Structure-borne noise decoupling on sensors working with transmitter fields

Patent metadata

Field	Value
Publication number	US-11118908-B2
Application number	US-201515323845-A
Country	US
Kind code	B2
Filing date	Jun 25, 2015
Priority date	Jul 8, 2014
Publication date	Sep 14, 2021
Grant date	Sep 14, 2021

Abstract

A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.

First claim

The invention claimed is:

1. A sensor for sensing an acceleration, comprising:
a sensor circuit for sensing the acceleration and for outputting a sensor signal which is dependent on the acceleration,
a circuit carrier having a first region, the first region having a first side on which at least a first part of the sensor circuit is positioned, and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged,
a noise-resistance element embodied as a slit which is arranged between the first region and the second region and is configured to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface,
a mechanical decoupling element which encapsulates the first region of the circuit carrier and the sensor circuit, and which does not extend into the slit, and
a noise-decoupling film positioned in direct contact with a second side of the first region of the circuit carrier opposite the first side of the first region of the circuit carrier, wherein at least a second part of the sensor circuit is supported on and in direct contact with the noise-decoupling film, the second part of the sensor circuit comprising one or more measuring pickups of the sensor circuit, the second part of the sensor circuit accommodated within a recess in the first region of the circuit carrier, the recess separating and intervening between the second part of the sensor circuit and the first part of the sensor circuit.

2. The sensor as claimed in claim 1 , wherein the circuit carrier is embodied as a leadframe.

3. The sensor as claimed in claim 2 , wherein the slit is designed to run around the first region, and the second region is connected to the first region via at least one web.

4. The sensor as claimed in claim 1 , wherein the mechanical decoupling element comprises a globe top mass.

5. The sensor as claimed in claim 1 , wherein the first region of the circuit carrier is accommodated between the globe top mass and the noise-decoupling film.

6. The sensor as claimed in claim 1 , wherein an electrical reference potential is applied to at least one of the two mechanical interfaces.

7. The sensor as claimed in claim 1 , further comprising a protective mass which encloses the sensor circuit, the first region of the circuit carrier and at least part of the second region of the circuit carrier.

8. The sensor as claimed in claim 1 , wherein the recess is bounded on all lateral sides by the first region of the circuit carrier.

9. The sensor as claimed in claim 1 , wherein an entirety of the first part of the sensor circuit is supported by and in direct contact with the first side of the first region of the circuit carrier.

Assignees

• Continental Teves Ag & Co Ohg

Inventors

• Fischer Thomas
• Schillinger Jakob
• Huber Dietmar
• Günthner Stefan
• Biebricher Lothar
• Schulmeister Michael

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• G01D11/10 Primary

  Elements for damping the movement of parts · CPC title

• G01P1/003

  used for damping · CPC title

• B60W2520/14

  Yaw · CPC title