Seating assembly cover
US-10773619-B1 · Sep 15, 2020 · US
Vehicle seat back and method of manufacturing the same
US11130430B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11130430-B2 |
| Application number | US-201916526022-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 30, 2019 |
| Priority date | Nov 9, 2018 |
| Publication date | Sep 28, 2021 |
| Grant date | Sep 28, 2021 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A vehicle seat back may include an integrated suspension structure including a suspension wire and suspension mounting guides coupled to both sides of the suspension wire; and a seat back pad foamed for integrating with the integrated suspension structure in a state in which the integrated suspension structure is inserted into a mold for seat back pad formation.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a vehicle seat back, the method comprising: providing an integrated suspension structure including a suspension wire and suspension mounting guides coupled to a first portion and a second portion of the suspension wire; and foaming a seat back pad after the integrated suspension structure is inserted into a mold for seat back pad foaming such that the integrated suspension structure is integrated with the seat back pad, wherein, in the providing the integrated suspension structure, each of the suspension mounting guides has a support groove for insertion of a seat back frame, and hook fastening holes for insertion of hook wires of the suspension wire into the hook fastening holes, and a side airbag guide is formed to protrude integrally from one surface of at least one of the suspension mounting guides opposite to a position where the support groove is formed. 2. The method of claim 1 , wherein the foaming a seat back pad includes: providing the mold including a first mold piece, a second mold piece, and a third mold piece for the seat back pad foaming; inserting the integrated suspension structure into a cavity defined in the first mold piece; placing the second mold piece for securing a back profile of the seat back pad on the integrated suspension structure; and injecting a seat back pad foam material into the mold to foam the seat back pad after clamping the third mold piece to the first mold piece. 3. The method of claim 2 , wherein, in the providing an integrated suspension structure, the suspension wire includes: a plurality of horizontal wires; a plurality of vertical wires connected perpendicular to the plurality of horizontal wires; and a plurality of hook wires extending obliquely forward from distal end portions of the horizontal wires. 4. The method of claim 2 , wherein the integrated suspension structure is embedded in the seat back pad after the foaming of the seat back pad. 5. The method of claim 4 , further including inserting a side plate of the seat back frame into the support groove of the suspension mounting guides after the foaming of the seat back pad.
Assignees
Inventors
Classifications
Moulds · CPC title
Reducing production costs, e.g. by redesign · CPC title
attached to the backrest (B60N2/504 takes precedence) · CPC title
Leaf- or flexion springs · CPC title
Seat frames · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11130430B2 cover?
- A vehicle seat back may include an integrated suspension structure including a suspension wire and suspension mounting guides coupled to both sides of the suspension wire; and a seat back pad foamed for integrating with the integrated suspension structure in a state in which the integrated suspension structure is inserted into a mold for seat back pad formation.
- Who is the assignee on this patent?
- Hyundai Motor Co Ltd, Kia Motors Corp, Hyundai Transys Inc
- What technology area does this patent fall under?
- Primary CPC classification B60N2/7017. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Sep 28 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).