Electrical arrangements for sensor assemblies in electromagnetic navigation systems

Patent metadata

Field	Value
Publication number	US-11141567-B2
Application number	US-201916248352-A
Country	US
Kind code	B2
Filing date	Jan 15, 2019
Priority date	Jan 16, 2018
Publication date	Oct 12, 2021
Grant date	Oct 12, 2021

Abstract

A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.

First claim

We claim:

1. A system comprising:
a sensor assembly including:
a multilayer circuit including a proximal section, a distal section, and a longitudinal axis,
the proximal section including a plurality of electrical pads and being at least partially folded,
a first magnetic field sensor coupled to the multilayer circuit at the distal section and having a primary sensing direction aligned with the longitudinal axis, and
a second magnetic field sensor coupled to the multilayer circuit at the distal section and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis,
a housing surrounding the multilayer circuit, the first magnetic field sensor, and the second magnetic field sensor,
the housing is cylinder shaped,
wherein the proximal section includes a first leg portion, a second leg portion,
and a bend portion positioned between the first leg portion and the second leg portion,
wherein a first subset of the plurality of electrical pads is positioned on the first leg portion,
and wherein a second subset of the plurality of electrical pads is positioned on the second leg portion.

2. The system of claim 1 , wherein the multilayer circuit includes a flexible substrate layer, wherein a first subset of the plurality of electrical pads is positioned on a first side of the flexible substrate layer, and wherein a second subset of the plurality of electrical pads is positioned on a second side of the flexible substrate layer opposite the first side.

3. The system of claim 1 , wherein the proximal section of the multilayer circuit is c-shaped.

4. The system of claim 1 , wherein the proximal section of the multilayer circuit includes a flexible substrate only partially covered by a mask layer such that a portion of the flexible substrate layer is exposed.

5. The system of claim 1 , wherein the multilayer circuit includes six to nine electrical pads at the proximal section.

6. The system of claim 5 , further comprising:
a plurality of electrical leads, each electrically coupled to one of the plurality of electrical pads.

7. The system of claim 1 , wherein the housing includes four quadrants of equal size, wherein at least one electrical lead is positioned within each of the four quadrants.

8. The system of claim 1 , wherein the housing has a cross-section area of 0.096-0.79 mm 2 .

9. The system of claim 1 , wherein the housing comprises epoxy.

10. The system of claim 1 , wherein the housing comprises an outer shell and is at least partially filled with epoxy.

11. The system of claim 1 , further comprising:
a third magnetic field sensor coupled to the multilayer circuit at the distal section and oriented with respect to the first magnetic field sensor such that the third magnetic field sensor has a primary sensing direction orthogonal to the longitudinal axis.

12. The system of claim 1 , wherein the first magnetic field sensor or the second magnetic field sensor is a multi-axis sensor and includes a second primary sensing direction.

13. The system of claim 1 , further comprising:
a medical device, wherein the sensor assembly is positioned within the medical device.

Assignees

• Boston Scient Scimed Inc

Inventors

• Meyer Steven J
• Blood James E
• Chizek David A
• Hein Matthew
• Foster Daniel J

Classifications

• H05K2201/056

  Folded around rigid support or component · CPC title

• H05K2201/10151

  Sensor · CPC title

• A61M2025/0166

  Sensors, electrodes or the like for guiding the catheter to a target zone, e.g. image guided or magnetically guided · CPC title

• A61B2562/164

  the sensor is mounted in or on a conformable substrate or carrier · CPC title

• A61B2562/043

  in a linear array · CPC title