Compact opto-electronic modules and fabrication methods for such modules

Patent metadata

Field	Value
Publication number	US-11145796-B2
Application number	US-202016919556-A
Country	US
Kind code	B2
Filing date	Jul 2, 2020
Priority date	Sep 10, 2013
Publication date	Oct 12, 2021
Grant date	Oct 12, 2021

Abstract

Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

First claim

What is claimed is:

1. An optoelectronic module comprising:
an optoelectronic device;
sidewalls laterally surrounding the optoelectronic device and in direct contact with sides of the optoelectronic device, wherein the sidewalls are composed of a material that is non-transparent to light emitted by or detectable by the optoelectronic device;
a passive optical element disposed directly on an upper surface of the optoelectronic device, wherein the passive optical element is in direct contact with the upper surface of the optoelectronic device, and wherein the passive optical element is a lens; and
electrically conductive contacts on an underside of the optoelectronic device and arranged to mount the module directly on a printed circuit board of a host device.

2. The optoelectronic module of claim 1 , wherein at least a portion of the sidewalls serves as an outer wall of the module.

3. The optoelectronic module of claim 1 , wherein the sidewalls are composed of a vacuum injected material.

4. The optoelectronic module of claim 1 , wherein the sidewalls are composed of a UV or thermally-cured polymer material containing a non-transparent filler material.

5. The optoelectronic module of claim 1 , further including a baffle laterally surrounding the passive optical element, wherein the baffle is composed of the same non-transparent material as the sidewalls.

Assignees

• Ams Sensors Singapore Pte Ltd

Inventors

• Gubser Simon
• Cesana Mario
• Rossi Markus
• Rudmann Hartmut

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title