Method for manufacturing ceramic electronic component

Patent metadata

Field	Value
Publication number	US-11120943-B2
Application number	US-201615133432-A
Country	US
Kind code	B2
Filing date	Apr 20, 2016
Priority date	Oct 25, 2013
Publication date	Sep 14, 2021
Grant date	Sep 14, 2021

Abstract

A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.

First claim

What is claimed is:

1. A method for manufacturing a ceramic electronic component comprising the steps of:
providing a ceramic electronic component including:
a ceramic body including first and second principal surfaces that extend in a length direction and a width direction, first and second side surfaces that extend in the length direction and a thickness direction, and first and second end surfaces that extend in the width direction and the thickness direction; and
an outer electrode arranged so as to extend from the first end surface of the ceramic body to the second principal surface of the ceramic body; wherein
the outer electrode includes:
a resin-containing electrode layer provided on the ceramic body and containing a conductive material and a resin; and
a plating layer provided on the resin-containing electrode layer, the plating layer including a Ni plating layer; wherein
when a thickness of the Ni plating layer is t1 and a distance by which a portion of the Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1; and
an end portion of the Ni plating layer extends beyond an end portion of the resin-containing electrode layer in the length direction on the second principal surface such that a length of the Ni plating layer in the length direction on the second principal surface is greater than a length of the resin-containing electrode layer in the length direction on the second principal surface; and

forming the Ni plating layer by using a Ni plating bath having a pH of about 4.4 or more.

2. The method according to claim 1 , wherein t2/t1 is greater than about 0.06.

3. The method according to claim 1 , wherein the outer electrode further includes a baked electrode layer disposed between the ceramic body and the resin-containing electrode layer.

4. The method according to claim 3 , wherein the baked electrode layer is baked at a temperature of about 700° C. to about 1000° C.

5. The method according to claim 1 , wherein the ceramic body is baked at a temperature of about 900° C. to about 1300° C.

6. The method according to claim 1 , wherein the resin-containing electrode layer includes a conductive resin paste that is subjected to a heat treatment at a temperature of about 150° C. to about 300° C.

7. The method according to claim 1 , further comprising the step of forming an Sn plating layer on the Ni plating layer.

Assignees

• Murata Manufacturing Co

Inventors

• Terashita Yosuke

Classifications

• C25D5/12

  at least one layer being of nickel or chromium · CPC title

• H01F41/02

  for manufacturing cores, coils, or magnets (H01F41/14 takes precedence; for dynamo-electric machines H02K15/00) · CPC title

• H01F17/0013

  with stacked layers · CPC title

• C25D5/625 Primary

  Discontinuous layers, e.g. microcracked layers · CPC title

• C25D5/56

  of plastics · CPC title