Carrier, Semiconductor Module and Fabrication Method Thereof
US-2016021780-A1 · Jan 21, 2016 · US
US11129270B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11129270-B2 |
| Application number | US-201816770246-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 23, 2018 |
| Priority date | Dec 21, 2017 |
| Publication date | Sep 21, 2021 |
| Grant date | Sep 21, 2021 |
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Official abstract text for this publication.
A control device for an electric machine includes a circuit board and a cooling body, which are joined together, wherein a heat-conducting paste is introduced between the circuit board and the cooling body at least for thermally connecting the circuit board to the cooling body. The circuit board and/or the cooling body has at least one recess, wherein the recess is formed in the lateral direction between a region to be protected and the introduced heat-conducting paste in such a way that, when the circuit board and the cooling body are joined, an excess portion of the laterally spreading heat-conducting paste can be received by the recess.
Opening claim text (preview).
The invention claimed is: 1. A control device for an electrical machine, the control device comprising: a circuit board; a cooling body joined to the circuit board; a heat-conducting paste introduced between the circuit board and the cooling body and configured to thermally connect the circuit board to the cooling body, wherein at least one of the circuit board and the cooling body defines at least one recess extending in a lateral direction between a region which is to be protected and the heat-conducting paste such that, when the circuit board and the cooling body are joined, an excess portion of the laterally spreading heat-conducting paste is accommodated in the at least one recess. 2. The control device as claimed in claim 1 , wherein the recess is configured as a slot. 3. The control device as claimed in claim 1 , wherein the at least one recess entirely encloses the region which is to be protected. 4. The control device as claimed in claim 1 , wherein at least part of an electrical contact-connection of an electronic component with the circuit board is arranged within the region which is to be protected. 5. The control device as claimed in claim 4 , wherein the electronic component is configured in a slug-down technical arrangement. 6. The control device as claimed in claim 1 , wherein at least one electronic component is arranged in the region which is to be protected. 7. The control device as claimed in claim 3 , wherein the at least one recess entirely encloses the region which is to be protected in the lateral direction. 8. The control device as claimed in claim 4 , wherein the at least part of the electrical contact-connection includes part of a push-through contact-connection. 9. The control device as claimed in claim 6 , wherein the at least one electronic component includes at least one of a sensor unit and a component which is covered by a coating.
Components thermally connected to metal substrates or heat-sinks by insert mounting · CPC title
Recess in conductor, e.g. in pad or in metallic substrate · CPC title
onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20) · CPC title
Lead-in-hole components · CPC title
Recesses or grooves in insulating substrate · CPC title
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