Method of forming superconducting layers and traces

Patent metadata

Field	Value
Publication number	US-11114602-B2
Application number	US-202016842431-A
Country	US
Kind code	B2
Filing date	Apr 7, 2020
Priority date	Sep 26, 2017
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

Methods and structures corresponding to superconducting apparatus including superconducting layers and traces are provided. A method for forming a superconducting apparatus includes forming a first dielectric layer on a substrate by depositing a first dielectric material on the substrate and curing the first dielectric material at a first temperature. The method further includes forming a first superconducting layer comprising a first set of patterned superconducting traces on the first dielectric layer. The method further includes forming a second dielectric layer on the first superconducting layer by depositing a second dielectric material on the first superconducting layer and curing the second dielectric material at a second temperature, where the second temperature is lower than the first temperature. The method further includes forming a second superconducting layer comprising a second set of patterned superconducting traces on the second dielectric layer.

First claim

The invention claimed is:

1. A method comprising:
forming a first dielectric layer on a substrate by depositing a first dielectric material on the substrate and curing the first dielectric material at a first temperature;
forming a first superconducting layer comprising a first set of patterned superconducting traces on the first dielectric layer;
forming a second dielectric layer on the first superconducting layer by depositing a second dielectric material on the first superconducting layer and curing the second dielectric material at a second temperature, wherein the second temperature is lower than the first temperature; and
forming a second superconducting layer comprising a second set of patterned superconducting traces on the second dielectric layer, wherein each of the first superconducting layer and the second superconducting layer comprises a superconducting metal, and wherein each of the first temperature and the second temperature is selected to not adversely affect the superconducting metal by damaging the superconducting metal.

2. The method of claim 1 , wherein the second temperature is lower than the first temperature by at least 50 degrees Centigrade.

3. The method of claim 1 , wherein the depositing the first dielectric material on the substrate comprises spinning on a liquid polymer based dielectric on the substrate.

4. The method of claim 3 , wherein the depositing the second dielectric material on the substrate comprises spinning on a liquid polymer based dielectric on the first superconducting layer.

5. The method of claim 1 , wherein the forming the second superconducting layer further comprises depositing and patterning at least the superconducting metal to form the second set of the patterned superconducting traces and at least one interconnect structure for connecting at least one of the second set of the patterned superconducting traces with at least one of the first set of the patterned superconducting traces.

6. The method of claim 5 , wherein the superconducting metal comprises niobium.

7. The method of claim 1 , wherein each of the first set of the patterned superconducting traces and the second set of the patterned superconducting traces is formed using lithography.

8. The method of claim 1 , wherein each of the first dielectric material and the second dielectric material comprises a photo-imageable polyimide.

9. A method comprising:
forming a first dielectric layer on a substrate by depositing a first dielectric material on the substrate and curing the first dielectric material at a first temperature;
forming a first niobium layer comprising a first set of patterned niobium traces on the first dielectric layer;
forming a second dielectric layer on the first niobium layer by depositing a second dielectric material on the first niobium layer and curing the second dielectric material at a second temperature, wherein the second temperature is approximately equal to or lower than the first temperature by at least 25 degrees Centigrade; and
forming a second niobium layer comprising a second set of patterned niobium traces on the second dielectric layer, wherein each of the first temperature and the second temperature is selected to not adversely affect each of the first niobium layer and the second niobium layer by damaging niobium, and wherein each of the first temperature and the second temperature is selected to be below 275 degrees Centigrade.

10. The method of claim 9 , wherein the depositing the first dielectric material on the substrate comprises spinning on a liquid polymer based dielectric on the substrate.

11. The method of claim 10 , wherein the depositing the second dielectric material on the substrate comprises spinning on a liquid polymer based dielectric on the first niobium layer.

12. The method of claim 9 , wherein the forming the second niobium layer further comprises depositing and patterning niobium to form the second set of the patterned niobium traces and at least one niobium via for connecting at least one of the second set of the patterned niobium traces with at least one of the first set of the patterned niobium traces.

13. The method of claim 9 , wherein each of the first set of the patterned niobium traces and the second set of the patterned niobium traces is formed using lithography.

14. The method of claim 9 , wherein each of the first dielectric material and the second dielectric material comprises a photo-imageable polyimide.

15. A method comprising:
forming a first dielectric layer on a substrate by spinning on polyimide on the substrate and curing the polyimide at a first temperature;
forming a first niobium layer comprising a first set of patterned niobium traces on the first dielectric layer;
forming a second dielectric layer on the first niobium layer by spinning on photo-imageable polyimide on the first niobium layer and curing the photo-imageable polyimide at a second temperature, wherein the second temperature is approximately equal to or lower than the first temperature by at least 25 degrees Centigrade;
forming a second niobium layer comprising a second set of patterned niobium traces on the second dielectric layer; and
forming a third dielectric layer on the second niobium layer by spinning on photo-imageable polyimide on the second niobium layer and curing the photo-imageable polyimide at a third temperature, wherein the third temperature is lower than the second temperature, and wherein each of the first temperature, the second temperature, and the third temperature is selected to not adversely affect the niobium by damaging the niobium.

16. The method of claim 15 , wherein the forming the second niobium layer further comprises depositing and patterning niobium to form the second set of the patterned niobium traces and at least one niobium via for connecting at least one of the second set of the patterned niobium traces with at least one of the first set of the patterned niobium traces.

17. The method of claim 15 , wherein each of the first set of the patterned niobium traces and the second set of the patterned niobium traces is formed using lithography.

18. The method of claim 15 , wherein the second temperature is lower than the first temperature by at least 25 degrees Centigrade and the third temperature is lower than the second temperature by at least 25 degrees Centigrade.

19. The method of claim 15 further comprising forming at least one via in the second dielectric layer, wherein the via comprises niobium.

20. The method of claim 19 , wherein the at least one via is formed in a same step as the forming the second niobium layer, and wherein the at least one via is formed by conformal deposition of the niobium.

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Rouse Richard P
• Tuckerman David B

Classifications

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W70/668

  Superconducting materials · CPC title

• H10W20/4484

  Superconducting materials · CPC title

• H10W20/097 Primary

  by thermally treating · CPC title