Socket assembly, light emitter module, and lighting system

Patent metadata

Field	Value
Publication number	US-11129276-B2
Application number	US-201816125947-A
Country	US
Kind code	B2
Filing date	Sep 10, 2018
Priority date	Mar 11, 2016
Publication date	Sep 21, 2021
Grant date	Sep 21, 2021

Abstract

A socket assembly comprises a base frame formed of a thermally conductive material holding a light emitting diode (LED) package to a support structure, a contact element electrically contacting the LED package, and an isolator PCB. The LED package includes an LED PCB having an LED mounted on the LED PCB. The base frame includes a base mounted to the support structure and mechanically engaging the LED PCB so that the LED package is attached to the support structure with a predetermined holding force. The contact element electrically connects the isolator PCB to the LED PCB. The isolator PCB supplies electrical power to the LED. The isolator PCB has a first surface and a second surface; the second surface is in heat transmitting contact with the base frame and the electronic component is disposed on the first surface of the isolator PCB and electrically connected to the LED.

First claim

What is claimed is:

1. A socket assembly, comprising:
a base frame formed of a thermally conductive material and holding a light emitting diode (LED) package to a support structure, the LED package including an LED printed circuit board (PCB) having an LED mounted on the LED PCB, the base frame includes a base configured to be mounted to the support structure and defining a compressible spring element that extends from the base and is configured to mechanically engage the LED PCB and apply a clamping force to the LED PCB for clamping the LED PCB to the base with a predetermined holding force independently from the support structure, the base defines a recess formed therethrough for receiving the LED package, the compressible spring element extending radially inwards from the base into the recess for exerting a clamping force on the LED PCB in a direction of and within a plane of the recess, the compressible spring element is formed integrally with the base and is defined by a portion of the base protruding into the recess and a slot formed through the base between the portion of the base protruding into the recess and a remaining portion of the base, and wherein, with the LED package received within the recess, the protruding portion of base defining the compressible spring element is compressed in a direction toward the slot for generating the clamping force on the LED PCB;
a contact element electrically contacting the LED package; and
an isolator PCB, the contact element is arranged on the isolator PCB and electrically connects the isolator PCB to the LED PCB, the isolator PCB configured to be electrically connected to an electrical power supply for supplying electrical power to the LED, the isolator PCB has a first surface and a second surface, the second surface is in heat transmitting contact with the base frame, an electronic component is disposed on the first surface of the isolator PCB and is electrically connected to the LED.

2. The socket assembly of claim 1 , wherein the electronic component includes an active driver unit for controlling power provided to the LED.

3. The socket assembly of claim 2 , wherein the electronic component includes a communication unit in communication with an external controller.

4. The socket assembly of claim 3 , wherein the electronic component is a dimming unit for controlling a luminous flux emitted by the LED.

5. The socket assembly of claim 4 , wherein the dimming unit is a pulse width modulator (PWM) unit.

6. The socket assembly of claim 5 , wherein the PWM unit has an input terminal and a control terminal, the PWM unit receiving a control signal at the input terminal and the output terminal is connected to the driver unit to provide the driver unit with an alternating PWM signal in response to the control signal.

7. The socket assembly of claim 1 , further comprising an electrical connector arranged on the isolator PCB and configured to be mated with a mating connector for supplying power to the LED.

8. The socket assembly of claim 1 , wherein the base frame has a spring finger that extends from the base and is configured to engage the LED PCB and apply a clamping force to the LED PCB in a direction of the support structure.

9. The socket assembly of claim 1 , further comprising a cover that includes an opening configured to expose the LED.

10. The socket assembly of claim 9 , wherein the cover receives an anvil of the base frame to mechanically connect the cover to the base frame.

11. The socket assembly of claim 1 , wherein the compressible spring element comprises a first compressible spring element and a second compressible spring element arranged on opposing sides of the recess and configured to apply opposing clamping forces on the LED PCB in respective directions along the plane of the recess.

12. A light emitter module, comprising:
a light emitting diode (LED) package including an LED printed circuit board (PCB) having an LED mounted on the LED PCB; and
a socket assembly including:
a base frame formed of a thermally conductive material for holding the light emitting diode package to a support structure, the base frame includes a base configured to be mounted to the support structure and configured to mechanically engage the LED PCB so that the LED package is attached to the support structure with a predetermined holding force;
a contact element electrically contacting the LED package; and
an isolator PCB, the contact element is arranged on the isolator PCB and electrically connects the isolator PCB to the LED PCB, the isolator PCB configured to be electrically connected to an electrical power supply for supplying electrical power to the LED, the isolator PCB has a first surface and a second surface, the second surface is in heat transmitting contact with the base frame, an active electronic component for controlling the operation of the LED is disposed on the first surface of the isolator PCB and is electrically connected to the LED, the electronic component including a dimming unit for controlling a luminous flux emitted by the LED and the dimming unit is a pulse width modulator (PWM) unit.

13. The light emitter module of claim 12 , further comprising a communication unit controlling the electronic component.

14. The light emitter module of claim 13 , wherein the communication unit is a wireless communication unit or a wirebound communication unit.

15. The light emitter module of claim 12 , wherein the electronic component includes a driver unit for controlling power to the LED and the PWM unit has an input terminal and a control terminal, the PWM unit receiving a control signal at the input terminal and the output terminal is connected to the driver unit to provide the driver unit with an alternating PWM signal in response to the control signal.

16. The light emitter module of claim 15 , wherein the communication unit outputs the control signal to the input terminal of the PWM unit.

17. A socket assembly, comprising:
a base frame configured to attach to a support structure and formed of a thermally conductive material, the base frame defining:
a recess for receiving a light emitting diode (LED) package; and
a first compressible spring element and a second compressible spring element extending from the base frame and into the recess for clamping the LED package to the base frame, the first and second compressible spring elements arranged on opposing sides of the recess and configured to apply opposing clamping forces on the LED PCB in respective directions along the plane of the recess to secure the LED package to the base frame independently from the support structure;
a contact element electrically contacting the LED package; and
an isolator PCB, the contact element is arranged on the isolator PCB and electrically connects the isolator PCB to the LED package, the isolator PCB configured to be electrically connected to an electrical power supply for supplying electrical power to the LED package, the isolator PCB has a first surface and a second surface, the second surface is in heat transmitting contact with the base frame, an active electronic component for controlling the LED package is disposed on the first surface of the isolator PCB.

Assignees

• Te Connectivity Nederland Bv
• Tyco Electronics Ltd Uk

Inventors

• Iedema Jeroen
• Leijnse Olaf
• Poorter Peter
• Catchpole Jonathan

Classifications

• H05K1/184

  associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes · CPC title

• H05K3/325

  by abutting or pinching; Mechanical auxiliary parts therefor · CPC title

• H05K1/141

  One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence) · CPC title

• F21V19/04

  with provision for changing light source, e.g. turret {(auxiliary devices for cleaning, placing, or removing incandescent lamps H01K3/32, fluorescent lamps H01J9/006)} · CPC title

• F21V23/006

  the substrate being distinct from the light source holder · CPC title