Crystal growth method in a semiconductor device

Patent metadata

Field	Value
Publication number	US-11111598-B2
Application number	US-201916456265-A
Country	US
Kind code	B2
Filing date	Jun 28, 2019
Priority date	Jun 28, 2019
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

According to one embodiment, a crystal growth method includes forming a first member at at least a part of a bottom portion of a hole in a structure body. The hole includes the bottom portion and a side portion. The first member includes a first element. The first element is not adhered to at least a part of the side portion in the forming the first member. The crystal growth method includes growing a crystal member inside the hole by supplying a source material to the hole after the forming the first member. The source material includes a second element. The crystal member includes the second element.

First claim

What is claimed is:

1. A crystal growth method, comprising:
removing at least a portion of a first film, the first film being provided at a bottom portion and at a side portion of a hole in a structure body before the removing;
forming a first member at at least a part of the bottom portion of the hole in the structure body, the first member including a first element; and
growing a crystal member inside the hole by supplying a source material to the hole after the forming the first member, the source material including a second element, the crystal member including the second element.

2. The method according to claim 1 , wherein
the first member contacts the bottom portion before the growing the crystal member, and
the crystal member contacts the bottom portion after the growing the crystal member.

3. The method according to claim 1 , wherein the crystal member contacts at least a portion of the side portion.

4. The method according to claim 1 , wherein
the first member is in a solid phase in the forming the first member, and
the first member is in a liquid phase in the growing the crystal member.

5. The method according to claim 1 , wherein
the structure body includes a third element, and
the first film includes a compound including the third element.

6. The method according to claim 1 , wherein
the hole further has an opening, and
a length of the first member along a first direction is not less than 20% of a length of the opening along a second direction crossing the first direction, the first direction being from the bottom portion toward the opening.

7. The method according to claim 1 , wherein
the hole further has an opening, and
a length of the first member along a first direction is longer than a length of the first member along a second direction crossing the first direction, the first direction being from the bottom portion toward the opening.

8. The method according to claim 1 , wherein
the hole further has an opening, and
a length of the opening along a second direction crossing a first direction is shorter than a maximum value of a length along the second direction of the hole, the first direction being from the bottom portion toward the opening.

9. The method according to claim 1 , wherein
the hole further has an opening, and
a length of the first member along a first direction is not less than 40% of a depth of the hole along the first direction, the first direction being from the bottom portion toward the opening.

10. The method according to claim 1 , wherein
the hole further has an opening,
a direction from the bottom portion toward the opening is aligned with a first direction,
a depth along the first direction of the hole is a sum of a bottom portion length along the first direction of the bottom portion and a side portion length along the first direction of the side portion, and
the bottom portion length is 50% of the depth.

11. The method according to claim 1 , wherein
the structure body includes:
a first region including the bottom portion; and
a second region including the side portion,

a crystal orientation of the crystal member is aligned with a crystal orientation of the first region, and
the crystal orientation of the crystal member is aligned with a crystal orientation of the second region.

12. The method according to claim 1 , further comprising forming an insulating film at the side portion after the forming the first member and before the growing the crystal member.

13. The method according to claim 1 , wherein the first element includes at least one selected from the group consisting of Au, Al, Ag, Bi, Cd, Co, Cu, Dy, Fe, Ga, Gd, In, Mg, Mn, Ni, Os, Pb, Pd, Pt, Te, Ti, and Zn.

14. The method according to claim 1 , wherein the second element includes at least one selected from the group consisting of Si, Ge, Ga, and In.

15. The method according to claim 1 , wherein the crystal member includes at least one selected from the group consisting of Si, Ge, SiGe, GaAs, GaN, and InP.

16. The method according to claim 1 , wherein the source material includes a fourth element including at least one selected from the group consisting of P, B, As, and Mg.

17. The method according to claim 1 , wherein
the supplying the source material includes supplying a first gas, and
the first gas includes at least one selected from the group consisting of hydrogen, nitrogen, argon, and helium.

18. The method according to claim 1 , wherein the forming the first member includes performing at least one of vapor deposition of the first element or long throw sputtering of the first element.

19. The method according to claim 1 , wherein the first element does not adhere to at least a part of the side portion in the forming the first member.

Assignees

• Toshiba Kk
• Univ Johns Hopkins

Inventors

• Gangi Hiro
• Hwang Jongil
• Kempa Thomas
• Thompson Eric

Classifications

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title

• H10W72/951

  Materials of bond pads · CPC title

• H10W72/942

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title