Composite interconnection conduits for HVAC systems

US11118795B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11118795-B2
Application numberUS-201916289102-A
CountryUS
Kind codeB2
Filing dateFeb 28, 2019
Priority dateFeb 8, 2019
Publication dateSep 14, 2021
Grant dateSep 14, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.

First claim

Opening claim text (preview).

The invention claimed is: 1. A heating, ventilation, and/or air conditioning (HVAC) packaged unit, comprising: a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component; a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component, wherein the first refrigerant circuit component and the second refrigerant circuit component are within a common refrigerant circuit that is disposed within a common support structure comprising an enclosure; and an interconnection conduit having a length formed from a first material, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length, wherein: the first end segment and the second end segment are each formed from a second material; the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component; the first end segment has a first inner diameter; the length has a second inner diameter that is less than the first inner diameter; and the interconnection conduit includes a stepped transition between the first inner diameter and the second inner diameter. 2. The HVAC packaged unit of claim 1 , wherein the first refrigerant circuit component is an evaporator, a condenser, an expansion device, or a compressor. 3. The HVAC packaged unit of claim 1 , wherein the first end segment has a first outer diameter, the length has a second outer diameter, and the second outer diameter is substantially equal to the first outer diameter. 4. The HVAC packaged unit of claim 1 , wherein the HVAC packaged unit is a rooftop unit. 5. The HVAC packaged unit of claim 1 , wherein a connection between the first end segment and the first end of the length includes a corrosion resistant treatment. 6. The HVAC packaged unit of claim 1 , comprising: a second interconnection conduit having a second length coupled between a third end segment and a fourth end segment; and a third interconnection conduit having a third length coupled between a fifth end segment and a sixth end segment, wherein the second length and the third length are each formed from the first material, wherein the third, fourth, fifth, and sixth end segments are each formed from the second material, and wherein the fourth end segment is coupled to the fifth end segment. 7. The HVAC packaged unit of claim 1 , wherein the first end segment is coupled to a first end joint of the first refrigerant circuit component, and the second end segment is coupled to a second end joint of the second refrigerant circuit component. 8. The HVAC packaged unit of claim 7 , wherein the first material is aluminum and the second material is copper, and wherein the first end joint and the second end joint are each formed from copper. 9. The HVAC packaged unit of claim 1 , wherein the interconnection conduit is a first interconnection conduit and the length is a first length, wherein the HVAC packaged unit comprises a second interconnection conduit having a second length formed from the first material, a third end segment coupled to a third end of the second length, and a fourth end segment coupled to a fourth end of the second length, wherein the third end segment and the fourth end segment are each formed from the second material, and wherein the second interconnection conduit extends between the second refrigerant circuit component and a third interconnection conduit. 10. The HVAC packaged unit of claim 9 , comprising the third interconnection conduit having a third length formed from the first material, a fifth end segment, a sixth end segment, and a bend formed between the fifth end segment and the sixth end segment, wherein the fifth end segment and the sixth end segment are each formed from the second material, the fifth end segment is coupled to the fourth end segment of the second interconnection conduit, and the sixth end segment is coupled to a third refrigerant circuit component.

Assignees

Inventors

Classifications

  • Heat exchangers · CPC title

  • characterised by the arrangement of refrigerant piping outside the heat exchanger within the unit casing · CPC title

  • F24F1/03Primary

    characterised by mounting arrangements · CPC title

  • taking account of the properties of the materials to be soldered · CPC title

  • Copper or alloys thereof · CPC title

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11118795B2 cover?
A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit c…
Who is the assignee on this patent?
Johnson Controls Tech Co
What technology area does this patent fall under?
Primary CPC classification F24F1/03. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Sep 14 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).