Thick-film resistive element paste and use of thick-film resistive element paste in resistor

Patent metadata

Field	Value
Publication number	US-11136257-B2
Application number	US-201816640441-A
Country	US
Kind code	B2
Filing date	Aug 22, 2018
Priority date	Aug 31, 2017
Publication date	Oct 5, 2021
Grant date	Oct 5, 2021

Abstract

This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.

First claim

The invention claimed is:

1. A thick-film resistor comprising:
an insulating substrate;
a thick-film resistive element film formed on the insulating substrate;
a surface electrode; and
an end-surface electrode;
wherein the thick-film resistive element film is the product of sintering of a resistive element paste consisting of: an electrically conductive metal powder consisting of a copper powder and a manganese powder; a glass powder; and an organic vehicle; and
wherein the glass powder contains barium oxide, or barium oxide and calcium oxide, as a principal component.

2. The thick film resistor according to claim 1 , wherein the copper powder is composed of a mixture of two or more kinds of copper powder, the two or more kinds each having a different average grain size;
wherein the two or more kinds include a copper powder (A) with a minimum average grain size and a copper powder (B) with a maximum average grain size; and
wherein the copper powder has a grain size ratio satisfying (A)/(B)≥0.4.

3. The resistive element paste according to claim 1 , wherein a total of the electrically conductive metal powder corresponds to 100 wt %, the copper powder is present in 80 to 90 wt %, and the manganese powder is present in 10 to 20 wt %; and
wherein the copper powder includes not more than 40 wt % of copper powder with an average grain size of 1 to 5 μm, and not less than 50 wt % of copper powder with an average grain size of 0.5 to 2 μm.

4. The thick-film resistor according to claim 1 , wherein the copper powder is composed of a mixture of two or more kinds of copper powder having different grain shapes; and wherein the copper powder includes a spherical copper powder and a flake-like copper powder.

Assignees

• Koa Corp

Inventors

• Iguchi Natsuki
• Iguchi Yuya
• Urano Koichi

Classifications

• H10D86/85

  characterised by only passive components · CPC title

• C03C8/02

  Frit compositions, i.e. in a powdered or comminuted form · CPC title

• H01B1/026 Primary

  Alloys based on copper · CPC title

• H05K1/167

  incorporating printed resistors · CPC title

• H05K1/095

  for polymer thick films, i.e. having a permanent organic polymeric binder · CPC title