Optical module and optical encoder comprising a dummy light receiving device formed between a light receiving device and a through hole in a sensor substrate

US11112279B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11112279-B2
Application numberUS-202016807585-A
CountryUS
Kind codeB2
Filing dateMar 3, 2020
Priority dateMar 7, 2019
Publication dateSep 7, 2021
Grant dateSep 7, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An optical module includes a fixed substrate, and a sensor substrate secured to the fixed substrate and having a through-hole formed therein. A light emitting device is secured to the fixed substrate at a position in the through-hole. A light receiving device is provided in the sensor substrate. A dummy light receiving device is formed between the light receiving device and the through-hole, around the through-hole, and in the sensor substrate. The light receiving device and the dummy light receiving device are made of an impurity diffusion layer having a same conductive type as a conductive type of a surface layer of the sensor substrate. The dummy light receiving device is deeper than the light receiving device.

First claim

Opening claim text (preview).

What is claimed is: 1. An optical module, comprising: a fixed substrate; a sensor substrate secured to the fixed substrate and having a through-hole formed therein; a light emitting device secured to the fixed substrate at a position in the through-hole; a light receiving device provided in the sensor substrate; and a dummy light receiving device formed between the light receiving device and the through-hole, around the through-hole, and in the sensor substrate, wherein the light receiving device and the dummy light receiving device are made of an impurity diffusion layer having a same conductive type as a conductive type of a surface layer of the sensor substrate, and wherein the dummy light receiving device is formed deeper than the light receiving device. 2. The optical module as claimed in claim 1 , wherein the sensor substrate is a semiconductor substrate, and wherein the light receiving device and the dummy light receiving device are reverse biased pn junction type photodiodes. 3. The optical module as claimed in claim 2 , wherein the light emitting device is a light emitting diode. 4. The optical module as claimed in claim 3 , wherein the sensor substrate on the fixed substrate side is a cathode, and the light emitting device on the fixed substrate side is a cathode. 5. The optical module as claimed in claim 1 , wherein the impurity diffusion layer forming the dummy light receiving device has an impurity concentration higher than that of an impurity diffusion layer forming the light receiving device. 6. An optical module, comprising: a fixed substrate; a sensor substrate secured to the fixed substrate and having a through-hole formed therein; a light emitting device secured to the fixed substrate at a position in the through-hole; a light receiving device provided in the sensor substrate; and a dummy light receiving device formed between the light receiving device and the through-hole, around the through-hole, and in the sensor substrate, wherein the light receiving device and the dummy light receiving device are made of an impurity diffusion layer having a same conductive type as a conductive type of a surface layer of the sensor substrate, and wherein the sensor substrate is secured to the fixed substrate via a conductive adhesive layer containing a light absorbing member. 7. An optical encoder, comprising: the optical module as claimed in claim 1 ; and a reflective scale. 8. An optical encoder, comprising: the optical module as claimed in claim 6 ; and a reflective scale.

Assignees

Inventors

Classifications

  • Package configurations · CPC title

  • the beams of light being detected by photocells · CPC title

  • Scale reading or illumination devices · CPC title

  • Linear encoders · CPC title

  • G01D5/347Primary

    using displacement encoding scales · CPC title

Patent family

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Frequently asked questions

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What does patent US11112279B2 cover?
An optical module includes a fixed substrate, and a sensor substrate secured to the fixed substrate and having a through-hole formed therein. A light emitting device is secured to the fixed substrate at a position in the through-hole. A light receiving device is provided in the sensor substrate. A dummy light receiving device is formed between the light receiving device and the through-hole, ar…
Who is the assignee on this patent?
Ohara Tomomitsu, Tsutsumi Kazuki, Kimura Shinji, and 3 more
What technology area does this patent fall under?
Primary CPC classification G01D5/34715. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 07 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).