Thermal flowmeter

Patent metadata

Field	Value
Publication number	US-11112286-B2
Application number	US-201716464867-A
Country	US
Kind code	B2
Filing date	Sep 27, 2017
Priority date	Jan 26, 2017
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

A thermal flowmeter includes a plurality of measuring units for stabilizing air flowing in a sub-passage, and improves noise performance or a pulsation characteristic of a flow rate sensor. The thermal flowmeter includes a flange fixed to an attachment part of a main passage, a sub-passage takes in a part of measured gas flowing in the main passage, a flow rate measuring unit measures a flow rate of the measured gas in the sub-passage, a circuit component controls the flow rate measuring unit, and the flow rate measuring unit and an electronic component are mounted on a circuit substrate. The sub-passage is formed in a substrate of the circuit substrate, the sub-passage on a surface side of the circuit substrate and a second space on a rear surface side are separated by the circuit substrate, and a pressure measuring unit and the circuit component are arranged in the second space.

First claim

The invention claimed is:

1. A thermal flowmeter used by being inserted from an attachment hole provided in a passage wall of a main passage into an inside of the main passage, comprising:
a flange to be fixed to an attachment part of the main passage;
a sub-passage that takes in a part of measured gas flowing in the main passage;
a flow rate measuring unit that measures a flow rate of the measured gas in the sub-passage;
a circuit component that controls the flow rate measuring unit; and
a circuit substrate on which the flow rate measuring unit and the circuit component are mounted,
wherein the sub-passage is formed in the circuit substrate.

2. The thermal flowmeter according to claim 1 , wherein a second sub-passage on a surface side of the circuit substrate on which side the flow rate measuring unit is provided and a second space, which is different from the sub-passage, on a rear surface side of the circuit substrate are separated by the circuit substrate, and at least one physical sensor other than the flow rate measuring unit, and the circuit component are arranged in the second space.

3. The thermal flowmeter according to claim 1 , wherein the flange, the flow rate measuring unit, and the circuit component are installed in this order in an insertion direction of the thermal flowmeter.

4. The thermal flowmeter according to claim 1 , wherein the circuit substrate has a partially-molded resin component, and a first surface of the sub-passage is on a side on which the flow rate measuring unit is provided and the resin component forms an inner wall comprising a second surface of the sub-passage.

5. The thermal flowmeter according to claim 4 , wherein the resin component forms a cover that is included in a part of the inner wall of the sub-passage by being adhered or welded.

6. The thermal flowmeter according to claim 1 , further comprising a resin body having a recessed part, wherein the resin body forms a part of an inner wall of the sub-passage by being adhered or crimped to a surface on a side on which the flow rate measuring unit is provided of the circuit substrate.

7. The thermal flowmeter according to claim 1 , wherein the sub-passage includes a main sub-passage connecting an inlet and an outlet, and a bypass passage that bypasses the main sub-passage, and the flow rate measuring unit is included in the bypass passage.

8. The thermal flowmeter according to claim 7 , wherein the circuit substrate configures an entirety of one side wall surface among four side wall surfaces of the bypass passage.

9. The thermal flowmeter according to claim 7 , wherein a third space is included between the main sub-passage and the bypass passage, and at least one physical sensor other than the flow rate measuring unit is installed in the third space.

10. The thermal flowmeter according to claim 1 , wherein the flow rate measuring unit is electrically connected to the circuit component through a bonding wire, one end side thereof being connected to the flow rate measuring unit, and a seal material is provided that covers the bonding wire, the seal material being provided on a circuit component side of the flow rate measuring unit.

11. The thermal flowmeter according to claim 1 , wherein the circuit component is at least one of a large scale integration (LSI) circuit and a microcomputer.

12. The thermal flowmeter according to claim 1 , wherein the flow rate measuring unit and the circuit component are an integrated one-chip component.

13. The thermal flowmeter according to claim 1 , wherein the circuit substrate is a printed substrate.

14. The thermal flowmeter according to claim 7 , wherein a resist film or a surface treated film having a hydrophilic property or a water-repellent property is included on a surface of the circuit substrate included in a part of the bypass passage.

15. The thermal flowmeter according to claim 1 , further comprising a temperature measuring unit that measures a temperature of the measured gas flowing in the main passage,
wherein the temperature measuring unit is provided in such a manner as to be protruded to a leading end side of a chassis extended toward a center of the main passage from the flange.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Uenodan Akira
• Fukaya Masashi
• Saito Tomoaki
• Tashiro Shinobu
• Watanabe Tsubasa

Classifications

• G01F1/684 Primary

  Structural arrangements; Mounting of elements, e.g. in relation to fluid flow · CPC title

• G01K13/02

  for measuring temperature of moving fluids or granular materials capable of flow · CPC title

• G01F5/00

  Measuring a proportion of the volume flow · CPC title

• F02D2200/0414

  Air temperature · CPC title

• G01K13/024

  of moving gases · CPC title