Circuit board assemblies for electronic devices

Patent metadata

Field	Value
Publication number	US-11134591-B2
Application number	US-201916723237-A
Country	US
Kind code	B2
Filing date	Dec 20, 2019
Priority date	Dec 20, 2019
Publication date	Sep 28, 2021
Grant date	Sep 28, 2021

Abstract

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

First claim

The invention claimed is:

1. A circuit board assembly comprising:
a circuit board having a first surface and a second surface opposite the first surface;
a heat sink carrier disposed on the first surface of the circuit board, the heat sink carrier comprising:
a base positioned to contact the first surface of the circuit board, the base including two opposite edges; and
at least one clamp portion comprising two resilient arms, each resilient arm located at a different one of the opposite edges of the base to receive a heat sink;
wherein the base is positioned between the two resilient arms;

wherein the heat sink is positioned in the base of the heat sink carrier between the two resilient arms to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier; and
wherein the one or more electronic devices are disposed on the second surface of the circuit board opposite the heat sink carrier.

2. The circuit board assembly of claim 1 , wherein the heat sink is sized and shaped to frictionally engage the at least one clamp portion of the heat sink carrier.

3. The circuit board assembly of claim 1 , wherein the at least one clamp portion is sized and shaped to apply a clamping retention force on the heat sink to retain the heat sink in the at least one clamp portion.

4. The circuit board assembly of claim 1 , wherein:
the two resilient arms apply a clamping force on the heat sink; and
a normal force of the clamping force applies a force toward a mating surface between the base of the heat sink carrier and the heat sink.

5. The circuit board assembly of claim 1 , wherein each resilient arm extends at an angle of less than ninety degrees from the base of the heat sink carrier.

6. The circuit board assembly of claim 5 , wherein the heat sink comprises at least two surfaces disposed at an angle different than the angle of the two resilient arms of the heat sink carrier, for removably coupling the heat sink to the two resilient arms of the heat sink carrier.

7. The circuit board assembly of claim 6 , wherein:
the heat sink comprises a body and a coupling member extending from the body;
the coupling member includes the at least two surfaces disposed at the angle different than the angle of the two resilient arms of the heat sink carrier; and
the coupling member is positioned between the two resilient arms of the heat sink.

8. The circuit board assembly of claim 1 , further comprising a thermal interface material positioned between the heat sink carrier and the heat sink.

9. The circuit board assembly of claim 1 , wherein the heat sink carrier comprises beryllium copper.

10. The circuit board assembly of claim 1 , wherein the heat sink comprises aluminum.

11. The circuit board assembly of claim 1 , wherein the heat sink carrier is disposed on the first surface of the circuit board via a surface mount coupling.

12. The circuit board assembly of claim 11 , wherein the heat sink carrier is soldered to the first surface of the circuit board.

13. The circuit board assembly of claim 1 , wherein the heat sink carrier is a first heat sink carrier and the heat sink is a first heat sink, the circuit board assembly further comprising:
a second heat sink carrier disposed on the first surface of the circuit board, the second heat sink carrier including at least one clamp portion; and
a second heat sink, the second heat sink positioned in the at least one clamp portion of the second heat sink carrier to transfer heat from the one or more electronic devices to the second heat sink via the second heat sink carrier.

14. The circuit board assembly of claim 13 , wherein a size of the second heat sink is different than a size of the first heat sink.

15. The circuit board assembly of claim 1 , wherein:
the heat sink comprises a base and one or more fin members extending perpendicular to the base to dissipate heat from the heat sink; and
the heat sink carrier does not include any fin members extending from a base of the heat sink carrier to dissipate heat from the heat sink carrier.

16. The circuit board assembly of claim 1 , wherein the heat sink is coupled to the heat sink carrier without any fasteners or adhesives.

17. A power supply including:
the circuit board assembly of claim 1 ; and
a transformer having a primary winding and a secondary winding, wherein:
each of the one or more electronic devices comprises a field-effect transistor (FET) coupled with the primary winding or the secondary winding.

18. A circuit board assembly comprising:
a circuit board having a first surface and a second surface opposite the first surface;
a heat sink carrier disposed on the first surface of the circuit board, the heat sink carrier including a base portion and two resilient arms, the base portion positioned to contact the first surface of the circuit board, the base portion including two opposite edges, and the two resilient arms each located at a different one of the opposite edges, wherein the base portion is positioned between the two resilient arms;
and a heat sink, the heat sink having a surface disposed in the base portion of the heat sink carrier between the two resilient arms without any fasteners or adhesives, to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier; and
wherein the one or more electronic devices are disposed on the second surface of the circuit board opposite the heat sink carrier.

19. The circuit board assembly of claim 18 , further comprising a thermal interface material positioned between the heat sink carrier and the heat sink.

Assignees

• Astec Int Ltd

Inventors

• Chen Yu-Wei
• Chen Cheng-Sheng

Classifications

• H10W40/641

  Snap-on arrangements, e.g. clips · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H05K2201/10606

  Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB] · CPC title

• H05K2201/10393

  Clamping a component by an element or a set of elements · CPC title

• H05K2201/0311

  Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact · CPC title