Light emitting device package and method of manufacturing light emitting device package

Patent metadata

Field	Value
Publication number	US-11133443-B2
Application number	US-201916507183-A
Country	US
Kind code	B2
Filing date	Jul 10, 2019
Priority date	Jan 29, 2019
Publication date	Sep 28, 2021
Grant date	Sep 28, 2021

Abstract

A light emitting device package includes a mounting substrate including first and second lower electrode portions separated by a first groove, first and second upper electrode portions separated by a second groove connected to the first groove and disposed on the first and second lower electrode portions respectively, and an insulation support member filling the first groove, a light emitting device mounted on the first and second upper electrode portions of the mounting substrate, a double phosphor film covering an upper surface of the light emitting device, including a phosphor layer and a barrier layer sequentially stacked on each other, and having a thickness of 200 μm or less, and a sealing member on the mounting substrate covering the light emitting device and the double phosphor film.

First claim

What is claimed is:

1. A method of manufacturing a light emitting device package, the method comprising:
providing a metal substrate having a first surface and a second surface opposite to each other;
etching the first surface of the metal substrate to form a first lower electrode portion and a second lower electrode portion separated by a first groove;
forming an insulation support member filling the first groove;
etching the second surface of the metal substrate to form a first upper electrode portion and a second upper electrode portion on the first lower electrode portion and the second lower electrode portion respectively, the first upper electrode portion and the second upper electrode portion being separated by a second groove connected to the first groove;
stacking a light emitting device on a double phosphor film having a barrier layer and a phosphor layer to form a stacked structure;
arranging the stacked structure on the metal substrate such that the light emitting device is mounted on the first upper electrode portion and the second upper electrode portion; and
forming a sealing member on the insulation support member and the first upper electrode portion and the second upper electrode portion to cover the light emitting device and the double phosphor film.

2. The method of claim 1 , wherein forming the stacked structure comprises:
sequentially stacking the barrier layer and the phosphor layer on a base film to form the double phosphor film having a thickness of about 200 μm or less;
adhering a plurality of the light emitting devices on the phosphor layer; and
dicing the barrier layer and the phosphor layer to form a plurality of the stacked structures.

3. The method of claim 1 , wherein when viewed in plan view, a combined area occupied by the first upper electrode portion and the second upper electrode portion or by the first lower electrode portion and the second lower electrode portion is 70% or more of a whole area of the light emitting device package.

4. The method of claim 1 , wherein the phosphor layer includes KSF phosphor having a particle size of about 13 μm to about 22 μm.

5. The method of claim 1 , wherein a first thickness of the phosphor layer is greater than a second thickness of the barrier layer.

6. The method of claim 1 , wherein arranging the stacked structure on the metal substrate comprises mounting the light emitting device on the first upper electrode portion and the second upper electrode portion in a flip chip bonding manner.

7. The method of claim 1 , further comprising:
forming an electroplating layer on surfaces of the first upper electrode portion and the second upper electrode portion.

8. The method of claim 1 , wherein the insulation support member covers side surfaces of the first lower electrode portion and the second lower electrode portion, and exposes the first upper electrode portion and the second upper electrode portion.

9. The method of claim 1 , wherein etching the second surface of the metal substrate comprising forming recesses in upper surfaces of the first upper electrode portion and the second upper electrode portion adjacent respectively to regions where connection members for electrical connection with the light emitting device are bonded.

10. The method of claim 1 , further comprising:
forming a second insulation support member filling the second groove, after etching the second surface of the metal substrate.

11. A method of manufacturing a light emitting device package, the method comprising:
forming a mounting substrate by forming a first lower electrode portion and a second lower electrode portion separated by a first groove and an insulation support member filling the first groove, and forming a first upper electrode portion and a second upper electrode portion separated by a second groove connected to the first groove and disposed on the first lower electrode portion and the second lower electrode portion respectively;
stacking a light emitting device on a double phosphor film having a barrier layer and a phosphor layer to form a stacked structure;
arranging the stacked structure on the mounting substrate such that the light emitting device is mounted on the first upper electrode portion and the second upper electrode portion; and
forming a sealing member on the insulation support member and the first upper electrode portion and the second upper electrode portion to cover the light emitting device and the double phosphor film.

12. A method of manufacturing a light emitting device package, the method comprising:
forming a mounting substrate including a first lower electrode portion and a second lower electrode portion separated by a first groove, a first upper electrode portion and a second upper electrode portion separated by a second groove connected to the first groove and disposed on the first lower electrode portion and the second lower electrode portion respectively, and an insulation support member filling the first groove;
stacking a light emitting device on a double phosphor film having a barrier layer and a phosphor layer to form a stacked structure;
arranging the stacked structure on the mounting substrate such that the light emitting device is mounted on the first upper electrode portion and the second upper electrode portion; and
forming a sealing member on the insulation support member and the first upper electrode portion and the second upper electrode portion to cover the light emitting device and the double phosphor film,
wherein forming the stacked structure comprises;
sequentially stacking the barrier layer and the phosphor layer on a base film to form the double phosphor film having a thickness of about 200 μm or less;
adhering a plurality of the light emitting devices on the phosphor layer; and
dicing the barrier layer and the phosphor layer to form a plurality of the stacked structures.

13. The method of claim 11 , wherein when viewed in plan view, a combined area occupied by the first upper electrode portion and the second upper electrode portion or by the first lower electrode portion and the second lower electrode portion is 70% or more of a whole area of the mounting substrate.

14. The method of claim 11 , wherein the phosphor layer includes KSF phosphor having a particle size of about 13 μm to about 22 μm.

15. The method of claim 11 , wherein a first thickness of the phosphor layer is greater than a second thickness of the barrier layer.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kang Chi-Goo
• Kim Young-Kyung
• Park Young-Ho
• Park Jong-Won
• LIM Seog-ho

Classifications

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/036

  of packages · CPC title

• H10H20/858

  Means for heat extraction or cooling · CPC title

• H10H20/852

  Encapsulations · CPC title

• H10H20/831

  characterised by their shape · CPC title