Organic layer and method of manufacturing the same, directional heat source assembly, and display panel

Patent metadata

Field	Value
Publication number	US-11114618-B2
Application number	US-201916510843-A
Country	US
Kind code	B2
Filing date	Jul 12, 2019
Priority date	Nov 30, 2018
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

In one embodiment, there is provided a method of manufacturing an organic layer. The method includes: forming an organic material solution layer on a substrate; and heating, by a directional heat source assembly, at least a first portion of organic material solution of the organic material solution layer that is inside a to-be-treated area of the substrate, to increase an evaporation rate of the first portion of the organic material solution, whereby, reducing a thickness difference, due to different evaporation rates of the first portion of the organic material solution and a second portion of the organic material solution of the organic material solution layer that is outside the to-be-treated area of the substrate, of the organic layer that is cured from the organic material solution layer.

First claim

What is claimed is:

1. A method of manufacturing an organic layer, the method comprising:
forming an organic material solution layer on a substrate; and
heating, by a directional heat source assembly, at least a first portion of organic material solution of the organic material solution layer that is inside a pending area of the substrate and a second portion of the organic material solution of the organic material solution layer that is outside the pending area of the substrate, a heating efficiency of the directional heat source assembly to the first portion of the organic material solution being greater than a heating efficiency of the directional heat source assembly to the second portion of the organic material solution, to increase an evaporation rate of the first portion of the organic material solution,
whereby, a thickness difference of the organic layer that is cured from the organic material solution layer is reduced, due to different evaporation rates of the first portion of the organic material solution and the second portion of the organic material solution;
wherein the directional heat source assembly comprises a planar directional heat source configured to generate heat radiation, and a mask comprising a shielding part configured to shield the heat radiation from the planar directional heat source and at least an opening part having an adjustable size and configured to pass the heat radiation from the planar directional heat source therethrough; and
wherein the heating at least a first portion of organic material solution of the organic material solution layer further comprises:
aligning the mask with the substrate so that the opening part of the mask is aligned with the pending area of the substrate; and
heating, by the planar directional heat source, the first portion of the organic material solution of the organic material solution layer through the opening part of the mask.

2. The method of claim 1 , wherein:
the pending area comprises a central region and an edge region surrounding the central region; and
a heating efficiency of the directional heat source assembly to a third portion of the organic material solution in the central region is greater than a heating efficiency of the directional heat source assembly to a fourth portion of the organic material solution in the edge region.

3. The method of claim 1 , wherein:
forming the organic material solution layer on the substrate is performed in a manner that the organic material solution is applied by an inkjet printing method onto a preset area of the substrate so as to form the organic material solution layer, the pending area being a part of the preset area.

4. The method of claim 1 , wherein:
a size of the opening part and a heating efficiency of the planar directional heat source are adjustable in accordance with one or more of viscosity, hydrophilicity/hydrophobicity, crystallinity, or solid content of the organic material solution.

5. The method of claim 1 , further comprising:
prior to the heating at least a first portion of organic material solution of the organic material solution layer, determining a shape and a size of the pending area of the substrate.

6. The method of claim 5 , wherein the determining a shape and a size of the pending area of the substrate further comprises:
determining the shape and the size of the pending area by analyzing historical data of the organic layer formed at a same process conditions; or
determining the shape and the size of the pending area by simulating test data of the organic layer formed at a same process conditions.

7. The method of claim 1 , wherein:
the heating at least a first portion of organic material solution of the organic material solution layer is performed in a chamber filled with inactive gas.

8. The method of claim 1 , wherein:
the planar directional heat source comprises one of a microwave generator, an infrared generator, an ultraviolet generator, or a laser generator.

9. The method of claim 1 , wherein:
the organic material solution layer is an organic material solution layer for formation of an OLED pixel structure; and
the organic layer is an organic light emitting layer of the OLED pixel structure.

10. The method of claim 9 , wherein:
the organic light emitting layer comprises at least one of a light emitting material layer, a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer.

Assignees

• Hefei Xinsheng Optoelectronics Technology Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Ai Yu
• Xie Xuewu
• Kong Yubao
• Sun Shi
• Liu Hao
• Zhang Ameng
• Liu Bowen

Classifications

• H10K71/421

  using coherent electromagnetic radiation, e.g. laser annealing · CPC title

• H10K71/40

  Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title

• H10K50/17

  Carrier injection layers · CPC title

• H10K71/441

  in the presence of solvent vapors, e.g. solvent vapour annealing · CPC title

• H10K71/135 Primary

  using ink-jet printing · CPC title