Multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-11114246-B2
Application number	US-201916281391-A
Country	US
Kind code	B2
Filing date	Feb 21, 2019
Priority date	Mar 27, 2018
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

A multilayer ceramic electronic component includes an element body. The element body includes a capacitance region and an exterior region. The capacitance region is formed by alternately laminating inner dielectric layers and internal electrode layers having different polarities. The exterior region is laminated outside the capacitance region in a laminating direction and formed by outer dielectric layers. The internal electrode layers contain a main component of copper and/or silver. An exterior void ratio is larger than a capacitance void ratio, in which the exterior void ratio is an area ratio of voids contained in the exterior region, and the capacitance void ratio is an area ratio of voids contained in the capacitance region.

First claim

What is claimed is:

1. A multilayer ceramic electronic component comprising an element body including:
a capacitance region formed by alternately laminating inner dielectric layers and internal electrode layers, the inner dielectric layers being sandwiched between the internal electrode layers having different polarities; and
an exterior region laminated outside the capacitance region in a laminating direction and formed by outer dielectric layers without any of the internal electrode layers, wherein
the internal electrode layers contain a main component of copper and/or silver, and
an exterior void ratio (RSe) is larger than a capacitance void ratio (RSc), in which the exterior void ratio (RSe) is an area ratio of voids contained in the exterior region, and the capacitance void ratio (RSc) is an area ratio of voids contained in the capacitance region, wherein
the element body further includes a leading region formed by an insulator located between the internal electrode layers having the same polarity and led from the capacitance region, and
a leading void ratio (RSl) is larger than the capacitance void ratio (RSc), in which the leading void ratio (RSl) is an area ratio of voids contained in the leading region.

2. The mulitplayer ceramic electronic component according to claim 1 , wherein RSl/RSc 1.1 to 2.

3. A multilayer ceramic electronic component comprising an element body including:
a capacitance region formed by alternately laminating inner dielectric layers and internal electrode layers, the inner dielectric layers being sandwiched between the internal electrode layers having different polarities; and
an exterior region laminated outside the capacitance region in a laminating direction and formed by outer dielectric layers without any of the internal electrode layers, wherein
the internal electrode layers contain a main component of copper and/or silver, and
an exterior void ratio (RSe) is larger than a capacitance void ratio (RSc), in which the exterior void ratio (RSe) is an area ratio of voids contained in the exterior region, and the capacitance void ratio (RSc) is an area ratio of voids contained in the capacitance region, wherein RSe/RSc is 1.1 to 2.

4. The multilayer ceramic electronic component according to claim 3 , wherein
the element body further includes a side region formed by an insulator located on a side part of the capacitance region and covering side surfaces of the internal electrode layers, and
a side void ratio (RSs) is larger than the capacitance void ratio (RSc), in which the side void ratio (RSs) is an area ratio of voids contained in the side region.

5. The multilayer ceramic electronic component according to claim 3 , wherein the inner dielectric layers include a main component containing barium titanate and a sub-component containing boron oxide and/or lithium oxide.

6. The multilayer ceramic electronic component according to claim 3 , wherein the internal electrode layers also contain voids.

7. A multilayer ceramic electronic component comprising an element body including:
a capacitance region formed by alternately laminating inner dielectric layers and internal electrode layers, the inner dielectric layers being sandwiched between the internal electrode layers having different polarities; and
an exterior region laminated outside the capacitance region in a laminating direction and formed by outer dielectric layers without any of the internal electrode layers, wherein
the internal electrode layers contain a main component of copper and/or silver,
an exterior void ratio (RSe) is larger than a capacitance void ratio (RSc), in which the exterior void ratio (RSe) is an area ratio of voids contained in the exterior region, and the capacitance void ratio (RSc) is an area ratio of voids contained in the capacitance region,
wherein the element body further includes a side region formed by an insulator located on a side part of the capacitance region and covering side surfaces of the internal electrode layers, and
a side void ratio (RSs) is larger than the capacitance void ratio (RSc), in which the side void ratio (RSs) is an area ratio of voids contained in the side region, and
RSs/RSc is 1.1 to 2.

Assignees

• Tdk Corp

Inventors

• Iguchi Toshihiro

Classifications

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/224

  Housing; Encapsulation · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title

• H01G4/255 Primary

  Means for correcting the capacitance value · CPC title

• H01G4/1245

  containing also titanates · CPC title