Oxazine compound, composition and cured product

Patent metadata

Field	Value
Publication number	US-11117872-B2
Application number	US-201615781818-A
Country	US
Kind code	B2
Filing date	Nov 24, 2016
Priority date	Dec 8, 2015
Publication date	Sep 14, 2021
Grant date	Sep 14, 2021

Abstract

The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having the layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.

First claim

The invention claimed is:

1. An oxazine compound comprising:
a structure which is represented by General Formula (1-1) or (1-2):

wherein, in Formulae (1-1) and (1-2), each n independently represents an integer of 2 to 4, each Y independently represents a structure represented by General Formula (2), X is any one of General Formulae (3), and each R 1 independently represents a group represented by Formula (4) or (5);

in Formula (2), a ring A represents a substituted or unsubstituted aromatic ring, and a 1 represents a bonding position to X in General Formula (1);

in Formula (3), Ar 1 to Ar 6 each independently represent a substituted or unsubstituted aryl group, Ar 7 represents a substituted or unsubstituted arylene group, n 2 represents an integer of 2 to 4, n 3 represents 1 or 2, Z 1 , Z 2 , and Z 3 each independently represent a single bond, a nitrogen atom, an oxygen atom, an alkylene group, an arylene group, a carbonyl group, an ester group, an amide group, an imino group, an azo group, a sulfide group, a sulfone group, and any one of groups obtained by combining two or more of these groups;

in Formula (4), V 1 , V 2 , and Q 1 each independently represent a single bond or a divalent linking group, R 2 represents a hydrogen atom, a hydrocarbon group, or a hydrocarbon group in which one or more hydrogen atoms contained in the hydrocarbon group are substituted with any one of a hydroxyl group, an alkoxy group, and a halogen atom, and a 2 represents a bonding point to General Formula (1); and

in Formula (5), n 4 represents an integer of 2 to 6, V 3 and V 4 each independently represent a single bond or a divalent linking group, Q 2 represents a linking group having a valence of n 4 +1, R 3 represents a hydrogen atom, a hydrocarbon group, or a hydrocarbon group in which one or more hydrogen atoms contained in the hydrocarbon group are substituted with any one of a hydroxyl group, an alkoxy group, and a halogen atom, and a 3 represents a bonding point to General Formula (1).

2. The oxazine compound according to claim 1 ,
wherein the ring A is a substituted or unsubstituted benzene ring or a substituted or unsubstituted naphthalene ring.

3. A composition comprising the oxazine compound according to claim 1 .

4. The composition according to claim 3 , further comprising a reactive compound.

5. The composition according to claim 3 , further comprising a filler.

6. The composition according to claim 3 , further comprising a fibrous substrate.

7. A cured product, which is obtained by curing the composition according to claim 3 .

8. A laminate comprising:
a base material; and
a layer of the cured product according to claim 7 .

9. A composition for a heat-resistant material, comprising the composition according to claim 3 .

10. A heat-resistant member comprising the cured product according to claim 7 .

11. A composition for an electronic material, comprising the composition according to claim 3 .

12. An electronic member comprising the cured product according to claim 7 .

13. A semiconductor sealing material comprising the composition according to claim 3 .

14. A prepreg comprising the composition containing a fibrous substrate according to claim 6 .

15. A circuit board further comprising the prepreg according to claim 14 and a copper foil layer.

16. The laminate according to claim 8 , which is a build-up film.

17. A build-up substrate comprising the build-up film according to claim 16 .

Assignees

• Dainippon Ink & Chemicals

Inventors

• Shimono Tomohiro
• Arita Kazuo
• Yamaguchi Junji
• Otsu Masato

Classifications

• H10W74/473

  containing a filler · CPC title

• H10W74/40

  characterised by their materials · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• C08J5/244

  using glass fibres · CPC title

• C08J5/243

  using carbon fibres · CPC title