Interposer and electronic device

Patent metadata

Field	Value
Publication number	US-11145586-B2
Application number	US-202016861731-A
Country	US
Kind code	B2
Filing date	Apr 29, 2020
Priority date	Nov 1, 2017
Publication date	Oct 12, 2021
Grant date	Oct 12, 2021

Abstract

An interposer includes a stacked body including insulating base material layers that are stacked on one another, first and second electrodes, a conductor pattern, and an interlayer connection conductor. The stacked body includes a first mounting surface including a first electrode, and a second mounting surface facing the first mounting surface and including a second electrode. The first electrode is electrically connected to the second electrode through the conductor pattern and the interlayer connection conductor. A length of an electrical path including conductor patterns connecting the first electrode and the second electrode is larger than a total length of the interlayer connection conductor in a stacking direction.

First claim

What is claimed is:

1. An interposer disposed between a first element and a second element and electrically connecting the first element and the second element, the interposer comprising:
a stacked body including a plurality of insulating base material layers stacked on one another, being partially bent, and including a first mounting surface and a second mounting surface that face each other;
a plurality of conductor patterns in the stacked body and extending in a first direction perpendicular or substantially perpendicular to the first mounting surface and the second mounting surface;
an interlayer connection conductor in the stacked body, extending in a second direction parallel or substantially parallel to the first mounting surface and the second mounting surface, and connecting the plurality of conductor patterns;
a first electrode on the first mounting surface; and
a second electrode on the second mounting surface and electrically connected to the first electrode through the plurality of conductor patterns and the interlayer connection conductor; wherein
the first mounting surface and the second mounting surface are parallel or substantially parallel to a stacking direction in which the plurality of insulating base material layers are stacked; and
a length between the first mounting surface and the second mounting surface in the first direction is larger than a total length of the interlayer connection conductor in the second direction.

2. The interposer according to claim 1 , wherein the plurality of conductor patterns and the interlayer connection conductor are bonded by solid state diffusion bonding.

3. The interposer according to claim 1 , wherein the interlayer connection conductor is plated metal.

4. The interposer according to claim 1 , wherein
the plurality of insulating base material layers are made of a resin as a main material; and
the interlayer connection conductor includes a resin material.

5. The interposer according to claim 1 , wherein
the plurality of insulating base material layers are made of a resin as a main material;
the interlayer connection conductor includes a plurality of interlayer connection conductors each of which is provided on a different insulating base material layer; and
the plurality of interlayer connection conductors do not overlap with each other, when viewed in the second direction.

6. The interposer according to claim 1 , further comprising:
a planar conductor provided in the stacked body; and
the plurality of conductor patterns are at least partially overlapped with the planar conductor, when viewed in the second direction.

7. The interposer according to claim 6 , wherein
the planar conductor includes a plurality of planar conductors; and
the plurality of planar conductors interpose the plurality of conductor patterns or the interlayer connection conductor in the second direction.

8. The interposer according to claim 1 , wherein the plurality of insulating base material layers are made of a thermoplastic resin.

9. An interposer disposed between a first element and a second element and electrically connecting the first element and the second element, the interposer comprising:
a stacked body including a plurality of insulating base material layers stacked on one another, being partially bent, and including a first mounting surface and a second mounting surface that are parallel or substantially parallel to each other;
a plurality of conductor patterns in the stacked body;
an interlayer connection conductor in the stacked body;
a first electrode on the first mounting surface; and
a second electrode on the second mounting surface and electrically connected to the first electrode through the plurality of conductor patterns and the interlayer connection conductor; wherein
the stacked body includes an upright portion in which a stacking direction in which the plurality of insulating base material layers are stacked is parallel or substantially parallel to the first mounting surface and the second mounting surface;
in the upright portion, the plurality of conductor patterns extend in a first direction perpendicular or substantially perpendicular to the first mounting surface and the second mounting surface;
in the upright portion, the interlayer connection conductor extends in a second direction parallel or substantially parallel to the first mounting surface and the second mounting surface, and connects the plurality of conductor patterns; and
in the upright portion, a length in the first direction is larger than a total length of the interlayer connection conductor in the second direction.

10. The interposer according to claim 9 , wherein either one of the first mounting surface and the second mounting surface is an end surface of the stacked body parallel or substantially parallel to the stacking direction.

11. The interposer according to claim 9 , wherein the plurality of conductor patterns and the interlayer connection conductor are solid state diffusion bonded.

12. The interposer according to claim 9 , wherein the interlayer connection conductor is plated metal.

13. The interposer according to claim 9 , wherein
the plurality of insulating base material layers are made of a resin as a main material; and
the interlayer connection conductor includes a resin material.

14. The interposer according to claim 9 , wherein
the plurality of insulating base material layers are made of a resin as a main material;
the interlayer connection conductor includes a plurality of interlayer connection conductors each of which is provided on a different insulating base material layer; and
the plurality of interlayer connection conductors do not overlap with each other, when viewed in the second direction.

15. The interposer according to claim 9 , further comprising:
a planar conductor provided in the stacked body; and
the plurality of conductor patterns are at least partially overlapped with the planar conductor, when viewed in the second direction.

16. The interposer according to claim 15 , wherein
the planar conductor includes a plurality of planar conductors; and
the plurality of planar conductors interpose the plurality of conductor patterns or the interlayer connection conductor in the second direction.

17. The interposer according to claim 9 , wherein the plurality of insulating base material layers are made of a thermoplastic resin.

18. An electronic device comprising:
a first element;
a second element; and
an interposer disposed between the first element and the second element and electrically connecting the first element and the second element, the interposer comprising:
a stacked body including a plurality of insulating base material layers stacked on one another, being partially bent, and including a first mounting surface and a second mounting surface that face each other;
a plurality of conductor patterns in the stacked body and extending in a first direction perpendicular or substantially perpendicular to the first mounting surface and the second mounting surface;
an interlayer connection conductor in the stacked body, extending in a second direction parallel or substantially parallel to the first mounting surface and the second mounting surface, and connecting the plurality of conductor patterns;
a first electrode on the first mounting surface; and
a second electrode on the second mounting surface and electrically connected to the first electrode through the plurality of conductor patterns and the interlayer connection conductor; wherein
the first mount

Assignees

• Murata Manufacturing Co

Inventors

• Iida Kanto
• Koyama Hiromasa

Classifications

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title