Wood material board with reduced emission of volatile organic compounds (VOCs) and method for the production thereof

Patent metadata

Field	Value
Publication number	US-11148317-B2
Application number	US-201916506441-A
Country	US
Kind code	B2
Filing date	Jul 9, 2019
Priority date	Dec 7, 2015
Publication date	Oct 19, 2021
Grant date	Oct 19, 2021

Abstract

A method for producing wood material boards with reduced emission of volatile organic compounds (VOCs), including: a) producing woodchips from suitable timbers; b) heat-treating at least one portion of the woodchips at a temperature between 150° C. and 300° C. for a period of 1 to 5 hours; c) crushing the wood chips that are not heat-treated and at least one portion of the heat-treated woodchips by machining in order to obtain wood shavings or by solubilizing in order to obtain wood fibers; d) gluing the wood shavings or wood fibers with at least one binding agent; e) applying the glued wood shavings onto a transport belt while forming a multi-layered shavings cake or applying the glued wood fibers onto a transport belt while forming a single-layer fiber cake; and f) compressing the shavings cake or the fiber cake to form a wood material board.

First claim

The invention claimed is:

1. A wood chipboard panel with reduced emission of volatile organic compounds (VOCs) comprising wood shavings produced from heat-treated and non-heat-treated wood chips by shaving and gluing,
wherein, in the case of heat treatment, the wood chips are exposed to a temperature between 150° C. and 300° C. for a period of 1 hour to 5 hours prior to shaving,
the wood chipboard panel consists of a mixture of 10% to 50% by weight of shavings obtained from non-heat-treated wood chips and 50% to 90% by weight of shavings obtained from heat-treated wood chips, and
the wood chipboard panel exhibits a reduced emission of aldehydes and/or of organic acids released during wood decomposition as compared to a wood chipboard made of wood chips obtained from non-heat-treated wood chips.

2. The wood chipboard panel according to claim 1 , wherein the shavings obtained from the heat-treated wood chips are used in a middle layer of the wood chipboard panel.

3. The wood chipboard panel according to claim 1 , further comprising a binder selected from the group consisting of formaldehyde adhesives, polyurethane adhesives, epoxy resin adhesives, and polyester adhesives.

4. The wood chipboard panel according to claim 3 , wherein the polyurethane adhesive is based on aromatic polyisocyanates.

5. The wood chipboard panel according to claim 4 , wherein the aromatic polyisocyanate is polydiphenylmethane diisocyanate (PMDI), tolylene diisocyanate (TDI), and/or diphenylmethane diisocyanate (MDI).

6. The wood chipboard panel according to 3, wherein, when a polyurethane adhesive is used, the amount of binder in a middle layer is between 2% and 5% by weight and in a top layer is between 4% and 8% by weight.

7. The wood chipboard panel according to claim 1 , wherein the wood chipboard panel has a bulk density between 400 kg/m 3 and 1200 kg/m 3 .

8. The wood chipboard panel according to claim 1 , wherein the aldehydes comprise one or more of pentanal, hexanal, or octanal.

9. A method of using a chipboard panel according to claim 1 for furniture, wall, floor and ceiling coverings.

10. A wood fiberboard panel with reduced emission of volatile organic compounds (VOCs) comprising wood fibers produced and glued by defibration from heat-treated and non-heat-treated wood chips,
wherein, in the case of heat treatment, the wood chips are exposed to a temperature between 150° C. and 300° C. for a period of 1 hour to 5 hours prior to defibration,
the wood fiberboard panel consists of a mixture of 10% to 50% by weight of fibers obtained from non-heat-treated wood chips and 50% to 90% by weight of fibers obtained from heat-treated wood chips, and
the wood fiberboard panel exhibits a reduced emission of aldehydes and/or of organic acids released during wood decomposition as compared to a wood fiberboard made of wood chips obtained from non-heat-treated wood chips.

11. The wood fiberboard panel according to claim 10 , further comprising a binder selected from the group consisting of formaldehyde adhesives, polyurethane adhesives, epoxy resin adhesives, and polyester adhesives.

12. The wood fiberboard panel according to claim 11 , wherein the polyurethane adhesive is based on aromatic polyisocyanates.

13. The wood fiberboard panel according to claim 12 , wherein the aromatic polyisocyanate is polydiphenylmethane diisocyanate (PMDI), tolylene diisocyanate (TDI), and/or diphenylmethane diisocyanate (MDI).

14. The wood fiberboard panel according to claim 11 , wherein, when a polyurethane adhesive is used, the quantity of the binder is 1% to 10% by weight.

15. The wood fiberboard panel according to claim 10 , wherein the wood fiberboard panel has a bulk density between 400 kg/m 3 and 1200 kg/m 3 .

16. The wood fiberboard panel according to claim 10 , wherein the aldehydes comprise one or more of pentanal, hexanal, or octanal.

17. A method of using a wood fiberboard panel according to claim 10 for furniture, wall, floor and ceiling coverings.

Assignees

• SWISS KRONO Tec AG

Inventors

• Kalwa Norbert

Classifications

• B27N3/183

  Forming the mat-edges, e.g. by cutting · CPC title

• B27K5/00

  Treating of wood not provided for in groups B27K1/00, B27K3/00 · CPC title

• B27N1/00

  Pretreatment of moulding material · CPC title

• B27K2240/10

  Extraction of components naturally occurring in wood, cork, straw, cane or reed · CPC title

• B27N1/003 Primary

  for reducing formaldehyde gas emission · CPC title