Heat transfer system and method incorporating tapered flow field

Patent metadata

Field	Value
Publication number	US-11143466-B2
Application number	US-201816018927-A
Country	US
Kind code	B2
Filing date	Jun 26, 2018
Priority date	Mar 14, 2013
Publication date	Oct 12, 2021
Grant date	Oct 12, 2021

Abstract

A heat transfer system including a fluid inlet; a fluid outlet; and a substrate in fluid communication with the fluid inlet and fluid outlet, the substrate including a heat exchange region having a heat transfer surface and a flow field adjacent the heat transfer surface, the flow field including a fluid flow area including an open region at the inlet, a heat transfer region in thermal communication with the heat exchange region, and a taper of the flow field cross-sectional area in the flow direction, wherein the flow field heat transfer region includes a plurality of spaced apart open enhancement features from 1 micron to 3 mm in size, and method for enhancing the heat transfer performance of an apparatus is disclosed.

First claim

What is claimed is:

1. A flow boiling heat transfer system comprising:
a fluid inlet;
a fluid outlet;
a substrate having a fluid contacting side and a heat flux contacting side, through which heat is transferred across from the heat flux contacting side to the fluid contacting side;
a plurality of enhancement features from about 1 micron to about 3 mm in height on a surface of the fluid contacting side of the substrate;
a heat transfer region comprising the surface of the fluid contacting side of the substrate and the plurality of enhancement features;
and
a cover enclosing a mixed flow field,
wherein the mixed flow field comprises an open region throughout the mixed flow field and the heat transfer region, the open region extending the entire length of the heat transfer region from the fluid inlet to the fluid outlet and bounded by the heat transfer region and the cover,
and wherein a flow field cross-sectional area increases in a fluid flow direction by increasing the height of the open region in a direction normal to the substrate which reduces the acceleration pressure drop as well as total pressure drop and enhances critical heat flux and heat transfer coefficient during boiling of a fluid flowing through the mixed flow field.

2. The system of claim 1 , further comprising a fluid source in communication with the fluid inlet.

3. The system of claim 1 , wherein the plurality of enhancement features comprise at least one of micro fins and microchannels.

4. The system of claim 1 , wherein the plurality of enhancement features is comprised of a plurality of open channels.

5. The system of claim 1 , wherein the flow field cross-sectional area comprises a ratio of the maximum fluid flow cross-sectional area to the minimum fluid flow field cross-sectional area in a range of from 1.0001 to 1000.

6. The system of claim 5 , wherein the range is from 1.001 to 100.

Assignees

• Kandlikar Satish G
• Rochester Institute Tech

Inventors

• Kandlikar Satish G

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• F28F3/02

  Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) · CPC title

• F28D2021/0028

  for cooling heat generating elements, e.g. for cooling electronic components or electric devices · CPC title