High definition stencil

US11148453B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11148453-B2
Application numberUS-201916676960-A
CountryUS
Kind codeB2
Filing dateNov 7, 2019
Priority dateMay 30, 2017
Publication dateOct 19, 2021
Grant dateOct 19, 2021

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A stencil for use in stenciling complex symbols incorporates a stencil substrate employing a flexible material, having a plurality of symbols arranged thereon. A plurality of folding stiffeners are incorporated in the substrate, each stiffener being positioned to split symbols having stencil cutouts forming isolated elements within an interior of the symbol. The stiffeners are foldable about a vertex, to collapse into a raised position and bring together the split symbol, with the stiffeners supporting the isolated elements created by the cutouts and portions of the stencil cutouts forming the symbols that extend into coincident channels in the folding stiffeners, to bridge adjoining portions of said split characters.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for forming a stencil to apply a painted marker on a surface comprising: introducing symbols desired on a stencil into a stencil substrate to form a plurality of cutouts arranged thereon for paint transmission to a surface; introducing a removable filler into the cutouts at locations spanning the cutouts at isolated elements for placement of desired ribs; applying a plurality of raised stiffeners vertically oriented and arranged to bridge across specific cutouts with isolated elements, the plurality of raised stiffeners supporting the isolated elements spanning the symbol in a manner to overlap the filler wherein portions of said specific cutouts are coincident with channels through a part of the plurality of raised stiffeners; and removing the filler whereby the stencil substrate and the plurality of raised stiffeners are formed by an additive manufacturing process. 2. The method as defined in claim 1 wherein the filler has a depth creating the channels coincident with the cutouts. 3. The method as defined in claim 2 further comprising: applying the stencil to a surface on which the painted marker is to be applied; applying paint to the cutouts with communication through the channels for continuity of the symbols as painted; and removing the stencil from the surface. 4. The method as defined in claim 3 further comprising applying an adhesive to the stencil to adhere to the surface. 5. The method of claim 4 wherein the stencil substrate and symbols are formed by printing in an additive manufacturing process. 6. The method as defined in claim 4 wherein the step of printing in an additive manufacturing process further comprises printing the plurality of raised stiffeners supporting islands and tails spanning the symbol in a manner to overlap the filler. 7. The method as defined in claim 3 wherein the step of applying the stencil to a surface comprises adhesively adhering the stencil to the surface. 8. The method as defined in claim 1 wherein the filler is applied in one or more layers by fused deposition. 9. The method as defined in claim 1 wherein the vertical ribs are applied in one or more layers by fused deposition. 10. The method as defined in claim 1 wherein removal of the filler comprises dissolving or etching the filler. 11. The method as defined in claim 1 wherein removal of the filler comprises breaking the filler. 12. The method as defined in claim 1 wherein the vertical ribs are printed in one or more layers spanning the cutout to overlap the filler. 13. The method as defined in claim 1 wherein the step of introducing a removable filler comprises introducing a removable polysulfone filler. 14. The method as defined in claim 13 wherein the step of removing the filler comprises removing the polysulfone filler from the cutouts and channels. 15. The method as defined in claim 13 further comprises applying the removable polysulfone filler with a depth for communication through the channels during paint application for continuity of the symbols as painted. 16. The method as defined in claim 1 wherein the step of applying a plurality of raised stiffeners comprises applying a plurality of raised polyetherimide alloy raised stiffeners. 17. The method as defined in claim 1 wherein the step of introducing symbols desired on a stencil into a stencil substrate comprises introducing symbols desired on a stencil into a polyetherimide stencil substrate. 18. The method as defined in claim 1 wherein the step of applying a plurality of raised stiffeners further comprises applying the plurality of raised stiffeners as parallel ribs. 19. The method as defined in claim 1 wherein the step of applying a plurality of raised stiffeners further comprises applying the plurality of raised stiffeners as intersecting ribs.

Assignees

Inventors

Classifications

  • Stencils; Stencil materials; Carriers therefor (stencilling apparatus for office or other commercial use B41L13/00) · CPC title

  • Stencil printing; Silk-screen printing · CPC title

  • using stencils in artistic drawing or painting operations · CPC title

  • for stencil-printing or silk-screen printing · CPC title

  • Screens, Frames; Holders therefor · CPC title

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What does patent US11148453B2 cover?
A stencil for use in stenciling complex symbols incorporates a stencil substrate employing a flexible material, having a plurality of symbols arranged thereon. A plurality of folding stiffeners are incorporated in the substrate, each stiffener being positioned to split symbols having stencil cutouts forming isolated elements within an interior of the symbol. The stiffeners are foldable about a …
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification B05B12/28. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 19 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).