Bendable panel and method of fabricating same

Patent metadata

Field	Value
Publication number	US-11114426-B2
Application number	US-201916349283-A
Country	US
Kind code	B2
Filing date	Apr 2, 2019
Priority date	Dec 3, 2018
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

A bendable panel and a method of fabricating same are provided. The bendable panel improves a current display panel to provide better support and impact resistance to a bent region of a display panel. In addition, a protection performance, such as corrosion resistance, on a line in the bent region is improved.

First claim

What is claimed is:

1. A bendable panel, comprising:
a flexible display panel comprising a flexible substrate as a base, wherein the flexible substrate comprises an active display area and a binding end positioned on a side of the active display area;
a driving chip disposed on the binding end, wherein the binding end is bent toward a direction away from a light emitting side of the flexible display panel, such that the driving chip is positioned on a back surface of the flexible substrate;
a back film layer disposed on the back surface of the flexible substrate, wherein the back film layer is configured to support and protect the flexible substrate;
a foam layer disposed on the back surface of the back film layer, wherein the foam layer is configured to protect the flexible substrate; and
a support plate;
wherein the binding end comprises a first terminal portion adjacent to the active display area, a second terminal portion adjacent to the driving chip, and a bent portion connected to the first terminal portion and the second terminal portion and having a bent shape; and
wherein a bent region disposed on an inner surface of the bent portion is provided with a glue;
wherein the support plate is attached to a back surface of the second terminal portion, the support plate covers at least the back surface of the second terminal portion on which the driving chip is disposed, a configuration of the support plate, the back surface of the second terminal portion, and the driving chip fills a height difference between the foam layer and the second terminal portion.

2. The bendable panel according to claim 1 , further comprising a film circuit layer disposed on the flexible substrate and connected between the active display area and the driving chip, and the film circuit layer is attached to the bent portion and bent in a same direction as the bent portion.

3. The bendable panel according to claim 2 , further comprising a conductive line disposed on a surface of the film circuit layer and connected to the flexible display panel and the driving chip.

4. The bendable panel according to claim 2 , further comprising an ultraviolet glue layer disposed on an outer surface of the film circuit layer.

5. The bendable panel according to claim 1 , wherein the driving chip is directly attached to the flexible substrate.

6. The bendable panel according to claim 1 , wherein the driving chip is indirectly secured to the flexible substrate by a flip chip.

7. A method of fabricating a bendable panel, wherein the bendable panel comprises:
a flexible display panel comprising a flexible substrate as a base, wherein the flexible substrate comprises an active display area and a binding end positioned on a side of the active display area;
a driving chip disposed on the binding end, wherein the binding end is bent toward a direction away from a light emitting side of the flexible display panel, such that the driving chip is positioned on a back surface of the flexible substrate;
a back film layer disposed on the back surface of the flexible substrate, wherein the back film layer is configured to support and protect the flexible substrate;
a foam layer disposed on the back surface of the back film layer, wherein the foam layer is configured to protect the flexible substrate; and
a support plate;
wherein the binding end comprises a first terminal portion adjacent to the active display area, a second terminal portion adjacent to the driving chip, and a bent portion connected to the first terminal portion and the second terminal portion and having a bent shape; and
wherein a bent region disposed on an inner surface of the bent portion is provided with a glue;
wherein the support plate is attached to a back surface of the second terminal portion, the support plate covers at least the back surface of the second terminal portion on which the driving chip is disposed, a configuration of the support plate, the back surface of the second terminal portion, and the driving chip fills a height difference between the foam layer and the second terminal portion;
wherein the method comprises:
(a) binding the driving chip to the binding end of the flexible substrate;
(b) providing the glue on the surface of the binding end facing away from the light emitting side of the flexible substrate;
(c) after the glue is applied to the binding end, bending the binding end facing away from the light emitting side of the flexible display panel, such that the driving chip is disposed on the back surface of the flexible substrate; and
curing the glue.

8. The method according to claim 7 , wherein in step (b), the glue is provided by spraying or coating.

9. The method according to claim 7 , wherein in step (d), the glue is cured by high temperature or standing.

Assignees

• Wuhan China Star Optoelectronics Semiconductor Display Tech Co Ltd

Inventors

• Wang Mingliang

Classifications

• H10W90/00

  Package configurations · CPC title

• H10K59/873

  Encapsulations · CPC title

• H05K1/147 Primary

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• H05K2201/10128

  Display · CPC title