Substrate for sensing, a method of fabricating the substrate, and analyzing apparatus including the substrate

Patent metadata

Field	Value
Publication number	US-11125620-B2
Application number	US-201815989983-A
Country	US
Kind code	B2
Filing date	May 25, 2018
Priority date	May 25, 2017
Publication date	Sep 21, 2021
Grant date	Sep 21, 2021

Abstract

A substrate for sensing, a method of manufacturing the substrate, and an analyzing apparatus including the substrate are provided. The substrate for sensing includes: a support layer; a plurality of metal nanoparticle clusters arranged on the support layer; and a plurality of perforations arranged among the plurality of metal nanoparticle clusters. The plurality of metal nanoparticle clusters each comprise a plurality of metal nanoparticles stacked in a three-dimensional structure. Each of the plurality of perforations transmits incident light therethrough.

First claim

What is claimed is:

1. A substrate for sensing, comprising:
a support layer;
a seed layer on the support layer;
a plurality of metal nanoparticle clusters arranged on the seed layer, each of the plurality of metal nanoparticle clusters comprising a plurality of conductive metal nanoparticles, and the plurality of conductive metal nanoparticles being stacked in a three-dimensional structure; and
a plurality of perforations arranged at regular intervals among the plurality of metal nanoparticle clusters, wherein each of the plurality of perforations transmits incident light therethrough such that the light excites conductive metal nanoparticles between an upper part of each of the plurality of metal nanoparticle clusters and a lower part of each of the plurality of metal nanoparticle clusters while the light is transmitted along each of the plurality of perforations,
wherein the plurality of perforations are separated from each other, and
wherein a mean size of each perforation from among the plurality of perforations defined by a mean interval between adjacent ones of the plurality of metal nanoparticle clusters is 8 nm to 20 nm.

2. The substrate for sensing of claim 1 , wherein the support layer comprises a semiconductor wafer.

3. The substrate for sensing of claim 1 , wherein the plurality of conductive metal nanoparticles comprise at least one conductive metal selected from gold (Au), silver (Ag), copper (Cu), and aluminum (Al).

4. The substrate for sensing of claim 1 , wherein each of the plurality of metal nanoparticle clusters extends vertically from a surface of the seed layer.

5. The substrate for sensing of claim 4 , wherein a thickness of each of the plurality of metal nanoparticle clusters is 50 nm to 1 μm.

6. The substrate for sensing of claim 1 , wherein each of the plurality of perforations extend to a surface of the seed layer, such that each of the plurality of perforations transmits incident light to the surface of the seed layer.

7. The substrate for sensing of claim 1 , wherein a mean diameter of the plurality of conductive metal nanoparticles is 10 nm to 20 nm.

8. An analyzing apparatus comprising the substrate for sensing of claim 1 .

9. The substrate for sensing of claim 1 , wherein each perforation from among the plurality of perforations is positioned in a space remaining after a respective nanowire from among a plurality of nanowires has been dissolved during arrangement of the respective metal nanoparticle cluster.

Assignees

• Samsung Electronics Co Ltd
• California Inst Of Techn

Inventors

• Yang Daejong
• Cho Hyunjun
• Yoon Youngzoon
• Choo Hyuck

Classifications

• B81C2201/0104

  Chemical-mechanical polishing [CMP] · CPC title

• B81B2203/0361

  Tips, pillars · CPC title

• B81C1/00206 Primary

  Processes for functionalising a surface, e.g. provide the surface with specific mechanical, chemical or biological properties · CPC title

• B81B2207/056

  of static structures · CPC title

• B82Y15/00

  Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors · CPC title