amide, or a bivalent thiol, wherein R is a alkyl group, an aryl group, an ether group, a ketone group, a carbonate group, an amine group, an amide group, or a thiol group, wherein n is 2 to 100,000 and m is 2 to 100,000.

6. The structure of claim 5 , wherein the transient polymer adhesive has a T g of about 0 to about 400° C., wherein the transient polymer adhesive has a T Donset of about 0 to about 450° C., or wherein the transient polymer adhesive further comprising a catalyst and has a T Donset(cat) of about 25 to about 250° C.

7. The structure of claim 5 , wherein the transient polymer adhesive loses its adhesive properties upon exposure to temperatures from about 80 to about 325° C.

8. The structure of claim 5 , wherein the transient polymer adhesive loses its adhesive properties upon exposure to temperatures from about 25 to about 200° C.

9. A structure, comprising: a device or a textile adhered to a substrate using a transient polymer adhesive that loses its adhesive properties upon exposure to temperatures from about 0 to about 325° C.,
wherein the transient polymer adhesive is a thermoset polymer, wherein the thermoset polymer has one of the following structures:

wherein R 1 and R 3 are each independently selected from a bivalent aryl group, a bivalent ether, a bivalent ketone, a bivalent carbonate, a bivalent amine, a bivalent amide, or a bivalent thiol, wherein R is a alkyl group, an aryl group, an ether group, a ketone group, a carbonate group, an amine group, an amide group, or a thiol group, wherein n is 2 to 100,000 and m is 2 to 100,000.

10. The structure of claim 9 , wherein the transient polymer adhesive has a T g of about 0 to about 400° C., wherein the transient polymer adhesive has a T Donset of about 0 to about 450° C., or wherein the transient polymer adhesive further comprising a catalyst and has a T Donset(cat) of about 25 to about 250° C.

11. The structure of claim 9 , wherein the transient polymer adhesive loses its adhesive properties upon exposure to temperatures from about 80 to about 325° C.

12. The structure of claim 9 , wherein the transient polymer adhesive loses its adhesive properties upon exposure to temperatures from about 25 to about 200° C.

13. A structure, comprising: a device or a textile adhered to a substrate using a transient polymer adhesive that loses its adhesive properties upon exposure to temperatures from about 0 to about 325° C., wherein the transient polymer adhesive is a thermoset polymer, wherein the thermoset polymer has one of the following structures:

wherein R 1 and R 3 are each independently selected from C x X y , linear or branched, where X is H or a halogen and x is 1 to 12 and y is x to 2x, a bivalent aryl group, a bivalent ether, a bivalent ketone, a bivalent carbonate, a bivalent amine, a bivalent amide, or a bivalent thiol, wherein R is a alkyl group, an aryl group, an ether group, a ketone group, a carbonate group, an amine group, an amide group, or a thiol group, wherein n is 2 to 100,000 and m is 2 to 100,000.

14. The structure of claim 13 , wherein the transient polymer adhesive has a T g of about 0 to about 400° C., wherein the transient polymer adhesive has a T Donset of about 0 to about 450° C., or wherein the transient polymer adhesive further comprising a catalyst and has a T Donset(cat) of about 25 to about 250° C.

15. The structure of claim 13 , wherein the transient polymer adhesive loses its adhesive properties upon exposure to temperatures from about 80 to about 325° C.

16. The structure of claim 13 , wherein the transient polymer adhesive loses its adhesive properties upon exposure to temperatures from about 25 to about 200° C.

Assignees

• Georgia Tech Res Inst

Inventors

• Kohl Paul A
• Engler Anthony
• Schwartz Jared
• Gourdin Gerald
• Jiang Jisu
• Phillips Oluwadamilola

Classifications

• B32B2437/00

  Clothing · CPC title

• B32B2457/00

  Electrical equipment · CPC title

• C09J171/00

  Adhesives based on polyethers obtained by reactions forming an ether link in the main chain (based on polyacetals C09J159/00; based on epoxy resins C09J163/00; based on polythioether-ethers C09J181/02; based on polyethersulfones C09J181/06); Adhesives based on derivatives of such polymers · CPC title

• B32B2307/748

  Releasability · CPC title

• C09J163/00 Primary

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title