Method and device for removing material from a substrate

US11148246B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11148246-B2
Application numberUS-201916288753-A
CountryUS
Kind codeB2
Filing dateFeb 28, 2019
Priority dateJan 3, 2017
Publication dateOct 19, 2021
Grant dateOct 19, 2021

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A material removal device for removing material from a substrate includes a holder extending between first and second sides and a grinding wheel supported by the holder and being operable to remove the material from the substrate. The holder has a guide frame at the first side and a support frame at the second side. The guide frame has a first bottom surface and the support frame has a second bottom surface. The first and second bottom surfaces are vertically offset from each other. The grinding wheel has an axle supported by the guide frame and the support frame. The grinding wheel has a grinding surface located below the first bottom surface and above the second bottom surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A material removal device for removing material from a substrate, the material removal device comprising: a holder extending between first and second sides, the holder having a guide frame at the first side and a support frame at the second side, the guide frame having a first bottom surface, the support frame having a second bottom surface, the first and second bottom surfaces being vertically offset from each other; and a grinding wheel supported by the holder and being operable to remove the material from the substrate, the grinding wheel having an axle bearing on and supported by the guide frame and the axle bearing on and supported by the support frame, the grinding wheel having a grinding surface, the grinding surface being located below the first bottom surface and above the second bottom surface. 2. The material removal device of claim 1 , wherein the first bottom surface is configured to rest on the substrate and the second bottom surface is configured to rest on the material a distance above the substrate. 3. The material removal device of claim 1 , wherein the grinding surface is parallel to the axle. 4. The material removal device of claim 1 , wherein the grinding surface is angled transverse relative to the axle. 5. The material removal device of claim 1 , wherein the grinding wheel is configured to remove a layer of the material having a thickness equal to a vertical distance between the grinding surface and the first bottom surface. 6. The material removal device of claim 1 , wherein the grinding wheel is configured to leave a layer of the material on the substrate having a thickness equal to a vertical distance between the grinding surface and the second bottom surface. 7. The material removal device of claim 1 , further comprising a cover attached to the holder and partially surrounding the grinding wheel, the cover having a handle used to advance the material removal device in a grinding direction along the substrate. 8. The material removal device of claim 7 , wherein the cover includes a funnel for collecting the material removed by the grinding wheel. 9. The material removal device of claim 1 , further comprising an actuator operably coupled to the axle to rotate the grinding wheel. 10. The material removal device of claim 1 , further comprising bearings held in the guide frame and the support frame, the bearings supporting the axle. 11. The material removal device of claim 1 , wherein the axle and the grinding wheel are integral including a common, unitary body. 12. The material removal device of claim 1 , wherein the guide frame includes a guide surface configured to engage a guide rail to guide advancing of the material removal device in a grinding direction along the substrate. 13. The material removal device of claim 1 , wherein the first bottom surface is milled down to a first offset distance from the grinding surface and the second bottom surface is milled down to a second offset distance from the grinding surface. 14. The material removal device of claim 1 , wherein the holder includes removable feet at bottoms of the guide frame and the support frame defining the first and second bottom surfaces, the removable feet being replaceable to adjust the position of the grinding wheel relative to the substrate. 15. The material removal device of claim 1 , wherein the holder has a support plane defined between the guide frame and the support frame, the grinding surface being nonparallel to the support plane. 16. The material removal device of claim 15 , wherein the support plane is non-horizontal. 17. A material removal device for removing material from a substrate, the material removal device comprising: a holder extending between first and second sides, the holder having a guide frame at the first side and a support frame at the second side, the guide frame having a first bottom surface, the support frame having a second bottom surface, the first and second bottom surfaces being vertically offset from each other; and a grinding wheel supported by the holder and being operable to remove the material from the substrate, the grinding wheel having an axle extending between the guide frame and the support frame and being generally parallel to the substrate, the grinding wheel having a grinding surface rotated around the axel, the grinding surface being located below the first bottom surface and above the second bottom surface. 18. The material removal device of claim 17 , wherein the first bottom surface is configured to rest on the substrate and the second bottom surface is configured to rest on the material a distance above the substrate. 19. A material removal device for removing material from a substrate, the material removal device comprising: a holder extending between first and second sides, the holder having a guide frame at the first side and a support frame at the second side, the guide frame having a first bottom surface, the support frame having a second bottom surface, the first and second bottom surfaces being planar, the first and second bottom surfaces being parallel to each other and being vertically offset from each other; and a grinding wheel supported by the holder and being operable to remove the material from the substrate, the grinding wheel having an axle supported by the guide frame and the support frame, the grinding wheel having a grinding surface, the grinding surface being located below the first bottom surface and above the second bottom surface. 20. The material removal device of claim 19 , wherein the first bottom surface is configured to rest on the substrate and the second bottom surface is configured to rest on the material a distance above the substrate.

Assignees

Inventors

Classifications

  • Maintaining or repairing aircraft · CPC title

  • B24B7/10Primary

    Single-purpose machines or devices (grinding tools or machines specially designed for use on assembled railway track E01B31/17) · CPC title

Patent family

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What does patent US11148246B2 cover?
A material removal device for removing material from a substrate includes a holder extending between first and second sides and a grinding wheel supported by the holder and being operable to remove the material from the substrate. The holder has a guide frame at the first side and a support frame at the second side. The guide frame has a first bottom surface and the support frame has a second b…
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification B24B7/10. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 19 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).