Method for manufacturing electroluminescent device

Patent metadata

Field	Value
Publication number	US-11145844-B2
Application number	US-202016748283-A
Country	US
Kind code	B2
Filing date	Jan 21, 2020
Priority date	Feb 27, 2019
Publication date	Oct 12, 2021
Grant date	Oct 12, 2021

Abstract

A method of manufacturing an electroluminescent device includes the following steps. A substrate including a first sub-pixel region and a second sub-pixel region is provided. A first light-emitting layer is formed over the substrate through a shadow mask to cover the first sub-pixel region and at least a portion of the second sub-pixel region. A sacrificial layer is formed over the substrate, wherein the sacrificial layer includes an opening exposing a portion of the first light-emitting layer that is over the second sub-pixel region. The portion of the first light-emitting layer that is over the second sub-pixel region is removed. A second light-emitting layer is formed over the sacrificial layer and on the second sub-pixel region through the opening of the sacrificial layer. The sacrificial layer is removed simultaneously with a portion of the second light-emitting layer that is over the sacrificial layer.

First claim

The invention claimed is:

1. A method of manufacturing an electroluminescent device, comprising:
providing a substrate including a first sub-pixel region and a second sub-pixel region configured to display an image of a first color and an image of a second color, respectively;
forming a first light-emitting layer over the substrate to cover the first sub-pixel region and at least a portion of the second sub-pixel region;
forming a first sacrificial layer over the substrate, wherein the first sacrificial layer covers a portion of the first light-emitting layer that is over the first sub-pixel region, and the first sacrificial layer includes a first opening exposing a portion of the first light-emitting layer that is over the second sub-pixel region;
removing the portion of the first light-emitting layer that is over the second sub-pixel region and is exposed through the first opening of the first sacrificial layer;
forming a second light-emitting layer over the first sacrificial layer and over the second sub-pixel region through the first opening of the first sacrificial layer; and
removing the first sacrificial layer simultaneously with a portion of the second light-emitting layer that is over the first sacrificial layer by a lift-off process.

2. The method of claim 1 , wherein the substrate further includes a third sub-pixel region configured to display an image of a third color.

3. The method of claim 2 , wherein the first light-emitting layer is formed by inject printing, and the first light-emitting layer covers the first sub-pixel region, the second sub-pixel region and the third sub-pixel region.

4. The method of claim 2 , wherein the first light-emitting layer is formed through a common metal mask having a hole aligned with the first sub-pixel region, the second sub-pixel region and the third sub-pixel region, the first light-emitting layer covers the first sub-pixel region, the second sub-pixel region and the third sub-pixel region, and the first sacrificial layer further covers the third sub-pixel region.

5. The method of claim 4 , further comprising:
forming a second sacrificial layer over the substrate, wherein the second sacrificial layer covers the portion of the first light-emitting layer that is over the first sub-pixel region, the second sacrificial layer further covers the second light-emitting layer that is over the second sub-pixel region, and the second sacrificial layer includes a second opening exposing a portion of the first light-emitting layer that is over the third sub-pixel region;
removing the portion of the first light-emitting layer that is over the third sub-pixel region and that is exposed through the second opening of the second sacrificial layer;
forming a third light-emitting layer over the second sacrificial layer and on the third sub-pixel region through the second opening of the second sacrificial layer; and
removing the second sacrificial layer simultaneously with a portion of the third light-emitting layer that is over the second sacrificial layer by a lift-off process.

6. The method of claim 2 , wherein the first light-emitting layer is formed through a first fine metal mask having a hole aligned with the first sub-pixel region and a portion of the second sub-pixel region, and the first light-emitting layer covers the first sub-pixel region and a portion of the second sub-pixel region.

7. The method of claim 6 , further comprising:
forming a third light-emitting layer over the substrate through a second fine metal mask to cover the third sub-pixel region and another portion of the second sub-pixel region prior to the forming of the first sacrificial layer; and
after the forming of the first sacrificial layer, removing a portion of the third light-emitting layer that is over the second sub-pixel region and is exposed through the first opening of the first sacrificial layer simultaneously with the removing of the first light-emitting layer.

8. The method of claim 6 , further comprising:
forming a second sacrificial layer over the substrate prior to the forming of the first light-emitting layer, wherein the second sacrificial layer covers the first sub-pixel region and the second sub-pixel region, and the second sacrificial layer includes a second opening exposing the third sub-pixel region;
forming a third light-emitting layer over the second sacrificial layer and over the third sub-pixel region through the second opening of the second sacrificial layer; and
removing the second sacrificial layer simultaneously with a portion of the third light-emitting layer that is over the second sacrificial layer by a lift-off process.

9. The method of claim 1 , wherein the first sacrificial layer comprises a photosensitive layer patterned by a photolithography process.

10. The method of claim 9 , wherein the first sacrificial layer further comprises a releasing layer between the substrate and the photosensitive layer.

11. The method of claim 10 , wherein the first sacrificial layer further comprises a barrier layer between the photosensitive layer and the releasing layer.

12. The method of claim 11 , further comprising patterning the barrier layer by a dry etching process.

13. The method of claim 12 , further comprising patterning the releasing layer by a dry etching process.

14. The method of claim 12 , further comprising patterning the releasing layer by a wet etching process.

15. The method of claim 1 , further comprising forming a pixel-defining layer over the substrate to separate the first sub-pixel region from the second sub-pixel region prior to the forming of the first light-emitting layer.

16. The method of claim 1 , further comprising forming a plurality of electrodes over the substrate prior to the forming of the first light-emitting layer.

17. The method of claim 1 , further comprising forming a conductive layer over the substrate after the removing of the first sacrificial layer.

18. A method of manufacturing a light-emitting device, comprising:
providing a substrate including a first pixel, a second pixel and a third pixel configured to emit different colors;
forming a first light-emitting layer over the substrate through a first shadow mask to cover the first pixel and at least a portion of the third pixel;
forming a second light-emitting layer over the substrate through a second shadow mask to cover the second pixel and at least a portion of the third pixel;
forming a photosensitive layer over the substrate, wherein the photosensitive layer covers a portion of the first light-emitting layer that is over the first pixel and a portion of the second light-emitting layer that is over the second pixel, and the photosensitive layer exposes portions of the first light-emitting layer and the second light-emitting layer that are over the third pixel;
removing the portions of the first light-emitting layer and the second light-emitting layer that are exposed through the photosensitive layer;
forming a third light-emitting layer over the photosensitive layer and over the third pixel; and
removing the photosensitive layer simultaneously with a portion of the third light-emitting layer that is over the photosensitive layer.

19. A method of manufacturing a display panel, comprising:
forming a first light-emitting layer over a substrate through a shadow mask, wherein the substrate includes a first pixel, a second pixel and a third pixel;
removing a portion of the first light-emitting layer that is over the second pixel and is exposed through a first photosensitive layer;
forming a seco

Assignees

• Int Tech Co Ltd

Inventors

• Chen Huei-Siou
• Liu Yi-Cheng
• Wei Li-Chen

Classifications

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K59/35 Primary

  comprising red-green-blue [RGB] subpixels · CPC title

• H01L51/0018

  Electricity · mapped topic

• H01L51/003

  Electricity · mapped topic

• H01L51/56 Primary

  Electricity · mapped topic