Silver electroplating compositions and methods for electroplating rough matt silver
US-2024003037-A1 · Jan 4, 2024 · US
US11142839B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11142839-B2 |
| Application number | US-201916659818-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 22, 2019 |
| Priority date | Jan 30, 2015 |
| Publication date | Oct 12, 2021 |
| Grant date | Oct 12, 2021 |
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A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm 2 in a silver plating solution so as to satisfy (32.6x−300)≤y≤(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g·A/L·dm 2 ) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.
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The invention claimed is: 1. A method for producing a silver-plated product, the method comprising the steps of: preparing a silver plating solution which contains 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium; and forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm 2 in the silver plating solution so as to satisfy (32.6x−300)≤y≤(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and the current density is y (g·A/L·dm 2 ) and that the liquid temperature of the silver plating solution is x (° C.). 2. A method for producing a silver-plated product as set forth in claim 1 , wherein said silver plating solution is an aqueous solution containing silver potassium cyanide, potassium cyanide and potassium selenocyanate. 3. A method for producing a silver-plated product as set forth in claim 1 , wherein said base material is made of copper or a copper alloy. 4. A method for producing a silver-plated product as set forth in claim 1 , wherein an underlying layer of nickel is formed between said base material and said surface layer.
Electroplating characterised by the article coated · CPC title
by plating · CPC title
characterised by the form or material of the contacting members (H01R4/01 takes precedence) · CPC title
characterised by the material, e.g. plating, or coating materials · CPC title
Ag-base component · CPC title
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