Adapter for hot-melt adhesive dispenser and system including the same

US11117159B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11117159-B2
Application numberUS-202016792370-A
CountryUS
Kind codeB2
Filing dateFeb 17, 2020
Priority dateFeb 17, 2020
Publication dateSep 14, 2021
Grant dateSep 14, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An adapter is configured to be mounted onto or otherwise coupled to a hot-melt adhesive dispenser. The adapter may include a body defining at least a first inlet channel, a second inlet channel, and a feed channel. The first inlet channel is configured to receive a first adhesive. The second inlet channel is configured to receive a second adhesive. The feed channel is configured to direct at least one of the first adhesive or the second adhesive to the hot-melt adhesive dispenser.

First claim

Opening claim text (preview).

The invention claimed is: 1. An adapter for a hot-melt adhesive dispenser, comprising: a body defining a first inlet channel, a second inlet channel, and a feed channel, the first inlet channel configured to receive a first adhesive, the second inlet channel configured to receive a second adhesive, the feed channel configured to direct at least one of the first adhesive or the second adhesive to the hot-melt adhesive dispenser, the body including a base portion and a neck portion extending from the base portion, the neck portion defining the first inlet channel, the second inlet channel, and an initial segment of the feed channel, the base portion defining a remaining segment of the feed channel and a heating channel adjacent to the remaining segment of the feed channel. 2. The adapter of claim 1 , wherein the body is a monolithic structure. 3. The adapter of claim 1 , wherein the body is formed of a conductive material. 4. The adapter of claim 3 , wherein the conductive material is brass. 5. The adapter of claim 1 , wherein the body is configured to conductively heat the first inlet channel, the second inlet channel, and the feed channel such that the first adhesive, the second adhesive, or both remain in a fluidic state while being fed to the hot-melt adhesive dispenser. 6. The adapter of claim 1 , wherein the feed channel includes a first feed segment, a second feed segment, and a third feed segment. 7. The adapter of claim 6 , wherein the first feed segment of the feed channel is downstream from the first inlet channel and the second inlet channel. 8. The adapter of claim 6 , wherein the first feed segment of the feed channel is parallel to the third feed segment. 9. The adapter of claim 6 , wherein the second feed segment of the feed channel is between the first feed segment and the third feed segment. 10. The adapter of claim 6 , wherein the second feed segment of the feed channel is orthogonal to the first feed segment and the third feed segment. 11. The adapter of claim 6 , wherein the first feed segment of the feed channel has a length between 1.2 and 2.4 inches. 12. The adapter of claim 6 , wherein the first feed segment of the feed channel has a diameter between 0.1 and 0.2 inches. 13. The adapter of claim 6 , wherein the second feed segment of the feed channel has a length between 0.8 and 1.6 inches. 14. The adapter of claim 6 , wherein the second feed segment of the feed channel has a diameter between 0.1 and 0.2 inches. 15. The adapter of claim 6 , wherein the third feed segment of the feed channel has a length between 1.2 and 2.4 inches. 16. The adapter of claim 6 , wherein the third feed segment of the feed channel has a diameter between 0.1 and 0.2 inches. 17. The adapter of claim 1 , wherein the base portion and the neck portion of the body are integrally formed. 18. A hot-melt adhesive dispensing system, comprising: a hot-melt adhesive dispenser defining an adhesive inlet, an adhesive chamber, and an adhesive outlet, the hot-melt adhesive dispenser including a heater configured to heat the adhesive chamber; and an adapter connected to the hot-melt adhesive dispenser, the adapter including a body defining a first inlet channel, a second inlet channel, and a feed channel, the first inlet channel configured to receive a first adhesive, the second inlet channel configured to receive a second adhesive, the feed channel configured to direct at least one of the first adhesive or the second adhesive to the adhesive inlet of the hot-melt adhesive dispenser, the body including a base portion and a neck portion extending from the base portion, the neck portion defining the first inlet channel, the second inlet channel, and an initial segment of the feed channel, the base portion defining a remaining segment of the feed channel and a heating channel adjacent to the remaining segment of the feed channel. 19. A method of dispensing a hot-melt adhesive, comprising: mounting an adapter onto a hot-melt adhesive dispenser, the adapter including a body defining a first inlet channel, a second inlet channel, and a feed channel, the first inlet channel configured to receive a first adhesive, the second inlet channel configured to receive a second adhesive, the feed channel configured to direct at least one of the first adhesive or the second adhesive to the hot-melt adhesive dispenser, the body including a base portion and a neck portion extending from the base portion, the neck portion defining the first inlet channel, the second inlet channel, and an initial segment of the feed channel, the base portion defining a remaining segment of the feed channel and a heating channel adjacent to the remaining segment of the feed channel; supplying the first adhesive or the second adhesive to the hot-melt adhesive dispenser via the adapter; and conductively heating the adapter while the first adhesive or the second adhesive is being directed through the body to the hot-melt adhesive dispenser.

Assignees

Inventors

Classifications

  • with feed system for supplying material from an external source; Supply controls therefor (B05C17/02 takes precedence) · CPC title

  • provided with means to heat the material · CPC title

  • Means for supplying a selected one of a plurality of liquids or other fluent materials, or several in selected proportions, to the applying apparatus · CPC title

  • provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus · CPC title

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What does patent US11117159B2 cover?
An adapter is configured to be mounted onto or otherwise coupled to a hot-melt adhesive dispenser. The adapter may include a body defining at least a first inlet channel, a second inlet channel, and a feed channel. The first inlet channel is configured to receive a first adhesive. The second inlet channel is configured to receive a second adhesive. The feed channel is configured to direct at le…
Who is the assignee on this patent?
Altria Client Services Llc
What technology area does this patent fall under?
Primary CPC classification B05C11/1036. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 14 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).